Electrical circuit assembly with improved shock resistance

• US 20050056946A1
• Filed: 09/16/2003
• Published: 03/17/2005
• Est. Priority Date: 09/16/2003
• Status: Abandoned Application

• Current Assignee: Alent, Inc. (Element Solutions Inc)
• Original Assignee: Alent, Inc. (Element Solutions Inc)
• Inventors: Gilleo, Kenneth B.
• Application Number:
  US10/663,253
• Publication Number:
  US 20050056946A1
• Time in Patent Office: Days
• US Class Current: 257/783
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/17505 Bump connectors having different materials
• CPC Class Codes: H01L 2224/17517 including bump connectors providing primarily mechanical support
• CPC Class Codes: H01L 2224/811 the bump connector being supplied to the parts to be connected in the bonding apparatus
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/81862 Heat curing
• CPC Class Codes: H01L 2224/81906 Specific sequence of method steps
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83194 Lateral distribution of the layer connectors
• CPC Class Codes: H01L 2224/83856 Pre-cured adhesive, i.e. B-stage adhesive
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 2201/0129 : Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/0126 : Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• CPC Class Codes: H05K 2203/0545 : Pattern for applying drops or paste; Applying a pattern made of drops or paste using thick film techniques to apply conductive material by using a substrate with a shape pattern H05K3/1258
• CPC Class Codes: H05K 2203/176 : Removing, replacing or disconnecting component; Easily removable component thermal arrangements, e.g. to prevent overheating H05K1/0201
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

An assembly of the present invention includes a substrate and an integrated circuit device adapted to be electrically and mechanically attached to the substrate. Electrically conductive connecting elements between the device and the substrate electrically connect the device and the substrate. At least one adhesive body is positioned between the integrated circuit device and the substrate to form a mechanical connection between the circuit device and the substrate. The at least one adhesive body comprises a non-thermosetting material which, when heated, releases said mechanical connection to allow removal of the circuit device from the substrate.

Claims

1. An assembly comprising

a substrate,

an integrated circuit device adapted to be electrically and mechanically attached to the substrate,

electrically conductive connecting elements between the device and the substrate that electrically connect the device and the substrate, and

at least one adhesive body positioned between the integrated circuit device and the substrate to form a mechanical connection between the circuit device and the substrate,

said at least one adhesive body comprising a non-thermosetting material which, when heated, releases said mechanical connection to allow removal of the circuit device from the substrate.

2. The assembly as set forth in claim 1 wherein said non-thermosetting material comprises a thermoplastic polymer.

3. The assembly as set forth in claim 2 wherein said thermoplastic polymer has a bonding temperature of at least about 100 degrees Celsius.

4. The assembly as set forth in claim 2 wherein said thermoplastic polymer has a bonding temperature of less than about 300 degrees Celsius.

5. The assembly as set forth in claim 1 wherein said at least one adhesive body is positioned at a peripheral edge of the integrated circuit device.

6. The assembly as set forth in claim 5 wherein said circuit device has corners and the adhesive bodies are located at said corners.

7. The assembly as set forth in claim 1 wherein said at least one adhesive body has a substantially spherical shape.

8. The assembly as set forth in claim 1 wherein said at least one adhesive body comprises four adhesive bodies.

9. The assembly as set forth in claim 1 wherein said integrated circuit device is a chip package.

10. The assembly as set forth in claim 1 wherein said integrated circuit device is a multi-chip module.

11. The assembly as set forth in claim 1 wherein said integrated circuit device has a bottom surface with four corners and said at least one adhesive body is located approximately equidistant from adjacent corners in contact with the bottom surface of the circuit device.

12. An assembly comprising

a substrate,

an integrated circuit device adapted to be electrically and mechanically attached to the substrate,

electrically conductive connecting elements between the device and the substrate that electrically connect the device and the substrate, and

at least two adhesive bodies comprising a non-thermosetting material positioned between the integrated circuit device and the substrate to form a releasable mechanical connection between the circuit device and the substrate.

13. The assembly as set forth in claim 12 wherein said releasable mechanical connection is released by heating said adhesive bodies.

14. The assembly as set forth in claim 12 wherein said at least two adhesive bodies are spaced apart to form an open space between the adhesive bodies.

15. The assembly as set forth in claim 12 wherein said at least two adhesive bodies are positioned at a periphery of the integrated circuit device.

16. The assembly as set forth in claim 12 wherein said integrated circuit device has corners and the at least two adhesive bodies comprise four adhesive bodies positioned at said corners.

17. The assembly as set forth in claim 12 wherein said at least two adhesive bodies comprise a thermoplastic polymer.

18-24. -24. (Cancelled)