High density integrated circuit apparatus, test probe and methods of use thereof

• US 20050062492A1
• Filed: 04/04/2003
• Published: 03/24/2005
• Est. Priority Date: 08/03/2001
• Status: Abandoned Application

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Lauro, Paul Alfred, Shih, Da-Yuan, Walker, George Frederick, Fogel, Keith Edward, Beaman, Brian Samuel, Norcott, Maurice Heathcote
• Application Number:
  US10/408,200
• Publication Number:
  US 20050062492A1
• Time in Patent Office: Days
• US Class Current: 324/754.70
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/0675 Needle-like
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
• CPC Class Codes: G01R 1/0735 arranged on a flexible frame or film
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips

Abstract

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

Claims

1-62. -62. (canceled)

63. An assembly including an electronic component, the electronic component comprising:

a plurality of contact locations adjacent a surface of the electronic component,

a plurality of electrical conductors, each electrical conductors comprising,

a first end on the component that is at a position adjacent the surface of the electronic component but fanned out from a corresponding contact location,

a compliant elongated electrical conductor positioned at the first end of the electrical conductor,

an electrical connection between the corresponding terminal and the first end,

where the compliant elongated electrical conductor is free standing, having a first end fixed adjacent to the electronic component and having a second end at a position not adjacent the electronic component,

where the compliant elongated electrical conductor can be displaced such that the second end thereof moves in relation to the first end of the compliant contact structure, and

the assembly including an active semiconductor device connected to function at least in part by communication of electrical energy through at least one of the contact elements.

64. The assembly of claim 63, wherein the electronic component comprises a silicon substrate.

65. The assembly of claim 63, wherein the electronic component is mated directly with an active semiconductor device.

66. The assembly of claim 65, wherein the electronic component is a socket mated directly with and to securely connect to an active semiconductor device.

67-91. -91. (canceled)

92. An assembly comprising:

an electronic component;

said electronic component comprising a substrate;

said substrate has a surface;

a plurality of contact locations at said surface;

a fanout member;

said fanout member comprises an electrical conductor comprising a contact location end and a fanout location end;

said contact location end is electrically connected to at least one of said plurality of contact locations at said surface;

said fanout location end is displace relative to said at least one of said plurality of contact locations;

an elongated electrical conductor comprising a first end and a second end;

said first end of said elongated electrical conductor is electrically connected to said fanout location end;

said second end of said elongated electrical conductor is not adjacent said electronic component;

said elongated electrical conductor is free standing;

said elongated electrical conductor is compliant and can be displaced so that said second end thereof moves in relation to the first end of said elongated electrical conductor; and

said assembly including an active semiconductor device connected to function by communication of electrical power through at least one said elongated electrical conductors.

93. The assembly according to claim 92, wherein said elongated electrical conductor has a coating.

94. The assembly according to claim 93, wherein said coating is selected from the groups consisting of Au, Cr, Co, Ni and Pd.

95. The assembly according to claim 92, wherein said elongated electrical conductor comprises a material selected from the group consisting of gold, aluminum, copper, nickel, palladium, gold alloy and copper alloy.

96. The assembly according to claim 92, wherein said fanout member comprises a thin film wiring structure.

97. The assembly according to claim 92, wherein said fanout member is a space transformer substrate.

98. An assembly comprising:

an electronic component;

said electronic component comprising a substrate;

said substrate has a surface;

a plurality of contact locations at said surface;

a fanout member;

said fanout member comprises an electrical conductor comprising a contact location end and a fanout location end;

said contact location end is electrically connected to at least one of said plurality of contact locations at said surface;

said fanout location end is displace relative to said at least one of said plurality of contact locations;

an elongated electrical conductor comprising a first end and a second end;

said first end of said elongated electrical conductor is electrically connected to said fanout location end;

said second end of said elongated electrical conductor is not adjacent said electronic component;

said elongated electrical conductor is free standing; and

said elongated electrical conductor is compliant and can be displaced so that said second end thereof moves in relation to the first end of said elongated electrical conductor.

99-105. -105. (canceled)

106. A semiconductor assembly comprising:

an assembly substrate;

at least one semiconductor die; and

a plurality of free standing elongate flexible interconnection elements located between the die and the assembly substrate, each having a first portion contacting the assembly substrate and a second portion contacting the semiconductor die, each elongate flexible interconnection element extends from one of the semiconductor die and the assembly substrate, whereafter the elongate flexible interconnection element alters direction at least once, and each elongate flexible interconnection element includes an elongate flexible element of a first material, and a second material on the elongate flexible element wherein the elongate flexible element with the second material thereon is compliant.

107. The semiconductor assembly of claim 106, wherein the substrate has a first set of contact pads and the semiconductor die has a second set of contact pads and each elongate flexible interconnection element has a first portion contacting a respective contact pad of the first set of contact pads, and a second portion contacting a respective contact pad of the second set of contact pads.

108. The semiconductor assembly of claim 106, wherein the elongate flexible interconnection element has a portion permanently attached to the assembly substrate.

136. The semiconductor assembly of claim 106, wherein said assembly is a probe for a semiconductor device.

137. The semiconductor assembly of claim 106, wherein said assembly is a connector for a semiconductor device.

140. The semiconductor assembly of claim 106, wherein said structure is a probe for a semiconductor device.

141. The semiconductor assembly of claim 106, wherein said structure is a connector for a semiconductor device.

109. An electronic assembly comprising:

a first substrate having a first set of contact pads;

a second substrate having a second set of contact pads; and

a plurality of elongate flexible interconnection elements located between the first substrate and the second substrate, each being free standing and having a portion permanently attached to a respective contact pad of the first set of contact pads and a second portion contacting a respective contact pad of the second set of contact pads, each elongate flexible interconnection element extending from the first substrate, whereafter the elongated flexible interconnection element alters direction at least once, each elongated flexible interconnection element including an elongated flexible element of a first material, and a second material on the elongated flexible element wherein the elongate flexible element with the second material thereon is compliant, the first and second substrates being brought into fixed relationship relative to one another.

110. The electronic assembly of claim 109, wherein one of the substrates comprises a material selected from the group consisting of a semiconductor die, a printed circuit board, a plastic substrate, a ceramic substrate, and a polymer based substrate.

111. The electronic assembly of claim 109, wherein one of the substrates is a semiconductor die.

112. The electronic assembly of claim 109, wherein the second substrate is a semiconductor die.

113. The electronic assembly of claim 109, wherein, for each interconnection element of a first plurality of the free standing interconnection elements, a contact region distant from the substrate on a given interconnection element is substantially in a common plane with corresponding contact regions of the first plurality of interconnection elements.

114. The electronic assembly of claim 109, wherein the elongated flexible element has a portion connected to a respective terminal of the first set of contact pads.

