Semiconductor device with borderless contact structure and method of manufacturing the same
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Abstract
A semiconductor device comprising a borderless contract structure and a method of manufacturing the same. An etch-protecting layer is formed on a semiconductor substrate having gate electrodes formed on an active area of the substrate. Spacers are formed on the etch-protecting layer, and removed after performing a source/drain ion-implantation process to secure a region for forming a contact hole between the gate electrodes. After sequentially forming an etch-stopping layer and an insulating interlayer on a resultant structure, the etch-stopping layer and the insulating interlayer are etched to form the first contact hole which exposes a surface of the semiconductor substrate between gate electrodes and a second contact hole for the borderless contact which exposes the surface of the semiconductor substrate adjacent to the field oxide layer and a portion of a surface of the field oxide layer.
17 Citations
27 Claims
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1-10. -10. (Cancelled)
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11. A method for forming a contact hole of a semiconductor device, the method comprising the steps of:
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forming a plurality of gate electrodes on an active area of a semiconductor substrate, the semiconductor substrate comprising the active area and a field area divided by a field oxide layer;
forming an etch-protecting layer on the gate electrodes and the semiconductor substrate;
forming spacers on the etch-protecting layer formed on both sides of each gate electrode, the spacers comprising a material having an etch selectively with respect to the etch-protecting layer;
performing a source and drain ion-implantation process by using the gate electrodes on which the spares are formed as a mask;
removing the spacers;
forming an etch-stopping layer on the entire surface of the resultant structure;
forming an insulating interlayer on the etch-stopping layer; and
sequentially etching the insulating interlayer, the etch-stopping layer and the etch-protecting layer such that a first contact hole is formed to expose a surface of the semiconductor substrate between the gate electrodes and a second contact hole is formed to expose a surface of the semiconductor substrate adjacent to the field oxide layer and a portion of a surface of the field oxide layer, thereby forming a borderless contact between the field area and the active area. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method for forming a contact hole of a semiconductor device, the method comprising the steps of:
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forming a plurality of gate electrodes on an active area of a semiconductor substrate, the semiconductor substrate comprising the active area and a field area divided by a field oxide layer;
forming an etch-protecting layer on the gate electrodes and the semiconductor substrate;
forming spacers on the etch-protecting layer formed on both sides of each gate electrode, the spacers comprising a material having an etch selectivity with respect to the etch-protecting layer;
performing a source and drain ion-implantation process by using the gate electrodes on which the spares are formed as a mask;
removing the spacers;
forming an etch-stopping layer on the entire surface of the resultant structure, wherein the etch-stopping layer comprising a material similar to a material of the etch-protecting layer;
forming an insulating interlayer on the etch-stopping layer; and
sequentially etching the insulating interlayer, the etch-stopping layer and the etch-protecting layer, such that a first contact hole is formed to expose a surface of the semiconductor substrate between the gate electrodes and a second contact hole is formed to expose a surface of the semiconductor substrate adjacent to the field oxide layer and a portion of a surface of the field oxide layer, thereby forming a borderless contact between the field area and the active area. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification