Electronic devices with small functional elements supported on a carrier
First Claim
1. A method of fabricating an electronic assembly, said method comprising:
- providing a substrate with a plurality of blocks each of which includes at least one functional component;
applying an electrical interconnect layer onto a flexible layer;
attaching said flexible layer to said substrate;
electrically coupling said electrical interconnect layer to at least one of said blocks; and
coupling a flexible antenna to at least one of said plurality of blocks, said flexible antenna being formed on a second substrate said second substrate facing said flexible layer.
5 Assignments
0 Petitions
Accused Products
Abstract
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.
-
Citations
29 Claims
-
1. A method of fabricating an electronic assembly, said method comprising:
-
providing a substrate with a plurality of blocks each of which includes at least one functional component;
applying an electrical interconnect layer onto a flexible layer;
attaching said flexible layer to said substrate;
electrically coupling said electrical interconnect layer to at least one of said blocks; and
coupling a flexible antenna to at least one of said plurality of blocks, said flexible antenna being formed on a second substrate said second substrate facing said flexible layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. (Canceled)
-
17. (Canceled)
-
18. (Canceled)
-
19. (Canceled)
-
20. (Canceled)
-
21. (Canceled)
-
22. (Canceled)
-
23. A method of fabricating an electronic assembly, said method comprising:
-
providing a flexible layer with a plurality of blocks each of which includes at least one functional component;
applying an electrical interconnect layer onto the flexible layer;
attaching said flexible layer to a substrate;
electrically coupling said electrical interconnect layer to at least one of said blocks; and
coupling a flexible antenna to at least one of said plurality of blocks, said flexible antenna being formed on a second substrate, said second substrate facing said flexible layer. - View Dependent Claims (24, 25)
-
-
26. A method of fabricating an electronic assembly, said method comprising:
-
applying an electrical interconnect layer onto a flexible layer;
dispensing onto the flexible layer a plurality of blocks each of which includes at least one functional component;
attaching said flexible layer to a substrate;
electrically coupling said electrical interconnect layer to at least one of said blocks. - View Dependent Claims (27, 28, 29)
-
Specification