115. The electronic assembly of claim 114, wherein an end of the elongate flexible element is connected to the respective terminal.

116. The electronic assembly of claim 109, wherein the second material passivates of the interconnection element.

117. The electronic assembly of claim 109, wherein the first material includes a material selected from the group consisting of gold, aluminum, copper, nickel, palladium, gold alloy and copper alloy.

118. The electronic assembly of claim 109, wherein the first material includes a material selected from the group consisting of gold, aluminum and copper.

119. The electronic assembly of claim 109, wherein the elongate flexible element has a cross-dimension of between 0.001 and 0.005 inches.

120. The electronic assembly of claim 109, wherein the elongate flexible element is a wire.

121. The electronic assembly of claim 109, wherein the second material is connected to the respective terminal.

122. The electronic assembly of claim 109, wherein the second material is stronger than the elongate flexible element.

123. The electronic assembly of claim 109, wherein the second material is a coating which is deposited around the elongate flexible element.

124. The electronic assembly of claim 109, wherein the second material comprises a material selected from the group consisting of nickel, cobalt, copper, gold, platinum and palladium.

125. The electronic assembly of claim 109, wherein the second material comprises a material selected from the group consisting of nickel and cobalt.

126. The electronic assembly of claim 109, wherein the second material is a thin layer.

127. The electronic assembly of claim 109, wherein the second material is selected from the group consisting of an electroplated, electrolessly plated, sputtered and e-beam evaporated coating.

128. The electronic assembly of claim 109, wherein the elongate flexible element has a cross-dimension of between 0.001 and 0.005 inches and the second material is a thin layer.

129. The electronic assembly of claim 109, wherein the first material and the second material are both conductive.

130. The electronic assembly of claim 129, wherein the second material is formed directly on the elongate element.

131. The electronic assembly of claim 109, wherein the first material comprises a material selected from the group consisting of gold, gold alloy, copper, copper alloy, aluminum, nickel and the second material is selected from the group consisting of Au, Cr, Co, Ni and Pd.

132. The electronic assembly of claim 109, wherein the first material includes a material selected from the group consisting of gold, aluminum and copper, and the second material includes a material selected from the group consisting of nickel and cobalt.

133. The electronic assembly of claim 109, wherein the elongate flexible element is a core element and the second material is located around the core element.

138. The semiconductor assembly of claim 109, wherein said assembly is a probe for a semiconductor device.

139. The semiconductor assembly of claim 109, wherein said assembly is a connector for a semiconductor device.

142. The semiconductor assembly of claim 109, wherein said structure is a probe for a semiconductor device.

143. The semiconductor assembly of claim 109, wherein said structure is a connector for a semiconductor device.

134. A structure comprising:

an assembly substrate;

at least one semiconductor die; and

a plurality of free standing elongate flexible interconnection elements located between the die and the assembly substrate, each having a first portion contacting the assembly substrate and a second portion contacting the semiconductor die, each elongate flexible interconnection element extends from one of the semiconductor die and the assembly substrate, whereafter the elongate flexible interconnection element alters direction at least once, and each elongate flexible interconnection element includes an elongate flexible element of a first material, and a second material on the elongate flexible element wherein the elongate flexible element with the second material thereon is compliant.

135. A structure comprising:

a first substrate having a first set of contact pads;

a second substrate having a second set of contact pads; and

a plurality of elongate flexible interconnection elements located between the first substrate and the second substrate, each being free standing and having a portion permanently attached to a respective contact pad of the first set of contact pads and a second portion contacting a respective contact pad of the second set of contact pads, each elongate flexible interconnection element extending from the first substrate, whereafter the elongate flexible interconnection element alters direction at least once, each elongate flexible interconnection element including an elongate flexible element of a first material, and a second material on the elongate flexible element wherein the elongate flexible element with the second material thereon is compliant, the first and second substrates being brought into fixed relationship relative to one another.

144. A semiconductor device comprising:

a silicon body having a plurality of contact locations;

a plurality of free-standing elongated electrical conductors, each of the elongated electrical conductors having a first end, a second end, and a compliant section between the first end and the second end, selected ones of the free-standing elongated electrical conductors each mounted by a first end thereof to and extending from a respective selected one of the contact locations and the respective compliant section thereof flexing against compliant action when a force is applied to the respective second end thereof and to compliantly respond when the force is relieved; and

the second ends of the elongated electrical conductors are at an angle with respect to said first end and the contact location, the angle being between a minimum and a maximum value.

145. A semiconductor device, according to claim 144, wherein:

the elongated electrical conductors having a second end at an angle with respect to the first end have a bend to accommodate the angle between the minimum and maximum angle.

146. A semiconductor device, according to claim 145, wherein:

the contact locations are disposed a first distance apart;

the second ends of the elongated electrical conductors are disposed at a second distance apart; and

the second distance is determined by the angle.

147. A semiconductor device, according to claim 146, wherein:

the first distance is approximately 5 mils.

148. A semiconductor device, according to claim 145, further comprising:

a dielectric material extending over a surface of the silicon body and enveloping a portion of the elongated electrical conductors.

149. A semiconductor device, according to claim 145, wherein:

the silicon body is covered by an electrically insulating coating having holes and comprises electrically conductive throughholes and electrical conductors electrically connected to the contact locations.

150. A semiconductor device, according to claim 145, further comprising:

metallization covering the elongated electrical conductors.

151. A semiconductor device, according to claim 145, wherein:

the elongated electrical conductors are composite structures.

152. A semiconductor device, according to claim 145, wherein:

the contact structures are resilient contact structures.

172. A semiconductor device according to any one of claims 144, 163, 164, 165 or 166, wherein the minimum value is 5 degrees and the maximum value is 60 degrees.

173. A semiconductor device according to any one of claims 144, 163, 164, 165 or 166, wherein as a result of the angle being between the minimum and the maximum values, the second ends are at a spacing different than the spacing of the first ends.

189. A semiconductor structure according to anyone of claims 144, 163, 164, 165 or 166, wherein the angle is nonorthogonal to the contact location.

153. An electronic assembly comprising:

a substrate having a plurality of contact locations on the one side thereof; and

a plurality of resilient, elongated electrical conductors, wherein;

(i) each elongated electrical conductor has a first end attached to a respective one of the contact locations, and a second end, distant from the substrate, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value and the first end of a first of the elongated electrical conductors is spaced from the first end of a second, adjacent one of the elongated electrical conductors by a first distance and the second end of the first elongated electrical conductor is spaced from the second end of the second elongated electrical conductor by a second distance which is determined by the angles corresponding to the first and second elongated electrical conductors; and

(ii) each elongated conductor comprises a flexible elongated element, and a second material on the flexible elongated element, the flexible elongated element having a first composition and the second material having a second composition which is different from the first composition.

154. The electronic assembly of claim 153, wherein the first composition comprises a material selected from the group consisting of gold, aluminum, copper, nickel, platinum, gold alloy, copper alloy and palladium.

155. The electronic assembly of claim 153, wherein the first material comprises gold.

156. The electronic assembly of claim 153, wherein the second material is selected from the group consisting of Au, Cr, Co, Ni and Pd.

157. The electronic assembly of claim 153, wherein at least one layer of the second material is selected from the group consisting of nickel and cobalt.

158. The electronic assembly of claim 153, wherein the flexible elongated electrical conductor has disposed thereon the second material.

159. The electronic assembly of claim 153, wherein the second material is selected from the group consisting of an electroless plated coating, an e-beam deposited coating, a sputter deposited coating and an electroplated coating.

174. An electronic assembly according to anyone of claims 153, 160, 162, 168, 169, 170 or 171, wherein the minimum value is 5 degrees and the maximum value is 60 degrees.

175. An electronic assembly according to anyone of claims 153, 160, 162, 168, 169, 170 or 171, wherein as a result of the angle being between the minimum and the maximum values, the second ends are at a spacing different than the spacing of the first ends.

190. An electronic assembly according to anyone of claims 153, 160, 162, 168, 169, 170, or 171, wherein the angle is nonorthogonal to the contact location.

160. An electronic assembly comprising:

a substrate having a plurality of contact locations on one side thereof; and

a plurality of flexible elongated electrical conductors, each flexible elongated electrical conductor having a first end attached to a respective one of the contact locations and a second end, distant from the substrate, which are resiliently depressible towards the substrate, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value wherein;

(i) the first ends of two of the flexible elongated electrical conductors located next to one another are spaced by a first distance from one another; and

(ii) the second ends of the two elongated electrical conductors are spaced by a second distance from one another which is determined by the angle corresponding to the first and second elongated electrical conductors both

(a) when the two flexible elongated electrical conductors are not depressed towards the substrate and

(b) when the second ends are depressed towards the substrate; and

(iii) each elongated electrical conductor comprises a flexible elongated element of a first material, and a second material on the flexible elongated element, the flexible elongated element having a first composition and the second material having a second composition which is different from the first composition.

161. The electronic assembly of claim 160, wherein the second end of each flexible elongated electrical conductor is an area of the flexible elongated electrical conductor which is most distant from the substrate and remains most distant both when the flexible elongated electrical conductor is not depressed towards the substrate and when the second end is depressed towards the substrate.

162. An electronic assembly comprising:

a substrate having a plurality of contact locations on one side thereof; and

a plurality of flexible elongated electrical conductors, each flexible elongated electrical conductor having a first end attached to a respective one of the contact locations, and a second end most distant from the substrate, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value, the flexible elongated electrical conductor is resiliently depressible towards the substrate, wherein the first locations of two of the flexible elongated electrical conductor located next to one another are spaced from one another by a first distance and the second ends of the two elongated electrical conductors are spaced from one another by a second distance which is determined by the angles corresponding to the first and second flexible elongated electrical conductors, the second ends of each of the two flexible elongated electrical conductors being an area of the flexible elongated electrical conductor which is most distant from the substrate and remaining most distant from the substrate after depression of the second end towards the substrate, each flexible elongated electrical conductor comprising a flexible elongated element of a first material, and a second material on the flexible elongated element, the flexible elongated electrical conductor having a first composition and the second material having a second composition.

163. A semiconductor device comprising:

a silicon body having a plurality of contact locations; and

a plurality of free-standing elongated electrical conductors, each of the free-standing elongated electrical conductors having a first end, a second end, a first portion having a first bend, and a second portion having a second bend selected ones of the free-standing elongated electrical conductors mounted by a respective first end thereof to and extending from a respective selected one of the contact locations, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value;

wherein the second ends of at least a portion of the elongated electrical conductors are spaced apart as determined by the angles corresponding to the first and second elongated electrical conductors.

164. A semiconductor device comprising:

a silicon body having a plurality of contact locations; and

a plurality of free-standing elongated electrical conductors, and each of the free-standing elongated electrical conductors having a first end and a second end, selected ones of the free-standing elongated electrical conductors mounted by a respective first end thereof to and extending from a respective selected one of the contact locations, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value;

wherein

(i) the contact locations are spaced approximately 5 mils apart; and

(ii) the second ends are spaced as determined by the angles corresponding to the first and second elongated electrical conductors.

165. A semiconductor device comprising:

a silicon body having a plurality of contact locations;

a plurality of free-standing elongated electrical conductors, each of the free-standing elongated electrical conductors having a first end and a second end, selected ones of the free-standing elongated electrical conductors mounted by a respective first end thereof to and extending from a respective selected one of the contact locations, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value, wherein second ends of at least a portion of the elongated electrical conductors are spaced apart as determined by the angles corresponding to the first and second elongated electrical conductors; and

a dielectric material extending over a surface of the silicon body and enveloping a portion of the elongated electrical conductors.

166. A semiconductor device comprising:

a silicon body having a plurality of contact locations;

a plurality of free-standing elongated electrical conductors, each of the free-standing elongated electrical conductors having a first end and a second end, selected ones of the free-standing elongated electrical conductors mounted by a respective first end thereof to and extending from a respective selected one of the contact locations, wherein the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value;

(i) second ends of at least a portion of the second ends are spaced as determined by the angles corresponding to the first and second elongated electrical conductors;

(ii) the silicon body is covered by an electrically insulating coating having through holes therethrough whereby the contact locations are accessible through the electrically insulating coating;

(iii) a plurality of additional conductive material elements extend through the passivation layer to contact the contact locations; and

(iv) the elongated electrical conductor are mounted to the additional conductive material.

167. A semiconductor device, according to claim 166, further comprising:

metallization covering the elongated electrical conductor.

168. An electronic assembly comprising:

a substrate having a plurality of contact locations on one side thereof; and

a plurality of resilient, elongated electrical conductors;

(i) each elongated electrical conductor has a first end attached to a respective one of the contact locations, and a second end, distant from the substrate, the second end of the elongated electrical conductor is at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value, and the first end of a first of the elongated electrical conductors is spaced from the first end of a second, adjacent one of the elongated electrical conductors by a first distance and the second end of the first elongated electrical conductor is spaced from the second end of the second elongated electrical conductor by a second distance which is determined by the angles corresponding to the first and second elongated electrical conductors;

(ii) each elongated electrical conductor comprises a flexible elongated element of a first material being gold, and a second material on the flexible elongated element, the flexible elongated element having a first composition and the coating having a second composition which is different from the first composition.

169. An electronic assembly comprising:

a substrate having a plurality of contact locations on one side thereof; and

a plurality of resilient, elongated electrical conductors;

(i) each elongated electrical conductor has a first end attached to a respective one of the contact locations, and a second end, distant from the substrate, wherein the second end of the elongated electrical conductor is at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value, and the first end of a first of the elongated electrical conductors is spaced from the first end of a second, adjacent one of the elongated electrical conductors by a first distance and the second end of the first elongated electrical conductor is spaced from the second end of the second elongated electrical conductor by a second distance which is determined by the angles corresponding to the first and second elongated electrical conductors; and

(ii) each elongated electrical conductor comprises a flexible elongated electrical conductor of a first material, and a second material on the flexible elongated element, the flexible elongated element having a first composition and the coating having a second composition which is different from the first composition.

170. An electronic assembly comprising:

a substrate having a plurality of contact locations on one side thereof; and

a plurality of resilient, elongated electrical conductors;

(i) each elongated electrical conductor has a first end attached to a respective one of the contact locations, and a second end, distant from the substrate wherein the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value, and the first contact location of a first of the elongated electrical conductors is spaced from the first end of a second, adjacent one of the elongated electrical conductors by a first distance and the second end of the first elongated electrical conductor is spaced from the second end of the second elongated electrical conductor by a distance which is determined by the angles corresponding to the first and second elongated electrical conductors; and

(ii) each elongated electrical conductor comprises a flexible elongated element of a first material, and a second material, comprising nickel iron or cobalt, on the flexible elongated element, the flexible elongated element having a first composition and the coating having a second composition which is different from the first composition.

171. An electronic assembly comprising:

a substrate having a plurality of contact locations on one side thereof; and

a plurality of resilient, elongated electrical conductors;

(i) each elongated electrical conductor has a first end attached to a respective one of the contact locations, and a second end, distant from the substrate wherein the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value, and the first end of a first of the elongated electrical conductor is spaced from the first end of a second, adjacent one of the elongated electrical conductors by a first distance and the second ends of the first elongated electrical conductor is spaced from the second end of the second elongated electrical conductor by a second distance which is determined by the angles corresponding to the first and second elongated electrical conductors; and

(ii) each elongated electrical conductor comprises a flexible elongated element of a first material, and a second material on the flexible elongated element, the flexible elongated element having a first composition and the coating having a second composition which is different from the first composition.

176. A structure comprising:

a substrate having a plurality of contact locations thereon;

a plurality of elongated electrical conductors, each having a first end and a second end;

said first end is electrically connected to one of said contact locations;

the second end of the elongated electrical conductor is at an angle with respect to said first end and said contact location to which said first end is electrically connected, the angle being between a minimum and a maximum value.

177. A structure according to claim 176, wherein the minimum value is 5 degrees and the maximum value is 60 degrees.

178. A structure according to claim 176, wherein as a result of the angle being between said minimum and said maximum values, the second ends are at a spacing different than the spacing of the first ends.

179. A structure according to claim 176, further including a coating on said elongated electrical conductors.

180. A structure according to claim 179, wherein the elongated electrical conductor comprises a first material and the coating comprises a second material.

181. A structure according to claim 180, wherein the second material is different then said first material.

182. A structure according to claim 176, wherein the elongated electrical conductor comprises a material selected from the group consisting of gold, aluminum, nickel, platinum, gold alloy, copper alloy and palladium.

183. A structure according to claim 179, wherein said coating comprises a material selected from the group consisting of Au, Cr, Co, Ni and Pd.

184. A structure according to claim 176, wherein said substrate comprises silicon.

185. A structure according to claim 176, wherein said substrate comprises an electrically insulating coating.

186. A structure according to claim 176, wherein said substrate comprises electrical conductors and electrically conductive throughholes electrically interconnected to the contact locations and to the electrical conductors.

187. A structure according to claim 176, wherein said elongated electrical conductor is compliant and can be displaced so that the second end thereof moves in relation to the first end of said elongated conductor when the second end is pressed against a surface.

188. A structure according to claim 176, wherein said elongated electrical conductor compliantly responds when said second end is released from being pressed against said surface.

191. A structure according to anyone of claims 176 to 190 or 192 to 194, wherein said angle is nonorthogonal to said one of said contact locations.

192. A structure according to anyone of claims 176 to 191 or 193 to 194, wherein the elongated electrical conductors are free-standing.

193. A structure according to anyone of claims 176 to 192 or 194, further including a dielectric material disposed on said substrate and enveloping a portion of said elongated electrical conductor.

194. A structure according to anyone of claims 176 to 193, wherein said elongated electrical conductors are compliant.

195. A structure comprising:

a substrate having first and second opposed sides with a first set of contact locations on the first side and a second set of contact locations on the second side;

a first set of resilient elongated electrical conductors, each having a first end electrically interconnected to a respective one of the contact locations of the first set of contact locations,

a second end distant from the substrate, and an elongated section extending from the first end to the second end, the elongated section resiliently bending upon depression of the second end towards the substrate, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and a maximum value, wherein the second ends of two adjacent resilient contact structures are spaced as determined by the angles corresponding to the first and second elongated electrical conductors and wherein respective ones of the second set of contact locations are coupled to corresponding ones of the first set of contact locations; and

a second set of resilient elongated electrical conductors, each having a first end electrically interconnected to a respective one of the contact locations of the second set of contact locations, a second end distant from the substrate, and an elongate section extending from the first end to the second end, the elongated section resiliently bending upon depression of the second end towards the substrate.

196. A structure, according to claim 195, further comprising:

an enlargement at ends of the first plurality of resilient elongated electrical conductors.

197. A structure, according to claim 195, wherein:

the first plurality of resilient contact structures are composite electrical interconnection elements.

198. A structure, according to claim 195, wherein:

the first plurality of resilient elongated electrical conductors are fabricated on a sacrificial substrate prior to electrical interconnections of the first plurality of elongated electrical conductors to the first plurality of contact locations.

199. A structure, according to claim 195, further comprising:

a subset of the second set of elongated electrical conductors directly electrically interconnected to the second set of contact locations.

200. A structure, according to claim 199, wherein:

the second plurality of elongated electrical conductors are composite interconnection elements.

201. A structure, according to claim 199, wherein:

the second plurality of resilient elongated electrical conductors are fabricated on a sacrificial substrate prior to electrically interconnecting the second plurality of resilient elongated electrical conductors to the second plurality of contact locations.

202. A Probe Assembly, comprising:

a second space transformer having a first surface, a second surface and a first plurality of contact locations on the first surface thereof;

an interconnection structure having a first surface, a second surface, a second plurality of elongated resilient electrical conductors extending from the second surface thereof and a first plurality of elongated resilient electrical conductors extending from the first surface thereof; and

a first space transformer having a first surface, a second surface, a plurality of contact locations disposed on the second surface thereof, and a third plurality of elongated resilient conductors extending from the first surface thereof;

wherein;

the second plurality of elongated resilient electrical conductors effect a pressure connection with the contact locations of the second space transformer; and

the first plurality of elongated resilient electrical conductors effect a pressure connection with the contact locations of the first space transformer.

203. A Probe Assembly, according to claim 202, wherein:

the third plurality of elongated resilient electrical conductors are electrically interconnected to contact locations on the first surface of the first space transformer.

204. A Probe Assembly, according to claim 202, wherein:

the first plurality of elongated resilient electrical conductors are composite electrical interconnection elements.

205. A Probe Assembly, according to claim 202, wherein:

the second plurality of elongated resilient electrical conductors are composite electrical interconnection elements.

206. A Probe Assembly, according to claim 202, wherein:

the third plurality of elongated resilient electrical conductors are composite electrical interconnection elements.

207. A Probe Assembly, according to claim 202, wherein:

one or more of the first plurality of elongated resilient electrical conductors are a composite structure comprising an elongated element and a coating.

208. A Probe Assembly, according to claim 202, wherein:

one or more of the second plurality of elongated resilient electrical conductors are a composite structure comprising an elongated element and a coating.

209. A structure, according to claim 202, further comprising:

a clamp for holding the first space transformer in place with respect to said second space transformer,

the clamp comprises a sheet of material supported by a member perpendicularly disposed with respect to the second space transformer;

means for affixing the sheet to the member; and

means for urging the first space transformer towards the first surface of the second space transformer.

210. A Probe Assembly, according to claim 209, wherein said clamps comprises a sheet made of aluminum.

211. A Probe Assembly, according to claim 209, wherein the means for urging the first space transformer comprises:

the sheet of material; and

a screw holding the sheet in place with respect to the member and the second space transformer with the first space transformer captured therebetween.

212. A Probe Assembly, according to claim 211, wherein:

said sheet comprises aluminum.

213. A Probe Assembly, according to claim 211, further comprising:

a member perpendicularly disposed with respect to the second space transformer for supporting the sheet of material.

214. A Probe Assembly, according to claim 209, wherein the clamp comprises means for affixing a sheet of material supported by a member perpendicularly despired with respect to the second space transformer, the sheet is held in place to the member by a screw forming the clamp to hold the first space transformer in place with respect to the second space transformer.

215. A Probe Assembly, according to claim 214, wherein:

the sheet and the member are made of aluminum.

216. A Probe Assembly, according to claim 202, further comprising:

means for aligning of the first space transformer relative to the second space transformer.

217. A Probe Assembly, according to claim 216, wherein the means for aligning the first space transformer comprises:

a plurality of pins disposed on the first space transformer.

218. A Probe Assembly, according to claim 216, wherein the means for aligning the first space transformer comprises:

a plurality of projections for mating with grooves on the interconnection structure.

219. A Probe Assembly, according to claim 202, wherein:

the contact locations are disposed at a first pitch on the second surface of the second space transformer;

the third plurality of elongated resilient electrical conductors are disposed at a second pitch on the first surface of the second space transformer.

220. A Probe Assembly, according to claim 202, wherein:

the first plurality of elongated resilient electrical conductors are disposed at a first pitch on the first surface of the interconnection structure;

the second plurality of elongated resilient electrical conductors are disposed at a second pitch on the second surface of the interconnection structure.

221. A Probe Assembly, according to claim 202, wherein:

the contact locations are disposed at a first pitch on the second surface of the first space transformer;

the third plurality of elongated resilient electrical conductors are disposed at a second pitch on the first surface of the second space transformer;

the first plurality of elongated resilient electrical conductors are disposed at the first pitch on the first surface of the interconnection structure;

the second plurality of elongated resilient electrical conductors are disposed at the first pitch on the second surface of the interconnection structure.

222. A Probe Assembly, according to claim 202, wherein at least some of the elongated resilient electrical conductors comprise:

a composite interconnection element having an end; and

a tip structure disposed at the end of the composite interconnection element.

223. A structure, according to claim 202, wherein:

the third plurality of elongated resilient electrical conductors are electrically interconnected to contact locations on the first surface of the first space transformer.

244. A Probe Assembly, according to claim 219, wherein the first pitch is greater than the second pitch.

245. A Probe Assembly, according to claim 220, wherein the first pitch is substantially the same as the second pitch.

246. A Probe Assembly, according to claim 221, wherein the first pitch is greater than the second pitch.

315. A Probe Assembly, according to claim 202, wherein:

the interconnection structure comprises a dielectric material comprising a plurality of elongated electrical conductors embedded therein;

a plurality of first ends of which comprise the first plurality of elongated resilient electrical conductors and a plurality of second ends of which comprise the second plurality of elongated resilient electrical conductors.

224. A structure, comprising:

a first space transformer having a first surface, a second surface, a plurality of contact locations disposed on the second surface thereof, and a plurality of elongated electrical conductors connected to the first surface thereof, said first space transformer adapted in use such that ends of the plurality of elongated electrical conductors for making pressure contacts with a corresponding plurality of contact locations on a semiconductor wafer; and

an interconnection structure having a first surface, a second surface, a first plurality of elongated resilient electrical conductors extending from the first surface thereof, said electrical interconnection structure adapted in use such that contact regions of the first plurality of elongated resilient electrical conductors make pressure connections with the plurality of contact locations on the second surface of the first space transformer, the electrical interconnection structure having a second plurality of elongated resilient electrical conductors extending from the second surface thereof, said interconnection structure adapted in use for contact locations of the second plurality of elongated resilient electrical conductors making pressure connections with a plurality of contact locations on a second space transformer.

225. A structure, according to claim 224, wherein:

the contact locations are disposed at a first pitch on the second surface of the first space transformer;

the plurality of elongated electrical conductors are disposed at a second pitch on the first surface of the first space transformer.

226. A structure, according to claim 224, wherein:

the second plurality of elongated resilient electrical conductors are disposed at a first pitch on the second surface of the interconnection structure;

the first plurality of elongated resilient electrical conductors are disposed at a second pitch on the first surface of the interconnection structure.

227. A structure, according to claim 224, wherein:

the contact locations are disposed at a first pitch on the second surface of the space transformer;

the plurality of elongated resilient electrical conductors are disposed at a second pitch on the first surface of the space transformer;

the second plurality of elongated resilient electrical conductors are disposed at the first pitch on the second surface of the electrical interconnection structure;

the first plurality of elongated resilient electrical conductors are disposed at the first pitch on the first surface of the electrical interconnection structure.

