Insulator for an organic electronic component

• US 20050048803A1
• Filed: 09/05/2002
• Published: 03/03/2005
• Est. Priority Date: 10/16/2001
• Status: Active Grant

• Current Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Original Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Inventors: Rost, Henning, Fix, Walter, Ullmann, Andreas, Guillet, Erwann, Bonzani, Peter
• Granted Patent: US 7,298,023 B2
• Time in Patent Office: Days
• US Class Current: 438/209
• CPC Class Codes: H01B 3/442 from aromatic vinyl compounds
• CPC Class Codes: H01B 3/447 from acrylic compounds
• CPC Class Codes: H01G 4/18 of synthetic material, e.g. derivatives of cellulose H01G4/16 takes precedence
• CPC Class Codes: H01L 21/02118 carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC polymers per se C08G, photoresist per se G03F
• CPC Class Codes: H01L 21/312 Organic layers, e.g. photoresist H01L21/3105, H01L21/32 take precedence; photoresists per se G03C
• CPC Class Codes: H10K 10/471 the gate dielectric comprising only organic materials

Abstract

The invention concerns an insulator for an organic electronic component, in particular, for an organic field-effect transistor (OFET) or for an organic capacitor. The insulating material is characterized in that it includes an almost constant relative dielectric constant, even in case of frequency variation in wide ranges, for example, between 1 Hz and 100 kHz.

Claims

1. An insulator for an organic electronic component comprising:

a layer of material which is at least partially based on organic material, wherein the dielectric constant of the insulating layer of material remains substantially constant within a frequency range between 1 Hz and 100 Hz;

the layer of material being arranged to be dimensioned including a thickness and outer peripheral dimensions to form one of an organic field-effect transistor and capacitor.

2. An insulator in accordance with claim 1, comprising one of polyisobutylene and uncrosslinked EPDM (Ethylene Propylene Diene Monomer) as a base polymer.

3. An insulator in accordance with claim 1, comprising as base polymer a commercially available PVDC-PAN-PMMA copolymer with the general formula

(—

CH₂Cl₂—

)_x—

(—

CH₂CH(CN)—

)_y—

(CH₂C(CH₃)(CO₂CH₃)—

)_z,

wherein x, y, z, in each case, independently from one another, may assume values between 0 and 1.

4. An insulator in accordance with claim 1, comprising a base polymer with general formula

[A_x/B₁-z],

wherein A, for example, is polyhydroxystyrene and B is poly(styrene-co-alyl-alcohol), polyvinylalcohol and/or poly-alpha-methylstyrene.

5. An insulator in accordance with claim 4, wherein the base polymer is a compound comprising 50% polyhydroxystyrene and 50% poly(styrene-co-allyl-alcohol).

6. An insulator in accordance with claim 1, comprising as base polymer a compound of two polymers, with the general formula

[A_z/B_y],

with A equals poly(vinyltoluene-co-alpha-methylstyrene) and B equals poly(styrene-co-allyl-alcohol), wherein the values of x and y may be equal or unequal and assume values between 0.5 and 1.

7. An insulator in accordance with claim 6, wherein the values of x and y are equal.

8. An insulator, in accordance with one of the claims 3 through 7 wherein the base polymer is dissolved in one of a polar solvent and a polar mixture comprising at least two solvents.

9. The insulating layer of claim 1 including a circuit formed on a surface of said layer.

10. The insulating layer of claim 1 including an OFET circuit formed on a surface of said layer.

11. The insulating layer of claim 1 including a transistor circuit formed on a surface of said layer.