Method and device for parting glass substrate, liquid crystal panel, and liquid crystal panel manufacturing device

• US 20050056127A1
• Filed: 11/05/2002
• Published: 03/17/2005
• Est. Priority Date: 11/08/2001
• Status: Active Grant

• Current Assignee: Citizen Seimitsu Co., Ltd. (Citizen Electronics Company Limited), Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Citizen Seimitsu Co., Ltd. (Citizen Electronics Company Limited)
• Inventors: Yamabuchi, Koji, Kaida, Kazuya, Furuya, Toshimitsu, Horiuchi, Takane, Komoda, Tomohisa, Izumi, Akinori, Katayama, Tetsuro, Takabe, Shinya
• Granted Patent: US 7,553,390 B2
• Time in Patent Office: Days
• US Class Current: 83/13
• CPC Class Codes: B65G 2249/04 Arrangements of vacuum systems or suction cups
• CPC Class Codes: C03B 33/033 Apparatus for opening score lines in glass sheets
• CPC Class Codes: C03B 33/07 Cutting armoured, multi-layered, coated or laminated, glass products
• CPC Class Codes: C03B 33/074 Glass products comprising an outer layer or surface coating of non-glass material
• CPC Class Codes: C03B 33/10 Glass-cutting tools, e.g. scoring tools
• CPC Class Codes: C03B 33/105 Details of cutting or scoring means, e.g. tips
• CPC Class Codes: C09K 2323/00 Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
• CPC Class Codes: G02F 1/133351 Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 156/1064 Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 83/0333 Scoring
• CPC Class Codes: Y10T 83/04 Processes
• CPC Class Codes: Y10T 83/0495 Making and using a registration cut
• CPC Class Codes: Y10T 83/0524 Plural cutting steps
• CPC Class Codes: Y10T 83/0605 Cut advances across work surface
• CPC Class Codes: Y10T 83/9372 Rotatable type

Abstract

A method for cutting apart a glass substrate is provided whereby scribing of the glass substrate is possible without being affected by the presence or thickness of a deposited film formed thereon and without scratching the deposited film. To treat a glass substrate (1) having a deposited film (1a), such as a thin film or resin film, formed on one surface thereof, there are provided a shaving means (202), which is a blade that removes strip-shaped portions of the deposited film (1a) to expose strip-shaped regions on the glass substrate (1), and a wheel cutter (14a) that forms scribed lines along the strip-shaped regions exposed on the glass substrate (1). The glass substrate (1) is cut apart along the scribed lines.

Claims

1. A method of cutting apart a glass substrate having a deposited film formed thereon, comprising the steps of:

removing strip-shaped portions of the deposited film so as to expose strip-shaped regions on the substrate; and

forming cracks so as to permit the glass substrate to be cut apart along the strip-shaped regions exposed thereon by the glass substrate exposing means, and

cutting the glass substrate apart along the cracks.

2. The method of cutting apart a glass substrate according to claim 1,

wherein said step of forming cracks so as to permit the glass substrate to be cut apart along the strip-shaped regions exposed thereon comprises the step of forming cracks on the strip-shaped regions.

3. The method of cutting apart a glass substrate according to claim 1,

wherein said step of forming cracks so as to permit the glass substrate to be cut apart along the strip-shaped regions exposed thereon comprises the steps of forming cracks on a surface of the glass substrate opposite to the strip-shaped regions.

4. The method of cutting apart a glass substrate according to one of claims 1 to 3,

wherein said step of forming cracks so as to permit the glass substrate to be cut apart along the strip-shaped regions exposed thereon comprises the step of forming cracks using a wheel cutter.

5. The method of cutting apart a glass substrate according to one of claims 1 to 3, including the additional step of:

placing the glass substrate on a workpiece stage,

wherein the glass substrate consists of product portions and waste portions arranged alternately, the product portions being used as products after cutting-apart and the waste portions being discarded after cutting-apart, and, on the workpiece stage, there are formed projections for supporting the glass substrate at the waste portions thereof.

6. The method of cutting apart a glass substrate according to one of claims 1 to 3,

wherein said step of removing strip-shaped portions of the deposited film so as to expose strip-shaped regions on the substrate comprises the steps of shaving off portions of the deposited film.

7. The method of cutting apart a glass substrate according to claim 6 including the additional step of,

determining an angle and a pressing force with which the cutting mechanism shaves the deposited film according to a thickness and a material of the deposited film.