247. A structure, according to claim 225, wherein the first pitch is greater than the second pitch.

248. A structure, according to claim 226, wherein the first pitch is substantially the same as the second pitch.

249. A structure, according to claim 227, wherein the first pitch is greater than the second pitch.

228. A Probe Assembly, comprising:

a second space transformer having a first surface, a second surface and a plurality of second contact locations on the first surface thereof;

a first space transformer having a first surface, a second surface, a plurality of first contact locations disposed on the second surface thereof, and a first plurality of elongated resilient electrical conductors mounted adjacent to and extending from the first surface thereof;

wherein the plurality of first contact locations are connected to the plurality of second contact locations of the second space transformer.

229. A Probe Assembly, according to claim 228, wherein:

the first plurality of elongated resilient electrical conductors are mounted directly to contact locations on the first surface of the first space transformer.

230. A Probe Assembly, according to claim 228, wherein:

the first plurality of elongated resilient electrical conductors are connected to contact locations on the first surface of the first space transformer.

231. A Probe Assembly, according to claim 228, wherein:

the first plurality of elongated resilient electrical conductors are composite interconnection elements.

232. A Probe Card Assembly, according to claim 228, further comprising:

means for aligning the first space transformer relative to the second space transformer.

233. A Probe Assembly, according to claim 232, wherein the means for aligning the first space transformer comprises:

a plurality of pins disposed on the first space transformer.

234. A Probe Assembly, according to claim 232, wherein the means for aligning the first space transformer comprises:

a plurality of engaging projections and grooves.

235. A Probe Assembly, according to claim 228, wherein:

the contact locations are disposed at a first pitch on the second surface of the first space transformer;

the first plurality of elongated resilient electrical conductors each having a second end, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and a maximum value, the second ends are disposed at a second pitch as determined by the angles corresponding to the first plurality of elongated resilient electrical conductors; and

the first pitch is a shortest distance between any two adjacent contact pads and the second pitch is a shortest distance between any two adjacent elongate electrical conductors.

236. A Probe Assembly, comprising:

a second space transformer having a first surface, a second surface and a plurality of second contact locations on the first surface thereof;

a first space transformer having a first surface, a second surface, a plurality of first contact locations disposed on the second surface thereof, and a first plurality of elongated electrical conductors electrically connected adjacent to and extending from the first surface thereof;

wherein the plurality of first contact locations are connected to the plurality of second contact locations of the second substrate.

237. A Probe Assembly, according to claim 236, wherein:

the first plurality of elongated electrical conductors are electrically interconnected to contact locations on the first surface of the first space transformer.

238. A Probe Assembly, according to claim 236, wherein:

the first plurality of elongated electrical conductors are electrically interconnected to contact locations on the first surface of the first space transformer.

239. A Probe Assembly, according to claim 236, wherein:

the first plurality of elongated electrical conductors are composite interconnection elements.

240. A Probe Assembly, according to claim 236, further comprising:

means for aligning the first space transformer relative to the second space transformer.

241. A Probe Assembly, according to claim 240, wherein the means for aligning the first space transformer comprises:

a plurality of pins disposed on the first space transformer.

242. A Probe Assembly, according to claim 240, wherein the means for aligning the first space transformer comprises:

a plurality of engaging projections and grooves.

243. A Probe Assembly, according to claim 236, wherein:

the contact locations are disposed at a first pitch on the second surface of the space transformer;

the first plurality of elongated electrical conductors each having a second end, the second end of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and a maximum value, the second ends are disposed at a second pitch as determined by the angles corresponding to the first and second elongated electrical conductors; and

the first pitch is a shortest distance between any two adjacent contact pads and the second pitch is a shortest distance between any two adjacent elongated electrical conductors.

250. A structure comprising:

a substrate having first and second opposed sides with a first set of contact locations on the first side and a second set of contact locations on the second side;

a first set of resilient elongated electrical conductors, each having a first end electrically interconnected to a respective one of the contact locations of the first set of contact locations,

a second end distant from the substrate, and an elongated section extending from the first end to the second end, the elongated section resiliently bending upon depression of the second end towards the substrate, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and a maximum value, wherein the second ends of two adjacent resilient contact structures are spaced as determined by the angles corresponding to the first and second elongated electrical conductors and wherein respective ones of the second set of contact locations are coupled to corresponding ones of the first set of contact locations; and

a second set of elongated electrical conductors, each having a first end electrically interconnected to a respective one of the contact locations of the second set of contact locations, a second end distant from the substrate, and an elongate section extending from the first end to the second end.

251. A structure, according to claim 250, further comprising:

an enlargement at ends of the first plurality of resilient elongated electrical conductors.

252. A structure, according to claim 250, wherein:

the first plurality of resilient contact structures are composite electrical interconnection elements comprising a first enlargement at the first end, a second enlargement at the second end and an electrically conductive wire electrically interconnecting the first enlargement and the second enlargement.

253. A structure, according to claim 250, wherein:

the first plurality of resilient elongated electrical conductors are fabricated on a sacrificial substrate prior to electrical interconnection of the first plurality of elongated electrical conductors to the first plurality of contact locations.

254. A structure, according to claim 250, further comprising:

a subset of the second set of elongated electrical conductors, directly electrically interconnected to the second set of contact locations.

255. A structure, according to claim 254, wherein:

the second plurality of elongated electrical conductors are composite interconnection elements comprising;

a first enlargement at the first end

a second enlargement at the second end; and

an electrically conductive wire electrically interconnecting the first enlargement and the second enlargement.

256. A structure, according to claim 250, wherein:

the second set of elongated electrical conductors are resilient.

257. A structure, according to claim 250, wherein:

the second set of elongated electrical conductors are pins.

258. A structure, according to claim 250, further including:

a dielectric material disposed on said first surface enveloping a part of said first set of resilient elongated electrical conductors.

259. A structure, according to claim 258, wherein:

the second set of elongated electrical conductors are resilient and further including a dielectric material disposed on the second surface and enveloping a part of the second set of elongated electrical conductors.

260. A structure, according to claim 251, wherein:

the second plurality of resilient elongated electrical conductors are fabricated on a sacrificial substrate prior to electrically interconnecting the second plurality of resilient elongated electrical conductors to the second plurality of contact locations.

261. A Probe Assembly, comprising:

a second space transformer having a first surface, a second surface and a first plurality of contact locations on the first surface thereof;

an interconnection structure having a first surface, a second surface, a second plurality of electrical conductors extending from the second surface thereof and a first plurality of electrical conductors extending from the first surface thereof; and

a first space transformer having a first surface, a second surface, a plurality of contact locations disposed on the second surface thereof, and a third plurality of elongated resilient electrical conductors extending from the first surface thereof;

wherein;

the second plurality of electrical conductors effect a pressure connection with the contact locations of the second space transformer; and

the first plurality of electrical conductors effect a pressure connection with the contact locations of the first space transformer.

