Further method to pattern a substrate
First Claim
1. A method of lithography for enhancing uniformity of critical dimensions of features patterned onto a workpiece coated with a layer sensitive to an energy beam, using the energy beam and a multipass writing strategy, the method including:
- determining individual doses for writing passes so that the passes will affect said coating substantially equally, thereby enhancing said uniformity of critical dimensions of features;
exposing said coating using the multipass writing strategy, applying the individual doses in the writing passes; and
developing said coating.
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Abstract
The present invention relates to methods for patterning substrates, such as reticles, masks or wafers, which reduce critical dimension variations, improving CD uniformity. In particular, it relates to tuning doses applied in passes of a multipass writing strategy to measurable characteristics of resists or radiation sensitive layers applied to the substrates. Particular writing strategies are described. Aspects of the present invention are described in the claims, specification and drawings.
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Citations
21 Claims
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1. A method of lithography for enhancing uniformity of critical dimensions of features patterned onto a workpiece coated with a layer sensitive to an energy beam, using the energy beam and a multipass writing strategy, the method including:
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determining individual doses for writing passes so that the passes will affect said coating substantially equally, thereby enhancing said uniformity of critical dimensions of features;
exposing said coating using the multipass writing strategy, applying the individual doses in the writing passes; and
developing said coating. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification