Porous retroreflection suppression plates, optical isolators and method of fabricating same

• US 20050058414A1
• Filed: 08/23/2004
• Published: 03/17/2005
• Est. Priority Date: 08/21/2003
• Status: Abandoned Application

• Current Assignee: Lake Shore Cryotronics, Inc.
• Original Assignee: Lake Shore Cryotronics, Inc.
• Inventors: Kochergin, Vladimir
• Application Number:
  US10/923,076
• Publication Number:
  US 20050058414A1
• Time in Patent Office: Days
• US Class Current: 385/120
• CPC Class Codes: G02B 5/0236 the diffusion taking place within the volume of the element
• CPC Class Codes: G02B 5/0278 used in transmission
• CPC Class Codes: G02B 5/0284 used in reflection
• CPC Class Codes: G02B 6/00 Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
• CPC Class Codes: G02B 6/0001 specially adapted for lighting devices or systems lighting or signalling on vehicles using light guides B60Q1/00; lighting devices for vehicle dashboards B60Q3/10; lighting devices for vehicle interior using light guides B60Q3/62; lighting devices mounted on the vehicle rear part using light guides F21S43/235; measuring arrangements having light conducting pointers G01D13/265; illumination of liquid crystal displays G02F1/1336; illuminated signs G09F13/00
• CPC Class Codes: G02B 6/4207 with optical elements reducing the sensitivity to optical feedback anti-reflection devices specially adapted for lasers, see H01S3/0064

Abstract

A plate having leaky waveguides defined therethrough can be used for retroreflection suppression and/or light diffusing/optical isolation. Such designs can exhibit good performance over a wider range of wavelengths and angles of the incident light than current art optical components.

Claims

1. A light scattering plate comprising:

a substrate or host wafer having a first and a second surface and further including plural substantially uniform, parallel, uncoupled leaky waveguides defined at least partially therethrough, the plural leaky waveguides defining axes that are substantially perpendicular to the wafer first surface, the plural leaky waveguides each supporting at least one waveguide mode in a predetermined spectral range

2. A light scattering plate of claim 1 wherein said host wafer at least partially comprises porous semiconductor material, said pores in the semiconductor host serving as leaky waveguides while the host semiconductor material optically and physically separates neighboring leaky waveguides.

3. A light scattering plate of claim 2 wherein said semiconductor material is macroporous silicon.

4. A light scattering plate of claim 1, wherein the wafer has a thickness of from about 10 to about 5000 times the characteristic lateral dimension of the leaky waveguides.

5. A light scattering plate of claim 1 wherein at least one layer of highly reflective material is made to coat the leaky waveguide walls.

6. A light scattering plate of claim 5, wherein the said at least one layer of the reflective leaky waveguide wall coating is made of a metal.

7. A light scattering plate of claim 1, wherein centers of said leaky waveguides are spaced apart by a distance in the range of 0.5 μ

m to 30 μ

m, said distance being more than the smallest lateral dimension of said leaky waveguides.

8. A light scattering plate of claim 1, wherein said leaky waveguides are spatially disordered in the plane of said wafer.

9. A light scattering plate of claim 1, wherein said leaky waveguides are disposed in a pattern that has a complex order having complex symmetry.

10. A light scattering plate of claim 1, wherein said leaky waveguides have at least one end tapered near a first or second wafer surface.

11. A light scattering plate of claim 10 wherein said tapering is created such that the leaky waveguide cross section is gradually increased when approaching said waveguide end with the rate of increase being in the range of 1 to 55 degrees with respect to the leaky waveguide axis.

12. A light scattering plate of claim 1 wherein said wafer is disposed between two plates of material that are transparent in a predetermined spectral range.

13. A light scattering plate of claim 1 wherein said host wafer at least partially comprises porous semiconductor material, with pore walls coated by a substantially transparent material, said coated pores comprise the cores of said leaky waveguides and said semiconductor material between the pores optically and physically separates neighbor leaky waveguides.

14. A light scattering plate of claim 13 wherein said pore wall coating is comprised of multilayer of materials of differing indices of refraction.

15. A light scattering plate of claim 1 wherein said plate serves to suppress retroreflection of light from optical system over a broad spectral range.

16. A light scattering plate of claim 15 wherein said plate is disposed contiguous to an optical detection means.

17. A light scattering plate of claim 1 wherein said plate serves as a light diffuser in a transmission mode.

18. A light scattering plate of claim 17 wherein and said diffuser provides substantially uniform scattering of light over a range of angles within the numerical aperture of the leaky waveguides.

19. A light scattering plate of claim 17 wherein said leaky waveguides have both ends tapered to maximize the transmission through said light diffusing element.

20. An optical isolation component for transmitting light propagating in a first direction and absorbing light propagating in the opposite direction, within at least some spectral band comprising:

a substrate or host wafer having a first and a second surface and further including plural, substantially uniform, parallel, uncoupled leaky waveguides defined at least partially therethrough, the plural leaky waveguides having axes that are substantially perpendicular to the wafer first surface, the plural leaky waveguides each supporting at least one waveguide mode in a predetermined spectral range, the plural waveguides having coherently asymmetrically modulated cross-sections along the directions of the axes over at least some part of the length of said waveguides.

21. An optical isolation component of claim 20 wherein said host wafer at least partially comprises porous semiconductor material, said pores in the semiconductor host serving as leaky waveguides while the host semiconductor material optically and physically separates neighboring leaky waveguides.

22. An optical isolation component of claim 21 wherein said semiconductor material is macroporous silicon.

23. An optical isolation component of claim 22 wherein said semiconductor material is porous III-V compound semiconductor.

24. An optical isolation component of claim 23 wherein said porous Ill-V compound semiconductor is chosen from the group consisting of porous GaAs and porous, InP.

25. An optical isolation component of claim 20, wherein the wafer has a thickness of from about 10 to about 5000 times the characteristic lateral dimension of the leaky waveguides.

26. An optical isolation component of claim 20 wherein at least one layer of metal is made to coat the leaky waveguide walls.

27. An optical isolation component of claim 26 wherein said metal is chosen from the group consisting of Au, Ag, Al and Cu.

28. An optical isolation component of claim 26 wherein at least one layer of transparent dielectric material is disposed over the metal layer coating the leaky waveguide walls.

29. An optical isolation component of claim 20, wherein centers of said leaky waveguides are placed apart by a distance in the range of 0.5 μ

m to 30 μ

m, said distance being more than the smallest lateral dimension of said leaky waveguides.

30. An optical isolation component of claim 20, wherein said leaky waveguides are spatially ordered in the plane of said wafer.

31. An optical isolation component of claim 30, wherein said symmetry is hexagonal symmetry.

32. An optical isolation component of claim 30, wherein said symmetry is cubic symmetry.

33. An optical isolation component of claim 30, wherein said leaky waveguides are disposed such that the leaky waveguide pattern has a complex order having complex symmetry.

34. An optical isolation component of claim 20, wherein said leaky waveguides have at least one end tapered at one wafer first or second surface.

35. An optical isolation component of claim 34 wherein said tapering is created such that the leaky waveguide cross section is gradually increased when approaching said leaky waveguide end with the rate of increase being in the range of 1 to 55 degrees with respect to the leaky waveguide axis.

36. An optical isolation component of claim 20, wherein said asymmetrical modulation is made in the form of saw-tooth.

37. An optical isolation component of claim 20, wherein said leaky waveguide cross-section modulation is periodic, with a period from about 50 nm to about 20 μ

m.

38. An optical isolation component of claim 20, wherein said leaky waveguide cross section modulation is a superposition of two or more periodic modulations, each modulation with a period from about 50 nm to about 20 μ

m.

39. An optical isolation component of claim 20, wherein said modulation is quasi-periodic with the period changing along the depth of said leaky waveguides in a predetermined fashion.

40. An optical isolation component of claim 20, wherein said leaky waveguides have more than one length segment of modulation along their depth.

41. An optical isolation component of claim 20 wherein said wafer is disposed between two plates of materials that are transparent in a predetermined spectral range.

42. A method of making a light scattering plate comprising:

providing a substrate wafer of (100)-oriented single-crystal silicon having a first surface and a second surface,

electrochemically etching the substrate wafer to produce a structured layer having pores with controlled depths defined at least partially therethrough,

removing at least one un-etched portion of the substrate wafer, and

coating the pore walls with at least one metal layer, said material having a thickness of at least 10 nm.

43. The method of claim 42 further including the method of providing the first surface of the substrate wafer, prior to electrochemical etching, with a surface topology that defines the cross-sectional shape, arrangement and location of the pores to be formed during etching.

44. The method of claim 43, wherein said surface topology is composed of depressions on the first surface of substrate wafer.

45. The method of claim 43, wherein said surface topology is produced by:

disposing upon said wafer surface at least one layer of a material with different chemical properties than those of said substrate wafer material, by producing a photoresist mask on the surface of said layer, by etching away the said layer material inside said photoresist mask openings, by further etching the wafer surface through said formed openings in said disposed chemically different material and by further removal of said chemically different layer from the first surface of the wafer after the formation of said surface topology.