262. A Probe Assembly, according to claim 261, wherein:

the interconnection structure comprises a dielectric material comprising a plurality of elongated electrical conductors embedded therein;

a plurality of first ends of which comprise the first plurality of electrical conductors and a plurality of second ends of which comprise the second plurality of electrical conductors.

263. A Probe Assembly, according to claim 261, wherein:

the second plurality of electrical conductors are pins.

264. A structure, according to claim 261, further including:

a dielectric material disposed on said first surface of the interconnecting structure enveloping a part of said first set of resilient elongated electrical conductors.

265. A Probe Assembly, according to claim 264, wherein:

the first set of electrical conductors are elongated and resilient and further including a dielectric material disposed on the first surface and enveloping a part of the first set of elongated electrical conductors.

266. A Probe Assembly, according to claim 261, wherein:

the third plurality of elongated resilient electrical conductors are electrically interconnected to contact locations on the first surface of the first space transformer.

267. A Probe Assembly, according to claim 261, further including:

a dielectric material disposed on the first surface of the space transformer enveloping a part of the third plurality of elongated resilient electrical conductors.

268. A Probe Assembly, according to claim 261, wherein:

the first plurality of electrical conductors are composite elongated resilient electrical interconnection elements comprising;

a first enlargement at a first end thereof, a second enlargement at a second end thereof; and

a wire interconnecting the first enlargement and the second enlargement.

269. A Probe Assembly, according to claim 261, wherein:

the second plurality of electrical conductors are composite elongated resilient electrical interconnection elements comprising;

a first enlargement at a first end thereof, a second enlargement at a second end thereof; and

a wire interconnecting the first enlargement and the second enlargement.

270. A Probe Assembly, according to claim 261, wherein:

the third plurality of elongated resilient electrical conductors are composite electrical interconnection elements comprising;

a first enlargement at a first end thereof, a second enlargement at a second end thereof; and

a wire interconnecting the first enlargement and the second enlargement.

271. A Probe Assembly, according to claim 261, wherein:

one or more of the first plurality of electrical conductors are an elongated resilient composite structure comprising an elongated element and a coating.

272. A Probe Assembly, according to claim 261, wherein:

one or more of the second plurality of electrical conductors are an elongated resilient composite structure comprising an elongated element and a coating.

273. A structure, according to claim 261, further comprising:

a clamp for holding the first space transformer in place with respect to said second space transformer,

the clamp comprises a sheet of material supported by a member perpendicularly disposed with respect to the second space transformer;

means for affixing the sheet to the member; and

means for urging the first space transformer towards the first surface of the second space transformer.

274. A Probe Assembly, according to claim 273, wherein said clamps comprises a sheet made of aluminum.

275. A Probe Assembly, according to claim 273, wherein the means for urging the first space transformer comprises:

the sheet of material; and

a screw holding the sheet in place with respect to the member and the second space transformer with the first space transformer captured therebetween.

276. A Probe Assembly, according to claim 275, wherein:

said sheet comprises aluminum.

277. A Probe Assembly, according to claim 275, further comprising:

a member perpendicularly disposed with respect to the second space transformer for supporting the sheet of material.

278. A Probe Assembly, according to claim 275, wherein the clamp comprises means for affixing a sheet of material supported by a member perpendicularly dispired with respect to the second space transformer, the sheet is held in place to the member by a screw forming the clamp to hold the first space transformer in place with respect to the second space transformer.

279. A Probe Assembly, according to claim 275, wherein:

the sheet and the member are made of aluminum.

280. A Probe Assembly, according to claim 261, further comprising:

means for aligning of the first space transformer relative to the second space transformer.

281. A Probe Assembly, according to claim 280, wherein the means for aligning the first space transformer comprises:

a plurality of pins disposed on the first space transformer.

282. A Probe Assembly, according to claim 280, wherein the means for aligning the first space transformer comprises:

a plurality of projections for mating with grooves on the interconnection structure.

283. A Probe Assembly, according to claim 261, wherein:

the contact locations are disposed at a first pitch on the second surface of the second space transformer;

the third plurality of elongated resilient electrical conductors are disposed at a second pitch on the first surface of the second space transformer.

284. A Probe Assembly, according to claim 283, wherein:

the first pitch is greater than the second pitch.

285. A Probe Assembly, according to claim 261, wherein:

the first plurality of elongated resilient electrical conductors are disposed at a first pitch on the first surface of the interconnection structure;

the second plurality of elongated resilient electrical conductors are disposed at a second pitch on the second surface of the interconnection structure.

286. A Probe Assembly, according to claim 261, wherein:

the contact locations are disposed at a first pitch on the second surface of the first space transformer;

the third plurality of elongated resilient electrical conductors are disposed at a second pitch on the first surface of the second space transformer;

the first plurality of elongated resilient electrical conductors are disposed at the first pitch on the first surface of the interconnection structure;

the second plurality of elongated resilient electrical conductors are disposed at the first pitch on the second surface of the interconnection structure.

287. A Probe Assembly, according to claim 286, wherein the first pitch is greater than the second pitch.

288. A Probe Assembly, according to claim 261, wherein at least some of the elongated resilient electrical conductors comprise:

a composite interconnection element having an end; and

a protuberance disposed at the end of the composite interconnection element.

289. A structure, according to claim 261, wherein:

the third plurality of elongated resilient electrical conductors are electrically interconnected to contact locations on the first surface of the first space transformer.

314. A Probe Assembly, according to claim 285, wherein the first pitch is substantially the same as the second pitch.

317. A structure, according to claim 262, wherein the plurality of first ends comprise a first plurality of elongated resilient electrical conductors and the plurality of second ends comprise a second plurality of elongated resilient electrical conductors.

290. A structure, comprising:

a first space transformer having a first surface, a second surface, a plurality of contact locations disposed on the second surface thereof, and a plurality of elongated electrical conductors connected to the first surface thereof, said first space transformer adapted in use such that ends of the plurality of elongated electrical conductors for making pressure contacts with a corresponding plurality of contact locations on a semiconductor wafer; and

an interconnection structure having a first surface, a second surface, a first plurality of electrical conductors extending from the first surface thereof, said electrical interconnection structure adapted in use such that contact regions of the first plurality of electrical conductors make pressure connections with the plurality of contact locations on the second surface of the first space transformer, the electrical interconnection structure having a second plurality of electrical conductors extending from the second surface thereof, said interconnection structure adapted in use for contact locations of the second plurality of electrical conductors making pressure connections with a plurality of contact locations on a second space transformer.

291. A structure, according to claim 290, wherein:

said interconnection structure comprises a dielectric material comprising a plurality of elongated electrical conductors embedded therein, a plurality of first ends of which comprise the first plurality of electrical conductors and a plurality of second ends of which comprise the second plurality of electrical conductors.

