Optical transmitting module having a CAN type package and providing a temperature sensor therein

• US 20050047461A1
• Filed: 07/29/2004
• Published: 03/03/2005
• Est. Priority Date: 07/09/2003
• Status: Active Grant

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Kato, Kiyoshi, Kihara, Toshiaki, Moto, Akihiro, Tsumura, Eiji, Go, Hisao
• Granted Patent: US 7,218,657 B2
• Time in Patent Office: Days
• US Class Current: 372/43.10
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01S 5/02212 Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/06804 by monitoring an external parameter, e.g. temperature
• CPC Class Codes: H01S 5/06832 Stabilising during amplitude modulation

Abstract

The present invention provides an optical transmitting module capable of outputting a signal for precisely controlling bias and modulation current, and a transmitting optical sub-assembly using the same. The optical transmitting module of the invention builds a semiconductor laser diode 5 and a temperature sensor within a CAN type package. The CAN type package includes a base, a block provided on the base and mounting the laser diode on a side thereof, and a plurality of leads secured to the base. The laser diode is supplied current signal S_DRV through one of leads, while the temperature sensor outputs a signal S_TEMP through the other of leads. The temperature sensor is mounted immediately close to the laser diode, accordingly, capable of monitoring the temperature of the laser diode.

Claims

1. An optical transmitting module, comprising:

a semiconductor laser diode;

a temperature sensor; and

a CAN type package for enclosing said laser diode and said temperature sensor, said CAN type package including a base, and a block provided on said base and having a side surface for mounting said laser diode thereon.

2. The optical transmitting module according to claim 1, wherein said temperature sensor is mounted on said block.

3. The optical transmitting module according to claim 2, wherein said temperature sensor is mounted on said side surface of said block.

4. The optical transmitting module according to claim 2, wherein said temperature sensor is mounted on another side surface of said block different to said side surface on which said laser diode is mounted.

5. The optical transmitting module according to claim 2, wherein said temperature sensor is mounted on a top surface of said block.

6. The optical transmitting module according to claim 1, wherein said temperature sensor is mounted on said base.

7. The optical transmitting module according to claim 1, wherein said base secures a first lead, said temperature sensor being mounted on a top of said first lead.

8. The optical transmitting module according to claim 7, wherein said first lead includes a flat side surface on a top end portion thereof, said temperature sensor being mounted on said flat side surface of said first lead.

9. The optical transmitting module according to claim 1, wherein said base further includes a second lead having a flat side surface on a top end portion thereof, and said module further comprises an inductor mounted on said flat side surface of said second lead.

10. The optical transmitting module according to claim 1, further comprises a driver for driving said laser diode, said driver being mounted on said side surface of said block on which said laser diode is mounted.

11. The optical transmitting module according to claim 10, further comprises a second lead secured to said base and having a flat side surface on a top end portion thereof, a third lead connected to said driver, and an inductor mounted on said flat side surface of said second lead,

wherein said driver receives a driving signal through said third lead and a bias signal from said inductor, supplies a superimposed signal of said driving signal on said bias signal to said laser diode.

12. The optical transmitting module according to claim 10, wherein said driver is an integrated circuit including a driving circuit for driving said laser diode and a temperature sensor for sensing a temperature of said integrated circuit.

13. A transmitting optical sub-assembly, comprising:

an optical transmitting module, including;

a semiconductor laser diode for emitting light by supplying a driving signal,

a temperature sensor for sensing a temperature of said laser diode, and

a CAN type package including a base, a block provided on said base and having a side surface for mounting said laser diode thereof, and a cap for forming a cavity co-operating with said base, said laser diode and said temperature sensor being enclosed within said cavity;

a welding member cylindrically surrounding said cap provided in said CAN type package;

an alignment member having a bore and an end surface, said welding member being inserted into said bore of said alignment member and being fixed to said alignment member; and

a sleeve assembly, including;

a stub having a coupling fiber disposed in a center thereof, said light emitted from said laser diode being converged to said coupling fiber,

a sleeve for securing said stub to an end portion thereof,

a sleeve cover for covering said sleeve, said sleeve cover having an end surface, and

a bush press-fitted between said sleeve cover and said end portion of said sleeve such that said stub is tightly positioned within said sleeve,

wherein said sleeve assembly is optically aligned to said CAN type package by sliding said end surface of said sleeve cover on said end surface of said alignment member, and by sliding said welding member within said bore of said alignment member.

14. The transmitting optical sub-assembly according to claim 13, wherein said temperature sensor is mounted on said side surface of said block on which said laser diode is mounted.

15. The transmitting optical sub-assembly according to claim 13, further includes a lead secured to said base and having a flat side surface on a top end portion thereof, and an inductor mounted on said flat side surface of said lead.

16. The transmitting optical sub-assembly according to claim 13, further includes a driver for driving said laser diode, said driver being mounted on said side surface of said block on which said laser diode is mounted.