LOOK DOWN IMAGE SENSOR PACKAGE
First Claim
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1. An image sensor package comprising:
- a transparent substrate comprising a base surface and a pocket sidewall;
a trace coupled to said base surface;
an image sensor comprising a first surface comprising an active area and a bond pad;
a bump coupling said bond pad to said trace, wherein said image sensor is located within an image sensor pocket of said transparent substrate defined by said base surface and said pocket sidewall; and
a bead forming a seal between a periphery of said image sensor and said base surface, wherein said image sensor, said bead, and said base surface define a cavity, said active area being located within said cavity.
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Abstract
An image sensor package includes a transparent substrate having an image sensor pocket. An image sensor is flip chip mounted to the transparent substrate such that the image sensor is located within the image sensor pocket. Since the image sensor is located within the image sensor pocket, the image sensor package is approximately the same thickness as the transparent substrate.
82 Citations
25 Claims
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1. An image sensor package comprising:
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a transparent substrate comprising a base surface and a pocket sidewall;
a trace coupled to said base surface;
an image sensor comprising a first surface comprising an active area and a bond pad;
a bump coupling said bond pad to said trace, wherein said image sensor is located within an image sensor pocket of said transparent substrate defined by said base surface and said pocket sidewall; and
a bead forming a seal between a periphery of said image sensor and said base surface, wherein said image sensor, said bead, and said base surface define a cavity, said active area being located within said cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An image sensor package comprising:
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a transparent substrate comprising;
a base surface;
a pocket sidewall; and
a rear surface, said pocket sidewall extending between said base surface and said rear surface;
a trace coupled to said base surface, wherein said trace extends from said base surface, along said pocket sidewall, and to said rear surface;
an image sensor comprising;
a first surface comprising an active area and a bond pad; and
a second surface coplanar with said rear surface of said transparent substrate; and
a bump coupling said bond pad to said trace, wherein said image sensor is located within an image sensor pocket of said transparent substrate defined by said base surface and said pocket sidewall. - View Dependent Claims (13, 14)
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10. An image sensor package comprising:
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a transparent substrate comprising;
a base surface;
a pocket sidewall; and
a rear surface, said pocket sidewall extending between said base surface and said rear surface;
a trace coupled to said base surface, wherein said trace extends from said base surface, along said pocket sidewall, and to said rear surface;
an image sensor comprising;
a first surface comprising an active area and a bond pad; and
a second surface above said rear surface of said transparent substrate; and
a bump coupling said bond pad to said trace, wherein said image sensor is located within an image sensor pocket of said transparent substrate defined by said base surface and said pocket sidewall.
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11-12. -12. (Canceled)
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15-20. -20. (Canceled)
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21. An image sensor package comprising:
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a transparent substrate comprising;
a base;
a pocket ring coupled to said base;
an image sensor comprising a first surface comprising an active area and a bond pad, wherein said image sensor is located within an image sensor pocket of said transparent substrate; and
a bead forming a seal between a periphery of said image sensor and said base, wherein said image sensor, said bead, and said base define a cavity, said active area being located within said cavity. - View Dependent Claims (22, 23, 24, 25)
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Specification