Method for making a microstructure by surface micromachining

• US 20050059184A1
• Filed: 06/29/2004
• Published: 03/17/2005
• Est. Priority Date: 04/23/2001
• Status: Abandoned Application

• Current Assignee: MEMX, Inc. (Lumentum Holdings Inc.)
• Original Assignee: MEMX, Inc. (Lumentum Holdings Inc.)
• Inventors: Sniegowski, Jeffry J., Rodgers, M. Steven
• Application Number:
  US10/879,496
• Publication Number:
  US 20050059184A1
• Time in Patent Office: Days
• US Class Current: 438/48
• CPC Class Codes: B81C 1/00547 Etching processes not provided for in groups B81C1/00531 - B81C1/00539
• CPC Class Codes: H01L 21/302 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Abstract

Various methods for forming surface micromachined microstructures are disclosed. One aspect relates to executing surface micromachining operation to structurally reinforce at least one structural layer in a microstructure. Another aspect relates to executing the surface micromachining operation to form a plurality of at least generally laterally extending etch release channels within a sacrificial material to facilitate the release of the corresponding microstructure.

Claims

1-66. -66. Canceled

67. A method for making a surface micromachined microstructure, comprising the steps of:

forming a first sacrificial layer over a first substrate, wherein said first substrate comprises an upper surface that extends in a lateral dimension;

forming a plurality of conduits that are hollow, embedded, have a closed perimeter that is defined at least in part by said first sacrificial layer, and extend in said lateral dimension;

forming a first structural layer over said first sacrificial layer and after said forming a first sacrificial layer step, wherein said first structural layer extends in said lateral dimension and comprises a first perimeter that defines a lateral extent of said first structural layer, wherein said plurality of conduits extend in said lateral dimension underneath said first structural layer such that said first structural layer overlies said plurality of conduits; and

removing said first sacrificial layer after said forming a first structural layer step, wherein said removing step comprises flowing an etchant within at least some of said plurality of conduits, and wherein said forming a plurality of conduits step is completed before said forming a first structural layer step.