High temperature attachment of organic molecules to substrates
First Claim
1. A method of coupling a redox-active molecule to a surface, said method comprising:
- providing a heat-resistant organic molecule bearing an attachment group;
heating said molecule and/or said surface to a temperature of at least about 100°
C.; and
contacting said molecule to said surface whereby said molecule forms a covalent linkage to said surface.
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Abstract
This invention provides a new procedure for attaching molecules to semiconductor surfaces, in particular silicon. The molecules, which include, but are not limited to porphyrins and ferrocenes, have been previously shown to be attractive candidates for molecular-based information storage. The new attachment procedure is simple, can be completed in short times, requires minimal amounts of material, is compatible with diverse molecular functional groups, and in some instances affords unprecedented attachment motifs. These features greatly enhance the integration of the molecular materials into the processing steps that are needed to create hybrid molecular/semiconductor information storage devices.
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Citations
105 Claims
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1. A method of coupling a redox-active molecule to a surface, said method comprising:
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providing a heat-resistant organic molecule bearing an attachment group;
heating said molecule and/or said surface to a temperature of at least about 100°
C.; and
contacting said molecule to said surface whereby said molecule forms a covalent linkage to said surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 71, 72, 73, 74)
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40. A method of coupling a redox-active molecule to a surface, said method comprising heating said molecule to a gas phase;
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contacting said molecule to a surface whereby said redox-active molecule couples to said surface. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70)
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75. A redox-active substrate comprising a Group III, IV, or V element or a transition metal or transition metal oxide having attached thereto a redox-active molecule where:
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said redox-active molecule is covalently attached to the surface of said Group III, IV, or V element through an attachment group;
said redox-active molecule is an organic molecule stable at a temperature of at least about 200°
C.; and
said covalent attachment is not by a silane. - View Dependent Claims (76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100)
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101. A method of fabricating an ordered molecular assembly, said method comprising:
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providing a heat-resistant organic molecule derivatized with an attachment group;
heating said molecule and/or a surface to a temperature of at lest about 100°
C.; and
contacting said molecule with said surface wherein said surface comprises a Group III, IV, or V element or a transition metal or metal oxide, and said molecule is contacted at a plurality of discrete locations on said surface whereby the attachment groups form covalent or ionic bonds with said surface at said plurality of discrete locations. - View Dependent Claims (102, 103)
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104. A kit for coupling an organic molecule to the surface of a type III, IV, or V material or a transition metal or transition metal oxide, said kit comprising:
a container containing a heat-resistant organic molecule derivatized with an attachment group. - View Dependent Claims (105)
Specification