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Molded chip fabrication method and apparatus

  • US 20050062140A1
  • Filed: 09/18/2003
  • Published: 03/24/2005
  • Est. Priority Date: 09/18/2003
  • Status: Active Grant
First Claim
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1. An apparatus for coating a plurality of semiconductor devices, comprising:

  • a mold housing comprising a formation cavity arranged to hold semiconductor devices, said formation cavity further arranged so that a coating material can be introduced into said formation cavity, said coating material at least partially covering said semiconductor devices.

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