46. The method of claim 42 wherein said etching is obtained by electrochemical means and includes connecting the substrate as an electrode, contacting the first surface of the substrate with an fluoride-containing, acidic electrolyte, setting a current density that will influence etching erosion, and continuing etching to form said pores extending to a desired depth substantially perpendicular to said first surface.

47. The method of claim 46, wherein said electrolyte contains hydrofluoric acid in a range of 1% to 50% by volume.

48. The method of claim 42, wherein said silicon wafer is an n-type doped wafer and electrochemical etching includes illuminating a second surface of the substrate wafer that lies opposite the first surface during electrochemical etching.

49. The method of claim 42, wherein said silicon wafer is a p-type doped wafer and electrochemical etching occurs in an electrolyte additionally containing at least one organic additive selected from the group consisted of acetonitrile, dimethylformamide, dimethylsulfoxide, diethyleneglycol, formamide, hexamethylphosphoric triamide, isopropanol, triethanolamine, 2-methoxyethyl ether, triethylphosphite, and triethyleneglycol dimethyl ether.

50. The method of claim 42, wherein removal of the unwanted, unetched remainder of the wafer comprises a step selected from the group consisting of Reactive Ion Etching, chemical etching, and mechanical or chemical-mechanical polishing.

51. The method of claim 42, wherein said at least one metal layer is deposited by an atomic layer deposition technique.

52. The method of claim 42, further including substantially filling the pores with a transparent material after coating the pore walls with a said at least one layer of metal.

53. The method of claim 42 further including sealing said light scattering plate with two flat plates of materials that are transparent within the transparency range of said light scattering plate.

54. A method of making an optical isolation component comprising:

providing a semiconductor wafer substrate having a first surface and a second surface,

electrochemically etching the substrate wafer to produce a structured layer having pores with controlled depths and coherently, modulated diameters defined at least partially therethrough, and

coating the pores with at least one metal layer, said metal layer having a thickness of at least 10 nm.

55. The method of claim 54 further including a step prior to electrochemical etching of providing the first surface of the substrate wafer with a surface topology that defines the cross-sectional shape, arrangement and location of the pores to be formed during etching.

56. The method of claim 55, wherein said surface topology is composed of depressions on the first surface of substrate wafer.

57. The method of claim 55, wherein said surface topology is produced by:

disposing on the first surface of substrate wafer a layer of material with different chemical properties than those of the wafer material, by producing a photoresist mask on the surface of said layer, by etching away the said layer material inside the photoresist mask openings, by etching the wafer surface through the openings formed in said disposed chemically different material and by the removal of said chemically different layer from the first surface of the wafer after forming said surface topology.

58. The method of claim 54 wherein said etching is by electrochemical means and includes connecting the substrate as an electrode, contacting the first surface of the substrate with an acidic electrolyte, setting a current density that will influence etching erosion, and continuing etching to form said pores extending to a desired depth substantially perpendicular to said first surface.

59. The method of claim 57, wherein said substrate wafer is (100) oriented silicon and said electrolyte contains hydrofluoric acid in a range of 1% to 50% by volume.

60. The method of claim 59, wherein said silicon wafer is an n-type doped wafer and electrochemical etching includes illuminating a second surface of the substrate wafer that lies opposite the first surface during electrochemical etching.

61. The method of claim 59, wherein said silicon wafer is a p-type doped wafer and electrochemical etching occurs in an electrolyte additionally containing at least one organic additive selected from the group consisted of acetonitrile, dimethylformamide, dimethylsulfoxide, diethyleneglycol, formamide, hexamethylphosphoric triamide, isopropanol, triethanolamine, 2-methoxyethyl ether, triethylphosphite, and triethyleneglycol dimethyl ether.

62. The method of claim 54 wherein said substrate wafer is of a III-V compound semiconductor material.

63. The method of claim 54, wherein at least one electrochemical etching parameter selected from the group consisting of electrical current density, electrolyte temperature and/or applied voltage is changed in a predetermined fashion with time during the electrochemical etching process to provide the desired pore diameter modulation.

64. The method of claim 54, wherein said at least one metal layer is deposited by an atomic layer deposition technique.

65. The method of claim 55, further including coating the pore walls with at least one transparent material after coating the pores with a said at least one layer of metal.

66. The method of claim 65 wherein said coating is accomplished by a process selected from the group consisting of Chemical Vapor Deposition and Atomic Layer Deposition, electroplating and electroless plating.

67. The method of claim 54 further including sealing said optical isolation component with two flat plates of materials that are transparent within the transparency range of said optical isolation component.