Heat spreading thermal interface structure

• US 20050045372A1
• Filed: 07/07/2004
• Published: 03/03/2005
• Est. Priority Date: 02/25/2000
• Status: Active Grant

• Current Assignee: Laird Technologies Incorporated (DuPont de Nemours, Inc.)
• Original Assignee: Thermagon, Inc. (Laird Limited)
• Inventors: Hill, Richard, Strader, Jason, Latham, James
• Granted Patent: US 7,078,109 B2
• Time in Patent Office: Days
• US Class Current: 174/252
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/12396 Discontinuous surface component
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]
• CPC Class Codes: Y10T 428/12528 Semiconductor component
• CPC Class Codes: Y10T 428/12556 Organic component

Abstract

The thermal interface structure of the present invention is suited for use in a non-referenced die system between a heat source and heat sink spaced up to 300 mils apart and comprises a plurality of layers including a core body of high conductivity metal or metal alloy having opposite sides, a soft thermal interface layer disposed on one side of the core body for mounting against the heat sink and a thin layer of a phase change material disposed on the opposite side of the core body for mounting against the heat source wherein the surface area dimension (footprint) of the core body is substantially larger than the surface area of the heat source upon which the phase change material is mounted to minimize the thermal resistance between the heat source and the heat sink and wherein said soft thermal interface layer is of a thickness sufficient to accommodate a variable spacing between the heat source and the heat sink of up to 300 mils.

Claims

1. A thermal interface structure for placement between a heat source and heat sink spaced up to 300 mils apart comprising a plurality of layers including a core body of high conductivity metal or metal alloy having opposite sides, a soft thermal interface layer disposed on one side of the core body for mounting against the heat sink and a thin layer of a phase change material disposed on the opposite side of the core body for mounting against the heat source wherein the surface area dimension (footprint) of the core body is substantially larger than the surface area of the heat source upon which the phase change material is mounted to minimize the thermal resistance between the heat source and the heat sink and wherein said soft thermal interface layer is of a thickness sufficient to accommodate a variable spacing between the heat source and the heat sink of up to 300 mils.

2. A thermal interface structure as defined in claim 1 wherein said soft thermal interface layer is of a composition which is compressible or deflectable such that when squeezed it will allow for thickness tolerance differences between the heat source and heat sink.

3. A thermal interface structure as defined in claim 2 wherein said soft thermal interface layer has a thickness substantially greater than the thickness of said layer of phase change material.

4. A thermal interface structure as defined in claim 3 wherein said soft thermal interface layer is composed a polymer filled with a thermally conductive filler.

5. A thermal interface structure as defined in claim 4 wherein said layer of phase change material has a thickness of no greater than 25 mils.

6. A thermal interface structure as defined in claim 5 wherein said layer of phase change material has a thickness of less than 2 mils.

7. A thermal interface structure as defined in claim 5 wherein said layer of phase change material is selected from the group consisting of a low melting metal, metal alloy composition, polymer or filled polymer composition having a melting temperature between 40°

C. and 160°

C.

8. A thermal interface structure as defined in claim 7 wherein said layer of phase change material is a metal or metal alloy selected from the group of elements consisting of indium, bismuth, tin, lead, cadmium, gallium, zinc, silver and combinations thereof.

9. A thermal interface structure as defined in claim 7 wherein said layer of phase change material is a polymer composition composed of a wax or a resin filled with a thermally conductive filler selected from the group consisting of boron nitride, aluminum oxide, aluminum and zinc oxide.