Compact radio equipment and method of mounting the same

• US 20050052858A1
• Filed: 09/03/2004
• Published: 03/10/2005
• Est. Priority Date: 09/05/2003
• Status: Active Grant

• Current Assignee: Lenovo Innovations Ltd Hong Kong (Lenovo Group Ltd.)
• Original Assignee: NEC Corporation
• Inventors: Shima, Makoto
• Granted Patent: US 7,177,161 B2
• Time in Patent Office: Days
• US Class Current: 361/814
• CPC Class Codes: H04B 15/00 Suppression or limitation of noise or interference by means associated with receiver H04B1/10
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 9/0039 Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218

Abstract

A compact radio equipment includes internal circuits on two or more printed circuit boards electrically connected to each other and securely mounted in structure. With this structure, a first metal shield frame is mounted on a first printed circuit board to cover components mounted on the first printed circuit board. A second printed circuit board is mounted on the first metal shield frame.

Claims

1. Compact radio equipment including internal circuits on two or more printed circuit boards electrically connected to each other and securely mounted in structure, comprising:

a first metal shield frame mounted on a first printed circuit board to cover components mounted on the first printed circuit board; and

a second printed circuit board mounted on the first metal shield frame.

2. Compact radio equipment according to claim 1, wherein the second printed circuit board is electrically and mechanically connected to the first metal shield frame so that a bottom surface layer opposite to a component mounting surface is a ground layer.

3. Compact radio equipment according to claim 1, wherein the second printed circuit board is electrically connected to the first metal shield frame so that a bottom surface layer opposite to a component mounting surface is a ground layer, and the second printed circuit board is structured by a radio circuit.

4. Compact radio equipment according to claim 1, further comprising a second metal shield frame to cover the second printed circuit board.

5. Compact radio equipment according to claim 4, wherein the second metal shield frame is mounted on the first metal shield frame.

6. Compact radio equipment according to claim 4, wherein the second shield frame is mounted on the second printed circuit board.

7. Compact radio equipment according to claim 1, wherein the equipment serves as a cell-phone or a PHS terminal.

9. Compact radio equipment according to claim 7, wherein the equipment serves as a cell-phone or a PHS terminal.

13. A mounting method according to claim 1, further comprising the step of covering the second printed circuit board with a second metal shield frame.

14. A mounting method according to claim 13, wherein the second metal shield frame is mounted on the first metal shield frame.

15. A mounting method according to claim 13, wherein the second shield frame is mounted on the second printed circuit board.

16. A mounting method according to claim 1, wherein the equipment serves as a cell-phone or a PHS terminal.

8. Compact radio equipment including internal circuits on two or more printed circuit boards electrically connected to each other and securely mounted in structure, comprising:

a first metal shield frame mounted on a first printed circuit board to cover first components mounted on the first printed circuit board; and

a second metal shield frame mounted on a second printed circuit board to cover second components mounted on the second printed circuit board,

wherein a first top plate of the first metal shield frame and a second top plate of the second metal shield frame are connected to each other.

10. A method of mounting a compact radio equipment including internal circuits on two or more printed circuit boards electrically connected to each other and securely mounted in structure, comprising the steps of mounting a first metal shield frame on a first printed circuit board to cover components mounted on the first printed circuit board;

and mounting a second printed circuit board on the first metal shield frame.

11. A mounting method according to claim 10, wherein:

the second printed circuit board is electrically and mechanically connected to the first metal shield frame so that a bottom surface layer opposite to a component mounting surface is a ground layer.

12. A mounting method according to claim 10, wherein the second printed circuit board is electrically connected to the first metal shield frame so that a bottom surface layer opposite to a component mounting surface is a ground layer, and the second printed circuit board is structured by a radio circuit.

17. A method of mounting a compact radio equipment including internal circuits on two or more printed circuit boards electrically connected to each other and securely mounted in structure, comprising the steps of:

mounting a first metal shield frame on a first printed circuit board to cover first components mounted on the first printed circuit board; and

mounting a second metal shield frame on a second printed circuit board to cover second components mounted on the second printed circuit board,

wherein a first top plate of the first metal shield frame and a second top plate of the second metal shield frame are connected to each other.

18. A mounting method according to claim 17, wherein the equipment serves as a cell-phone or a PHS terminal.