Apparatus and method for mounting or wiring semiconductor chips
First Claim
1. An apparatus for mounting semiconductor chips onto a substrate, whereby an adhesive layer is formed between the substrate and the semiconductor chip, comprising a camera, in an image of which the semiconductor chip and parts of the substrate surrounding the semiconductor chip are visible, a light source for producing and projecting a light grid consisting of at least two lines onto the substrate, whereby the lines of the light grid impinge obliquely on the substrate at a predetermined projection angle so that each of the lines of the light grid impinging on the semiconductor chip is offset on at least two edges of the semiconductor chip, and an image processing unit for calculating at least one parameter characterising the adhesive layer from the image delivered by the camera based on at least three offsets.
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Accused Products
Abstract
An apparatus for mounting semiconductor chips onto a substrate contains a measuring station for the contactless measurement of the height of the surface of the mounted semiconductor chip facing away from the substrate at a minimum of three locations. From this, at least one parameter is calculated that characterises the adhesive layer formed between the semiconductor chip and the substrate. A difference of the measured value to a set value is used to adjust the mounting process. An apparatus for wiring semiconductor chips also contains such a measuring station in order to determine the individual height of each connection point on the semiconductor chip. This information is used in order to lower the capillary to the respective connection point on the semiconductor chip in the shortest possible time.
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Citations
7 Claims
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1. An apparatus for mounting semiconductor chips onto a substrate, whereby an adhesive layer is formed between the substrate and the semiconductor chip, comprising
a camera, in an image of which the semiconductor chip and parts of the substrate surrounding the semiconductor chip are visible, a light source for producing and projecting a light grid consisting of at least two lines onto the substrate, whereby the lines of the light grid impinge obliquely on the substrate at a predetermined projection angle so that each of the lines of the light grid impinging on the semiconductor chip is offset on at least two edges of the semiconductor chip, and an image processing unit for calculating at least one parameter characterising the adhesive layer from the image delivered by the camera based on at least three offsets.
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3. An apparatus for wiring a semiconductor chip mounted on a substrate, comprising
a camera in an image of which the semiconductor chip and parts of the substrate surrounding the semiconductor chip are visible, a light source for producing and projecting a light grid consisting of at least two lines onto the substrate, whereby the lines of the light grid impinge obliquely on the substrate at a predetermined projection angle so that each of the lines of the light grid impinging on the semiconductor chip is offset on at least two edges of the semiconductor chip, and an image processing unit for calculating an individual height of each connection point on the semiconductor chip from the image delivered by the camera based on at least three offsets.
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4. A method for mounting a semiconductor chip onto a substrate, wherein at least one parameter is determined that characterises an adhesive layer that is formed between a substrate and a semiconductor chip mounted on the substrate in accordance with the following steps:
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Projection of a light grid comprising at least two lines onto the substrate with the semiconductor chip, whereby the lines of the light grid impinge obliquely on the substrate so that each of the lines of the light grid impinging on the semiconductor chip is offset on at least two edges of the semiconductor chip, Recording an image of the semiconductor chip and parts of the substrate surrounding the semiconductor chip, and Calculating the at least one parameter based on at least three offsets of the lines of the light grid on the at least two edges of the semiconductor chip. - View Dependent Claims (5, 6)
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7. A method for wiring a semiconductor chip mounted on a substrate, whereby first connection points on the semiconductor chip are connected to second connection points on the substrate by means of a wire, comprising the following steps:
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Projection of a light grid comprising at least two lines onto the substrate with the semiconductor chip, whereby the lines of the light grid impinge obliquely on the substrate so that each of the lines of the light grid impinging on the semiconductor chip is offset on at least two edges of the semiconductor chip, Recording an image of the semiconductor chip and parts of the substrate surrounding the semiconductor chip, Calculating an individual height of each connection point on the semiconductor chip based on at least three offsets of the lines of the light grid on at least two edges of the semiconductor chip, and Wiring the first connection points on the semiconductor chip to the second connection points on the substrate under consideration of the individual heights of the connection points on the semiconductor chip.
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Specification