8. The method of cutting apart a glass substrate according to claim 6,

wherein said step of shaving off portions of the deposited film comprises the step of shaving off strip-shaped portions of the deposited film using a blade having a cutting edge having a substantially V-shaped, arc-shaped, or trapezoidal cross section.

9. The method of cutting apart a glass substrate according to claim 8,

including the additional step of determining dimensions of the cross section of the cutting edge of the blade so that the strip-shaped regions are exposed with a width sufficient to permit the cracks to be formed.

10. The method of cutting apart a glass substrate according to claim 8,

wherein said step of shaving off strip-shaped portions of the deposited film using a blade having a cutting edge comprises the step of using a blade having a cutting edge having an opening angle 3°

to 6°

smaller in a portion thereof away from a tip portion thereof than in the tip portion.

11. The method of cutting apart a glass substrate according to claim 8,

wherein said step of shaving off strip-shaped portions of the deposited film using a blade having a cutting edge comprises the step of using an elongate blade having a same cross-sectional shape throughout a length thereof.

12. The method of cutting apart a glass substrate according to claim 6,

wherein said step of removing strip-shaped portions of the deposited film so as to expose strip-shaped regions on the substrate comprises the step of cutting strip-shaped portions of the deposited film with a combination of two cutters fixed together at a predetermined interval.

13. The method of cutting apart a glass substrate according to claim 12,

wherein said step of removing strip-shaped portions of the deposited film so as to expose strip-shaped regions on the substrate comprises the step of cutting strip-shaped portions of the deposited film with a combination of two cutters fixed together at a predetermined interval and arranged so that the strip-shaped regions are exposed with a width sufficient to permit the cracks to be formed.

14. The method of cutting apart a glass substrate according to claim 6,

wherein said step of removing strip-shaped portions of the deposited film so as to expose strip-shaped regions on the substrate comprises the step of cutting strip-shaped portions of the deposited film with a blade portion that directly shaves off portions of the deposited film and a holder portion that holds the blade portion.

15. The method of cutting apart a glass substrate according to claim 6,

wherein said step of removing strip-shaped portions of the deposited film so as to expose strip-shaped regions on the substrate comprises the step of applying a predetermined pressing force to the glass substrate.

16. The method of cutting apart a glass substrate according to claim 15,

wherein said step of applying a predetermined pressing force to the glass substrate comprises the step of applying an elastic force exerted by an elastic member.

17. The method of cutting apart a glass substrate according to claim 6,

wherein, along edges of the glass substrate, there is provided a non-film-deposited portion where the deposited film is not formed.

19. The apparatus for cutting apart a glass substrate according to claim 18,

wherein the apparatus uses the method of cutting apart a glass substrate according to one of claims 1 to 3.

18. An apparatus for cutting apart a glass substrate, the apparatus including a workpiece stage on which a glass substrate having a deposited film formed thereon is placed, securing means for securing the glass substrate in a predetermined position on the workpiece stage, crack forming means for forming cracks on the glass substrate so as to permit the glass substrate to be cut apart along the cracks, and actuating means for moving the crack forming means to a predetermined position, the apparatus cutting apart the glass substrate into a plurality of blocks along the cracks, comprising:

a glass substrate exposing means for removing strip-shaped portions of the deposited film so as to expose strip-shaped regions on the glass substrate,

wherein the cracks are so formed that the glass substrate is cut apart along the strip-shaped regions exposed thereon by the glass substrate exposing means.

20. The apparatus for cutting apart a glass substrate according to claim 18,

wherein the apparatus performs both a step of making the glass substrate exposing means remove strip-shaped portions of the deposited film and a step of making the crack forming means form cracks on the glass substrate.

21. The apparatus for cutting apart a glass substrate according to claim 18 or 20,

wherein the actuating means moves the glass substrate exposing means and the crack forming means in a same direction.

22. The apparatus for cutting apart a glass substrate according to claim 18 or 20,

wherein the glass substrate exposing means and the crack forming means are arranged in a row along a direction in which the actuating means moves.

23. The apparatus for cutting apart a glass substrate according to claim 18 or 20,

wherein the glass substrate exposing means and the crack forming means are integrally held by the actuating means at a predetermined interval, and move parallel to a direction in which the actuating means moves.

