Semiconductor device and a method of manufacturing the same
First Claim
1. A semiconductor device comprising a complex integrated circuit where a substrate on which an inductor is formed on an insulating surface thereof and a layer including a thin film transistor connected to the inductor are laminated.
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Accused Products
Abstract
It is an object to provide a semiconductor device integrating various elements without using a semiconductor substrate, and a method of manufacturing the same. According to the present invention, a layer to be separated including an inductor, a capacitor, a resistor element, a TFT element, an embedded wiring and the like, is formed over a substrate, separated from the substrate, and transferred onto a circuit board 100. An electrical conduction with a wiring pattern 114 provided in the circuit board 100 is made by a wire 112 or a solder 107, thereby forming a high frequency module or the like.
136 Citations
38 Claims
- 1. A semiconductor device comprising a complex integrated circuit where a substrate on which an inductor is formed on an insulating surface thereof and a layer including a thin film transistor connected to the inductor are laminated.
- 2. A semiconductor device comprising a complex integrated circuit where a substrate on which a capacitor is formed on an insulating surface thereof and a layer including a thin film transistor connected to the capacitor are laminated.
- 3. A semiconductor device comprising a complex integrated circuit where a substrate on which an inductor and a capacitor are formed on an insulating surface thereof and a thin film transistor connected to the inductor or the capacitor are laminated.
- 4. A semiconductor device comprising a complex integrated circuit where a substrate on which an inductor, a capacitor, and a resistor element are formed on an insulating surface thereof and a thin film transistor connected to the inductor, the capacitor, or the resistor element are laminated.
- 8. A semiconductor device comprising a complex integrated circuit where a substrate on which a SAW element is formed on an insulating surface thereof and a thin film transistor connected to the SAW element are laminated.
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12. A method of manufacturing a semiconductor device, comprising:
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a first step of forming a layer to be separated including an inductor, a capacitor, a resistor element, a SAW element, or a TFT over a first substrate;
a second step of applying an organic resin film that is soluble in a solvent, over the layer to be separated;
a third step of attaching a second substrate to the organic resin film by a first two-sided tape and sandwiching the layer to be separated and the organic resin film with the first substrate and the second substrate;
a fourth step of separating the first substrate from the layer to be separated by a physical means;
a fifth step of attaching a third substrate to the layer to be separated by an adhesive agent and sandwiching the layer to be separated with the second substrate and the third substrate;
a sixth step of separating the layer to be separated and the first two-sided tape from the second substrate;
a seventh step of separating the layer to be separated from the first two-sided tape;
an eighth step of removing the organic resin film by the solvent; and
a ninth step of connecting an electrode provided in the third substrate and an electrode provided in the layer to be separated. - View Dependent Claims (13)
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14. A method of manufacturing a semiconductor device comprising:
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a first step of forming a layer to be separated including an embedded wiring over a first substrate;
a second step of forming an inductor, a capacitor, a resistor element, a SAW element, or a TFT and an extraction electrode connected to the elements over a second substrate;
a third step of attaching the second substrate to the layer to be separated by an adhesive agent and sandwiching the layer to be separated with the first substrate and the second substrate; and
a fourth step of separating the first substrate from the layer to be separated by a physical means. - View Dependent Claims (15, 16, 17)
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Specification