Stacked microfeature devices and associated methods
First Claim
1. A microfeature device package, comprising:
- a first microfeature device having a first bond pad surface with a plurality of first bond pads positioned at least proximate to the first bond pad surface;
a second microfeature device having a second bond pad surface with a plurality of second bond pads positioned at least proximate to the second bond pad surface, the second bond pad surface facing toward the first bond pad surface;
a package connection site positioned to provide electrical communication between the first microfeature device and devices external to the device package;
a wirebond coupled between at least one of the first bond pads and the package connection site; and
an electrically conductive link coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device.
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Accused Products
Abstract
Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.
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Citations
38 Claims
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1. A microfeature device package, comprising:
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a first microfeature device having a first bond pad surface with a plurality of first bond pads positioned at least proximate to the first bond pad surface;
a second microfeature device having a second bond pad surface with a plurality of second bond pads positioned at least proximate to the second bond pad surface, the second bond pad surface facing toward the first bond pad surface;
a package connection site positioned to provide electrical communication between the first microfeature device and devices external to the device package;
a wirebond coupled between at least one of the first bond pads and the package connection site; and
an electrically conductive link coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A microfeature device package, comprising:
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a first microfeature device having a first bond pad surface with a plurality of first bond pads positioned at least proximate to the first bond pad surface;
a second microfeature device having a second bond pad surface with a plurality of second bond pads positioned at least proximate to the second bond pad surface, the second bond pad surface facing toward the first bond pad surface;
a package connection site positioned to provide electrical communication between the first microfeature device and components external to the device package;
a wirebond coupled between at least one of the first bond pads and the package connection site; and
an electrically conductive link coupled between the at least one first bond pad of the first microfeature device and at least one second bond pad of the second microfeature device. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A microfeature device package, comprising:
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a first microfeature device having a first bond pad surface with a plurality of first bond pads and a plurality of intermediate bond pads positioned at least proximate to the first bond pad surface;
a second microfeature device having a second bond pad surface with a plurality of second bond pads positioned at least proximate to the second bond pad surface, the second bond pad surface facing toward the first bond pad surface;
a first package connection site positioned to provide electrical communication between the first microfeature device and components external to the device package;
a first wirebond coupled between at least one of the first bond pads and the first package connection site;
a second package connection site positioned to provide electrical communication between the second microfeature device and devices external to the device package;
a second wirebond coupled between at least one of the intermediate bond pads and the second package connection site; and
an electrically conductive link coupled between the at least one intermediate bond pad and at least one of the second bond pads of the second microfeature device. - View Dependent Claims (16, 17, 18, 19)
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20. A method for forming a microfeature device package, comprising:
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positioning a first microfeature device at least proximate to a second microfeature device, the first microfeature device having a first bond pad surface with a plurality of first bond pads at least proximate to the first bond pad surface, the second microfeature device having a second bond pad surface with a plurality of second bond pads at least proximate to the second bond pad surface, the first bond pad surface facing toward the second bond pad surface;
coupling a wirebond between at least one of the first bond pads and a package connection site, the package connection site being positioned to provide electrical communication between the first microfeature device and components external to the device package; and
coupling an electrically conductive link between the first microfeature device and at least one of the second bond pads of the second microfeature device. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27)
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28. A method for forming a microfeature device package, comprising:
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positioning a first microfeature device at least proximate to a second microfeature device, the first microfeature device having a first bond pad surface with a plurality of first bond pads at least proximate to the first bond pad surface, the second microfeature device having a second bond pad surface with a plurality of second bond pads at least proximate to the second bond pad surface, the first bond pad surface facing toward the second bond pad surface;
coupling a wirebond between at least one of the first bond pads and a package connection site, the package connection site being positioned to provide electrical communication between the first microfeature device and devices external to the device package; and
coupling an electrically conductive link between the at least one first bond pad of the first microfeature device and at least one second bond pad of the second microfeature device. - View Dependent Claims (29, 30, 31, 32, 33)
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34. A method for forming a microfeature device package, comprising:
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positioning a first microfeature device at least proximate to a second microfeature device, the first microfeature device having a first bond pad surface with a plurality of first bond pads at least proximate to the first bond pad surface, the second microfeature device having a second bond pad surface with a plurality of second bond pads at least proximate to the second bond pad surface, the first bond pad surface facing toward the second bond pad surface;
coupling a first wirebond between at least one of the first bond pads and a first package connection site, the first package connection site being positioned to provide electrical communication between the first microfeature device and devices external to the device package;
coupling a second wirebond between at least one of the intermediate bond pads and a second package connection site, the second package connection site being positioned to provide electrical communication between the second microfeature device and devices external to the device package; and
coupling an electrically conductive link between the at least one intermediate bond pad and at least one of the second bond pads of the second microfeature device. - View Dependent Claims (35, 36, 37, 38)
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Specification