24. The apparatus for cutting apart a glass substrate according to claim 23,

wherein the predetermined interval is equal to intervals at which the glass substrate is cut apart into strip-shaped blocks.

25. The apparatus for cutting apart a glass substrate according to claim 18 or 20, further comprising:

detecting means, controlling means, and guiding means for guiding the glass substrate exposing means to a position on a glass surface of the glass substrate on which the deposited film is formed.

26. The apparatus for cutting apart a glass substrate according to claim 25,

wherein the detecting means extends and contracts vertically relative to the glass substrate, and has, at a tip thereof, a freely rotatable rolling probe formed of an elastic material.

27. The apparatus for cutting apart a glass substrate according to claim 26,

wherein the detecting means operates with a sensing force of 0.2 N (newton) or less.

28. The apparatus for cutting apart a glass substrate according to claim 18 or 20,

wherein the strip-shaped regions and the cracks are formed in a grid-like pattern on the glass substrate.

29. The apparatus for cutting apart a glass substrate according to claim 28,

wherein the workpiece stage is rotatable through 90°

.

30. The apparatus for cutting apart a glass substrate according to claim 28,

wherein the workpiece stage is movable in a direction perpendicular to a direction in which the crack forming means moves.

31. The apparatus for cutting apart a glass substrate according to claim 18

wherein the crack forming means and the glass substrate exposing means are formed integrally and are together rotatable in a plane parallel to a surface of the workpiece stage.

32. The apparatus for cutting apart a glass substrate according to claim 18 or 20 further comprising:

removing means for removing waste shavings of the deposited film produced by the glass substrate exposing means and particles of the glass substrate produced by the crack forming means.

33. The apparatus for cutting apart a glass substrate according to claim 32,

wherein the removing means is a negative pressure supplying means, a positive pressure supplying means, or a brush-like removing means.

34. The apparatus for cutting apart a glass substrate according to claim 18 or 20,

wherein the glass substrate exposing means is a cutting mechanism that shaves off and thereby removes portions of the deposited film,

the apparatus further comprising:

a fine-adjusting means for guiding a tip of a blade portion of the cutting mechanism to a position on a glass surface of the glass substrate on which the deposited film is formed.

35. The apparatus for cutting apart a glass substrate according to claim 18 or 20,

wherein an elongate opening is formed in the workpiece stage,

the crack forming means being so disposed as to be movable along the opening,

the glass substrate exposing means being disposed opposite to the crack forming means across the glass substrate,

the crack forming means and the glass substrate exposing means being integrally moved by the actuating means.

36. The apparatus for cutting apart a glass substrate according to claim 35,

wherein the glass substrate exposing means is a cutting mechanism that shaves off and thereby removes portions of the deposited film, and has a roller disposed behind itself with respect to a traveling direction thereof, the roller being moved together with the glass substrate exposing means by the actuating means so as to roll on the strip-shaped regions on the glass substrate while pressing the strip-shaped regions, and,

when the crack forming means forms the cracks, the glass substrate is held on the workpiece stage by a composite force of a force with which the securing means secures the glass substrate on the workpiece stage, a force with which the glass substrate exposing means presses the glass substrate, and a force with which the roller, while rolling, presses the strip-shaped regions.

37. The apparatus for cutting apart a glass substrate according to claim 36,

wherein the crack forming means is a wheel cutter, and the roller is formed of a soft material and has substantially same shape and dimensions as the wheel cutter.

38. A liquid crystal panel composed of a pair of substrate cells bonded together with liquid crystal sealed in between and with polarizer plates bonded to outer surfaces of the substrate cells,

wherein at least one end of one of the substrate cells protrudes from at least one end of the other of the substrate cells so as to form a protruding portion, connection terminals by way of which the liquid crystal panel is driven is formed on an inner surface of the protruding portion, and the polarizing plate so extends as to cover an outer surface of the protruding portion.

39. The liquid crystal panel according to claim 38,

wherein edges of the polarizer plates are located 1 mm or less inward from edges of the substrate cells.

43. An apparatus for fabricating a liquid crystal panel, the apparatus fabricating a plurality of the liquid crystal panel according to claim 38 or 40 by cutting apart a glass substrate that has a plurality of pairs, arranged adjacent to one another, of glass substrate cells bonded together with liquid crystal sealed in between and that has polarizer plates bonded to both surfaces thereof, comprising:

glass substrate exposing means for removing strip-shaped portions of the polarizer plates so as to expose strip-shaped regions on the glass substrate; and

crack forming means for forming cracks so as to permit the glass substrate to be cut apart along the strip-shaped region exposed thereon by the glass substrate exposing means,

wherein the glass substrate is cut apart along the cracks.

