Micromachined double tuning-fork gyrometer with detection in the plane of the machined wafer
First Claim
1. A gyrometer based on a vibrating structure, comprising:
- four moving assemblies placed at the vertices of a virtual rectangle, each moving assembly being coupled to two moving assemblies located at neighboring vertices via a coupling structure in order to allow transfer of mechanical vibration energy between them, each moving assembly including a first inertial moving element connected to the coupling structure and intended to vibrate in two orthogonal directions in the plane of the wafer, a first direction, called the excitation direction, and a second direction, called the detection direction, a second moving element intended to vibrate in the detection direction without permitting movement of the second element in the excitation direction and connected, on one side, to the first moving element, and, on the other side, to anchoring zones via linking means which allow transmission to the second moving element of the vibration movement of the first moving element in the detection direction.
1 Assignment
0 Petitions
Accused Products
Abstract
The invention relates to a gyrometer based on a vibrating structure, produced by micromachining in a thin planar wafer. It comprises four moving assemblies placed at the vertices of a virtual rectangle, each moving assembly being coupled to two moving assemblies located at neighboring vertices via a coupling structure and comprising an inertial first moving element connected to the coupling structure and intended to vibrate in two orthogonal directions in the plane of the wafer, namely an excitation direction and a detection direction, and a second moving element intended to vibrate in the detection direction and connected, on one side, to the first moving element and, on the other side, to anchoring zones via linking means.
-
Citations
31 Claims
-
1. A gyrometer based on a vibrating structure, comprising:
four moving assemblies placed at the vertices of a virtual rectangle, each moving assembly being coupled to two moving assemblies located at neighboring vertices via a coupling structure in order to allow transfer of mechanical vibration energy between them, each moving assembly including a first inertial moving element connected to the coupling structure and intended to vibrate in two orthogonal directions in the plane of the wafer, a first direction, called the excitation direction, and a second direction, called the detection direction, a second moving element intended to vibrate in the detection direction without permitting movement of the second element in the excitation direction and connected, on one side, to the first moving element, and, on the other side, to anchoring zones via linking means which allow transmission to the second moving element of the vibration movement of the first moving element in the detection direction. - View Dependent Claims (2, 3, 4, 7, 8, 9, 10, 11, 12, 13, 16, 19, 20, 21, 22, 23, 24, 25, 26, 31)
-
5. (canceled)
-
6. (canceled)
-
14. (canceled)
-
15. (canceled)
-
17. (canceled)
-
18. (canceled)
-
27-30. -30. (canceled)
Specification