Heat sink structure

• US 20050061475A1
• Filed: 09/02/2004
• Published: 03/24/2005
• Est. Priority Date: 09/18/2003
• Status: Active Grant

• Current Assignee: Chicony Power Technology Co. Ltd. (Chicony Electronics Company Limited)
• Original Assignee: Hipro Electronics Company Limited (Chicony Electronics Company Limited)
• Inventors: Wang, Chia Hua
• Granted Patent: US 7,165,602 B2
• Time in Patent Office: Days
• US Class Current: 165/80.200
• CPC Class Codes: H05K 7/20518 Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots

Abstract

The present invention provides a heat sink structure, which includes: a housing located on a material with low thermal conductivity; and a heat conductor placed inside the housing. At least one air gap is formed between the heat conductor and the housing to reduce the conductivity from the heat conductor to the housing, and thus increasing the thermal resistance between the heat conductor and the housing. The surface temperature of the bottom of the housing thus could be reduced and averaged, so as to effectively improve the lifespan, the safety and reliability of a device with the heat sink structure.

Claims

1. A heat sink structure, including:

a housing; and

a heat conductor located inside said housing, and at least one air gap formed between said heat conductor and said housing.

2. The heat sink structure of claim 1, wherein said housing is located on a material with low thermal conductivity.

3. The heat sink structure of claim 2, wherein the material with low thermal conductivity is a material of wood, carpet or material for clothing.

4. The heat sink structure of claim 1, wherein said heat conductor is configured with a hollow flange associated with said housing with a flat bottom to form an air gap between said heat conductor and said housing.

5. The heat sink structure of claim 1, wherein said heat conductor is associated with said housing having an integrated shoulder to form an air gap between said heat conductor and said housing.

6. The heat sink structure of claim 1, wherein said heat conductor is associated with said housing having an integrated flange to form an air gap between said heat conductor and said housing.

7. The heat sink structure of claim 1, wherein the material of said heat conductor is a material with good thermal conductivity.

8. The heat sink structure of claim 7, wherein the material of said heat conductor is Copper or Aluminum.

9. The heat sink structure of claim 1, wherein the air gap is a material with low thermal conductivity, such as foam, vesicant material.

10. The heat sink structure of claim 5, wherein the material of said shoulder is a material of plastic or metal.

11. A heat sink structure, including:

a housing; and

a heat conductor configured with a flange;

wherein by overlapping said flange of said heat conductor on said housing to form at least one air gap therebetween.

12. The heat sink structure of claim 11, wherein the material of said heat conductor is a material with good thermal conductivity.

13. The heat sink structure of claim 12, wherein the material of said heat conductor is Aluminum or Copper.

14. The heat sink structure of claim 11, wherein the air gap is a material with low thermal conductivity, such as foam, vesicant material.

15. A heat sink structure, including:

a housing;

a first heat conductor; and

a second heat conductor with a hollow body, and said second heat conductor configured on the periphery of the bottom of said housing;

wherein by overlapping said first heat conductor on said second heat conductor to form at least one air gap therebetween.

16. The heat sink structure of claim 15, wherein the material of said first heat conductor and said second heat conductor is a material with good thermal conductivity.

17. The heat sink structure of claim 16, wherein the material of said first heat conductor and said second heat conductor is Aluminum or Copper.

18. The heat sink structure of claim 15, wherein the air gap is a material with low thermal conductivity, such as foam, vesicant material.