44. The apparatus for fabricating a liquid crystal panel according to claim 43,

wherein the glass substrate exposing means is a laser radiating mechanism that irradiates the polarizer plates with a leaser beam.

45. The apparatus for fabricating a liquid crystal panel according to claim 44,

wherein the crack forming means is a gas spraying mechanism that sprays a rapid-cooling gas to the strip-shaped region on the glass substrate heated by being irradiated with the laser beam.

46. The apparatus for fabricating a liquid crystal panel according to claim 43,

wherein the glass substrate exposing means is a cutting mechanism that shaves off and thereby removes portions of the polarizer plates.

47. The apparatus for fabricating a liquid crystal panel according to claim 46,

wherein the cutting mechanism is composed of a blade that shaves off strip-shaped portions of the polarizer plates, the blade having a cutting edge having a substantially C-shaped, trapezoidal, semicircular, or circular cross section.

48. The apparatus for fabricating a liquid crystal panel according to claim 46,

wherein the cutting mechanism is composed of first and second blades that are arranged so as to face each other at a predetermined interval and that shaves off strip-shaped portions of the polarizer plates, and a third blade that is arranged between the first and second blades and that scrapes away from the glass substrate the strip-shaped portions of the polarizer plates shaved off by the first and second blades.

49. The apparatus for fabricating a liquid crystal panel according to claim 48,

wherein the predetermined interval is set in a range of from 1 to 3 mm.

50. The apparatus for fabricating a liquid crystal panel according to claim 48,

wherein the first and second blades are a pair of wheel cutters fitted integrally together coaxially, each having a cutting edge angle in arrange of from 30°

to 90°

.

51. The apparatus for fabricating a liquid crystal panel according to claim 50,

wherein the wheel cutters constituting the first and second blades have a diameter in a range of from 5 mm to 10 mm.

52. The apparatus for fabricating a liquid crystal panel according to claim 48 or 49,

wherein the first and second blades are both relatively movable only in a direction in which they shave the polarizer plates, and are each provided with a plurality of cutting edges having smaller and smaller cutting depths in the direction in which they shave the polarizer plates.

53. The apparatus for fabricating a liquid crystal panel according to claim 48,

wherein the first and second blades are so arranged that cutting edges thereof do not make contact with the glass substrate.

54. The apparatus for fabricating a liquid crystal panel according to claim 47,

wherein the blade constituting the cutting mechanism has a coating formed thereon so that removed portions of the polarizer plates do not adhere thereto.

55. The apparatus for fabricating a liquid crystal panel according to claim 47,

wherein the crack forming means is a wheel cutter.

56. The apparatus for fabricating a liquid crystal panel according to claim 55, further comprising:

an activating mechanism for selectively activating the glass substrate exposing means and the crack forming means.

57. The apparatus for fabricating a liquid crystal panel according to claim 56,

wherein the activating mechanism activates the glass substrate exposing means and the crack forming means in such an order that a path along which the blade constituting the cutting mechanism travels does not cross the cracks.

58. The apparatus for fabricating a liquid crystal panel according to claim 57,

wherein the activating mechanism first activates only the glass substrate exposing means to form a first group of the strip-shaped regions, then activates the glass substrate exposing means and the crack forming means in a direction perpendicular to the first group of the strip-shaped regions to form a second group of the strip-shaped regions and a first group of the cracks, and then activates only the crack forming means along the first group of the strip-shaped regions to form a second group of the crack.

40. A liquid crystal panel composed of a pair of substrate cells bonded together with liquid crystal sealed in between and with polarizer plates bonded to outer surfaces of the substrate cells,

wherein edges of the polarizer plates are so formed as to have a vertical section that becomes thinner and thinner toward the substrate cells.

41. The liquid crystal panel according to claim 40,

wherein the edges are inclined at an angle larger than 90°

but not larger than 135°

relative to the outer surfaces of the substrate cells.

42. The liquid crystal panel according to claim 41,

wherein removable protective films are laid on outer surfaces of the polarizer plates so as to be integral therewith.