VLSI-photonic heterogeneous integration by wafer bonding
First Claim
1. A method to form a VLSI-photonic heterogeneous system device, said method comprising:
- providing an optical substrate comprising at least one passive optical component formed therein;
providing an electronic substrate comprising at least one active electronic component formed therein;
forming a plurality of metal pillars through said optical substrate and protruding out a first surface of said optical substrate;
forming a plurality of metal pads on a first surface of said electronic substrate; and
bonding together said optical substrate and said electronic substrate by a method further comprising;
aligning said first surfaces of said optical and electronic substrates such that said protruding metal pillars contact said metal pads; and
thermally treating said optical and electronic substrates such that said metal pillars bond to said metal pads.
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Accused Products
Abstract
A new method to form a VLSI-photonic heterogeneous system device is achieved. The method comprises providing an optical substrate comprising at least one passive optical component formed therein. An electronic substrate is provided comprising at least one active electronic component formed therein. A plurality of metal pillars are formed through the optical substrate and protruding out a first surface of the optical substrate. A plurality of metal pads are formed on a first surface of the electronic substrate. The optical substrate and the electronic substrate are bonding together by a method further comprising aligning the first surfaces of the optical and electronic substrates such that the protruding metal pillars contact the metal pads. The optical and electronic substrates are then thermally treated such that the metal pillars bond to the metal pads.
75 Citations
53 Claims
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1. A method to form a VLSI-photonic heterogeneous system device, said method comprising:
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providing an optical substrate comprising at least one passive optical component formed therein;
providing an electronic substrate comprising at least one active electronic component formed therein;
forming a plurality of metal pillars through said optical substrate and protruding out a first surface of said optical substrate;
forming a plurality of metal pads on a first surface of said electronic substrate; and
bonding together said optical substrate and said electronic substrate by a method further comprising;
aligning said first surfaces of said optical and electronic substrates such that said protruding metal pillars contact said metal pads; and
thermally treating said optical and electronic substrates such that said metal pillars bond to said metal pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method to form a waveguide with an embedded mirror in the manufacture of an optical substrate device, said method comprising:
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forming a cladding layer overlying a silicon layer on an optical substrate;
patterning said cladding layer to form openings through said cladding layer where an embedded mirror is planned;
depositing a waveguide layer overlying said cladding layer and filling said openings;
patterning said waveguide layer to define a waveguide wherein said patterning forms an angled edge where said waveguide layer is etched through to underlying said cladding layer;
depositing a metal layer overlying said waveguide; and
patterning said metal layer to remove said metal layer from said waveguide excepting at said angled edge of said waveguide wherein said metal layer forms an embedded mirror for said waveguide. - View Dependent Claims (27, 28, 29, 30)
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31. A VLSI-photonic heterogeneous system device, said device comprising:
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an optical substrate comprising;
at least one passive optical component formed therein; and
a plurality of metal pillars through said optical substrate and protruding out a first surface of said optical substrate; and
an electronic substrate comprising;
at least one active electronic component formed therein; and
a plurality of metal pads on a first surface of said electronic substrate wherein said first surfaces of said optical substrate and said electronic substrate are held together by the bonding between said metal pillars and said metal pads. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50)
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51. A waveguide device with an embedded mirror, said device comprising:
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a cladding layer overlying a silicon layer on an optical substrate wherein said cladding layer has openings through to underlying silicon layer;
a patterned waveguide layer overlying said cladding layer and partially filling said openings wherein said patterned waveguide layer has an angled edge in said openings;
a metal layer overlying said waveguide only on said angled edge; and
a second cladding layer overlying said waveguide layer and said metal layer. - View Dependent Claims (52, 53)
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Specification