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Method for forming ball pads of BGA substrate

  • US 20050054187A1
  • Filed: 09/03/2004
  • Published: 03/10/2005
  • Est. Priority Date: 09/05/2003
  • Status: Abandoned Application
First Claim
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1. A method for forming ball pads of a BGA substrate, comprising:

  • providing a substrate, the substrate having a plurality of pad terminals and a solder mask on a surface, the solder mask having a plurality of openings to expose the pad terminals;

    forming a metal layer on the solder mask, the metal layer covering the pad terminals via the openings;

    forming an etching mask on the metal layer, the etching mask having a plurality of covering portions which are aligned with the pad terminals and are larger than the openings of the solder mask; and

    etching the metal layer to form a plurality of redefined ball pads under the covering portions of the etching mask.

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