System and method for enhanced LED thermal conductivity
First Claim
1. A light emitting device assembly comprising:
- at least one encapsulation layer encasing (a) a light emitting diode (LED) chip, (b) a substrate having two terminals, a first one of said two terminals having an electrical lead and a portion with a width at least as wide as said LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of said encased assembly wherein said LED chip is located on an edge of said first terminal opposite said electrical lead, and (c) an adhesive that connects said LED chip to said first terminal of said substrate.
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Accused Products
Abstract
A light emitting device assembly comprises a light emitting diode (LED) chip, a substrate with two terminals, at least one encapsulation layer, and a thermally conductive adhesive to connect the LED chip and the substrate. The first terminal of the substrate is comprised of a portion with a width at least as wide as the LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of the encapsulated assembly, and a straight element. The enlarged first terminal portion provides more area for heat dissipation and conduction, and along with the thermally conductive adhesive and the encapsulation package, provide enhanced thermal conductivity.
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Citations
20 Claims
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1. A light emitting device assembly comprising:
at least one encapsulation layer encasing (a) a light emitting diode (LED) chip, (b) a substrate having two terminals, a first one of said two terminals having an electrical lead and a portion with a width at least as wide as said LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of said encased assembly wherein said LED chip is located on an edge of said first terminal opposite said electrical lead, and (c) an adhesive that connects said LED chip to said first terminal of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A system comprising:
at least one encapsulation layer encasing an assembly, wherein said assembly includes (a) at least one light emitting diode (LED) chip;
(b) a first terminal, said first terminal entering said encapsulation layer through an edge and wherein said first terminal has an electrical lead and a portion with a width at least as wide as said LED chip wherein said portion of said first terminal extends so as to be at least flush with said edge of said at least one encapsulation layer and wherein said portion is disposed between said LED chip and said electrical lead;
(c) at least one second terminal, wherein the number of said at least one second terminal corresponds to the number of said at least one LED chip; and
(d) at least one adhesive connecting said at least one LED chip to said first terminal. - View Dependent Claims (17, 18)
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19. A method for enhancing light emitting diode (LED) heat dissipation properties of a light emitting device assembly, said method comprising:
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positioning a LED chip within a cavity of a first terminal, said first terminal having an electrical lead and a portion with a width that is at least as wide as said LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of said assembly;
attaching said LED chip to said first terminal with adhesive;
connecting said LED chip to a second terminal;
inserting a portion of said terminals connected to said LED chip into a shell;
pouring a second layer encapsulant into said shell; and
pouring a first layer encapsulant into said shell, wherein said first and second layer encapsulants solidify, taking the shape of said shell, wherein said portion of said first terminal is located between said LED chip and an edge through which said electrical lead of said first terminal enters said first layer encapsulant. - View Dependent Claims (20)
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Specification