Image sensor having micro-lens array separated with trench structures and method of making

• US 20050048690A1
• Filed: 09/13/2004
• Published: 03/03/2005
• Est. Priority Date: 06/24/2003
• Status: Active Grant

• Current Assignee: Katsumi Yamamoto
• Original Assignee: Katsumi Yamamoto
• Inventors: Yamamoto, Katsumi
• Granted Patent: US 6,933,167 B2
• Time in Patent Office: Days
• US Class Current: 438/69
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216

Abstract

An image sensor having micro-lenses is disclosed. The image sensor comprises a plurality of pixels formed in a semiconductor substrate, each pixel including a light sensitive element. A micro-lens is formed over each of the light sensitive elements. Finally, a trench structure surrounds each of the micro-lenses.

Claims

1-14. -14. (cancelled)

15. A method of forming a pixel of an image sensor comprising:

forming a light sensitive element in a semiconductor substrate;

forming a top planarizing layer over said light sensitive element;

forming a trench structure in said top planarizing layer, said trench structure encompassing said light sensitive element; and

forming a microlens within the interior of said trench structure and over said light sensitive element.

16. The method of claim 15 wherein said trench structure is formed in said top planarizing layer.

17. The method of claim 15 wherein said trench structure has a rectangular cross section.

18. The method of claim 15 wherein said trench structure is a closed shape.

19. The method of claim 15 further including forming a color filter layer between said microlens and said light sensitive element.