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Moisture-resistant electronic device package and methods of assembly

  • US 20050057883A1
  • Filed: 09/16/2003
  • Published: 03/17/2005
  • Est. Priority Date: 09/16/2003
  • Status: Active Grant
First Claim
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1. An electronic device package comprising:

  • a substrate having a first surface, an opposing second surface, and a plurality of edge surfaces extending between the first surface and the second surface around a perimeter of the substrate;

    at least one contact pad on the first surface of the substrate;

    at least one attachment pad on the second surface of the substrate;

    at least one conductive element electrically connecting the at least one contact pad and the at least one attachment pad; and

    a housing structure disposed on the substrate and comprising a plurality of raised sidewalls extending along the perimeter of the substrate defining a cavity in the housing structure, wherein the cavity faces away from the substrate, and the housing structure extends across a bottom surface of the cavity to cover substantially all of the first surface of the substrate and includes at least one aperture in the bottom surface of the cavity exposing the at least one contact pad through the housing structure.

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