Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus
First Claim
1. A method for manufacturing a semiconductor device, comprising:
- (a) forming a conductive part in a concave part on a first surface of a substrate, the first surface having a plurality of chip mounting areas;
(b) stacking a semiconductor chip in the chip mounting areas;
(c) providing a sealing member on the first surface of the substrate; and
(d) making part of a second surface of the substrate thin so as to make the conductive part penetrate from the first surface to the second surface.
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Accused Products
Abstract
Exemplary embodiments of the present invention include a semiconductor device, a method for manufacturing the same, a circuit board and an electronic apparatus with increased productivity and reliability. An exemplary method for manufacturing a semiconductor device of the present invention includes forming a conductive part in a concave part on a first surface of a semiconductor substrate, the first surface having a plurality of chip mounting areas. Stacking at least one semiconductor chip in each of the chip mounting areas, providing a sealing member on the first surface of the semiconductor substrate and making part of a second surface of the semiconductor substrate thin so as to make the conductive part penetrate from the first surface to the second surface.
52 Citations
23 Claims
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1. A method for manufacturing a semiconductor device, comprising:
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(a) forming a conductive part in a concave part on a first surface of a substrate, the first surface having a plurality of chip mounting areas;
(b) stacking a semiconductor chip in the chip mounting areas;
(c) providing a sealing member on the first surface of the substrate; and
(d) making part of a second surface of the substrate thin so as to make the conductive part penetrate from the first surface to the second surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor device, comprising:
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a substrate having a first surface and a second surface, the substrate including;
a plurality of chip mounting areas on the first surface; and
a penetrating electrode penetrating from the first surface to the second surface;
a semiconductor chip stacked in each of the chip mounting areas of the substrate; and
a sealing member provided on the first surface of the substrate. - View Dependent Claims (19, 20, 21, 22, 23)
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Specification