Air-gap insulator for short-term exposure to a high temperature environment
First Claim
1. A packaging system for electronic circuitry, wherein the electronic circuitry is disposed on a substrate, the packaging system comprising in combination:
- an inner housing surrounding the substrate;
an outer housing surrounding the inner housing and the substrate; and
a gap positioned between the inner and outer housings, the gap filled with insulating media, whereby when the packaging system experiences short term exposure to a high temperature, the combination of the inner housing, the outer housing, and the gap allow the electronic circuitry to maintain operability.
1 Assignment
0 Petitions
Accused Products
Abstract
A packaging system for electronic circuitry is provided. The electronic circuitry may be disposed upon a substrate, which can be encased or otherwise surrounded by one or more components of the packaging system. The packaging system may include (i) an inner housing that can encase or otherwise enclose the substrate within its confines; (ii) an outer housing that in turn encases or encloses the combination of the inner housing and the substrate within its confines; and (iii) one or more gaps positioned between the electronic circuitry, inner housing and outer housing. The gaps may be filled with fluid or solid insulating media. The combination of the inner housing, outer housing, and gaps can insulate the electronic circuitry from the detrimental and destructive heating effects when the packaging system experiences short-term exposure to a high temperature, which thereby allows operability before, during and after such exposure.
-
Citations
24 Claims
-
1. A packaging system for electronic circuitry, wherein the electronic circuitry is disposed on a substrate, the packaging system comprising in combination:
-
an inner housing surrounding the substrate;
an outer housing surrounding the inner housing and the substrate; and
a gap positioned between the inner and outer housings, the gap filled with insulating media, whereby when the packaging system experiences short term exposure to a high temperature, the combination of the inner housing, the outer housing, and the gap allow the electronic circuitry to maintain operability. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A packaging system for electronic circuitry, wherein the electronic circuitry is disposed on a substrate, the packaging system comprising in combination:
-
an inner housing fabricated from material having low thermal conductivity, the inner housing defining a first cavity for accepting the substrate, the inner housing including an outer surface having at least one protrusion extending away from the outer surface;
an outer housing defining a second cavity for accepting the inner housing and substrate, the second cavity including an inner surface for contacting the at least one protrusion extending from the outer surface of the inner housing; and
a gap positioned between the outer surface of the inner housing and the inner surface of the outer housing, the gap filled with an insulating media, whereby when the packaging system experiences short term exposure to a high temperature, the combination of the inner housing, the outer housing, and the gap allow the electronic circuitry to maintain operability. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
-
Specification