292. A structure, according to claim 290, wherein:

the contact locations are disposed at a first pitch on the second surface of the first space transformer;

the plurality of elongated electrical conductors are disposed at a second pitch on the first surface of the first space transformer.

293. A structure, according to claim 292, wherein said first pitch is greater than said second pitch.

294. A structure, according to claim 290, wherein:

the second plurality of elongated resilient electrical conductors are disposed at a first pitch on the second surface of the interconnection structure;

the first plurality of elongated resilient electrical conductors are disposed at a second pitch on the first surface of the interconnection structure.

295. A structure according to claim 294, wherein the first pitch is substantially the same as the second pitch.

296. A structure, according to claim 290, wherein:

the contact locations are disposed at a first pitch on the second surface of the space transformer;

the plurality of elongated resilient electrical conductors are disposed at a second pitch on the first surface of the space transformer;

the second plurality of elongated resilient electrical conductors are disposed at the first pitch on the second surface of the electrical interconnection structure;

the first plurality of elongated resilient electrical conductors are disposed at the first pitch on the first surface of the electrical interconnection structure.

297. A structure according to claim 296, wherein the first pitch is greater than the second pitch.

316. A structure, according to claim 291, wherein the plurality of first ends comprise a first plurality of elongated resilient electrical conductors and the plurality of second ends comprise a second plurality of elongated resilient electrical conductors.

298. A Probe Card Assembly, comprising:

a second space transformer having a first surface, a second surface and a plurality of second contact locations on the first surface thereof;

a first space transformer having a first surface, a second surface, a plurality of first contact locations disposed on the second surface thereof, and a first plurality of elongated resilient electrical conductors mounted adjacent to and extending from the first surface thereof;

wherein the plurality of first contact locations are connected to the plurality of second contact locations of the second space transformer.

299. A Probe Card Assembly, according to claim 298, wherein:

the first plurality of elongated resilient electrical conductors are mounted directly to contact locations on the first surface of the first space transformer.

300. A Probe Card Assembly, according to claim 298, wherein:

the first plurality of elongated resilient electrical conductors are connected to contact locations on the first surface of the first space transformer.

301. A Probe Card Assembly, according to claim 298, wherein:

the first plurality of elongated resilient electrical conductors are composite interconnection elements.

302. A Probe Card Assembly, according to claim 298, further comprising:

means for aligning the first space transformer relative to the second space transformer.

303. A Probe Card Assembly, according to claim 302, wherein the means for aligning the first space transformer comprises:

a plurality of pins disposed on the first space transformer.

304. A Probe Card Assembly, according to claim 302, wherein the means for aligning the first space transformer comprises:

a plurality of engaging projections and grooves.

305. A Probe Card Assembly, according to claim 298, wherein:

the contact locations are disposed at a first pitch on the second surface of the first space transformer;

the first plurality of elongated resilient electrical conductors each having a second end, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and a maximum value, the second ends are disposed at a second pitch as determined by the angles corresponding to the first plurality of elongated resilient electrical conductors; and

the first pitch is a shortest distance between any two adjacent contact pads and the second pitch is a shortest distance between any two adjacent elongate electrical conductors.

306. A Probe Card Assembly, comprising:

a second space transformer having a first surface, a second surface and a plurality of second contact locations on the first surface thereof;

a first space transformer having a first surface, a second surface, a plurality of first contact locations disposed on the second surface thereof, and a first plurality of elongated electrical conductors electrically connected adjacent to and extending from the first surface thereof;

wherein the plurality of first contact locations are connected to the plurality of second contact locations of the second substrate.

307. A Probe Card Assembly, according to claim 306, wherein:

the first plurality of elongated electrical conductors are electrically interconnected to contact locations on the first surface of the first space transformer.

308. A Probe Card Assembly, according to claim 306, wherein:

the first plurality of elongated electrical conductors are electrically interconnected to contact locations on the first surface of the first space transformer.

309. A Probe Card Assembly, according to claim 306, wherein:

the first plurality of elongated electrical conductors are composite interconnection elements.

310. A Probe Card Assembly, according to claim 306, further comprising:

means for aligning the first space transformer relative to the second space transformer.

311. A Probe Card Assembly, according to claim 310, wherein the means for aligning the first space transformer comprises:

a plurality of pins disposed on the first space transformer.

312. A Probe Card Assembly, according to claim 310, wherein the means for aligning the first space transformer comprises:

a plurality of engaging projections and grooves.

313. A Probe Card Assembly, according to claim 306, wherein:

the contact locations are disposed at a first pitch on the second surface of the space transformer;

the first plurality of elongated electrical conductors each having a second end, the second end of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and a maximum value, the second ends are disposed at a second pitch as determined by the angles corresponding to the first and second elongated electrical conductors; and

the first pitch is a shortest distance between any two adjacent contact pads and the second pitch is a shortest distance between any two adjacent elongated electrical conductors.

318. A space transformer comprising:

a first substrate provided with first electrical contact locations on one side thereof;

first elongated electrical conductors, each having an elongate flexible shape and a respective first end connected to a respective first electrical contact location of said first electrical contact locations, and extending from the respective first electrical contact location;

a second substrate provided with second electrical contact locations on one side thereof and third electrical contact locations on an opposite side thereof;

the second contact locations facing the first contact locations and each first elongated electrical conductor having a respective second end connected to a respective one of the second electrical contact locations, the second substrate being disassembleable from the first substrate; and

second elongated electrical conductors, each having an elongate flexible shape and a respective first end connected to a respective third electrical contact location of said third electrical contact locations and extending from the respective third electrical contact location,

selected ones of the first elongated electrical conductors are interconnected with selected ones of the second contact locations, and

selected ones of the first contact locations are spaced from one another by first distances, and selected ones of the second elongated electrical conductors have second ends, removely located from the first ends thereof, which are spaced from one another by second distances.

319. A space transformer, according to claim 318, wherein:

the first substrate is a printed circuit board.

320. A space transformer, according to claim 318, wherein:

selected ones of the second electrical contact locations and selected ones of the third electrical contact locations are electrically interconnected by electrically conductive vias.

321. A space transformer, according to claim 318, wherein selected ones of the first flexible elongated electrical conductors comprise:

a flexible elongate core element having a first end and a second end and formed of a readily-shaped material;

an electrically conductive coating, formed of a layer of conductive material disposed on the elongate core element.

322. A space transformer, according to claim 321, wherein:

the flexible elongate core element is selected from the group consisting of;

palladium, gold alloy, copper alloy, gold, aluminum, copper, silver, nickel and combinations thereof.

323. A space transformer, according to claim 321, wherein:

the flexible elongate core element has a diameter in the range of from 1 to 5 mils.

324. A space transformer, according to claim 323, wherein:

the flexible elongate core element is a wire.

325. A space transformer, according to claim 321, wherein:

the flexible elongate core element has a length of about 40 mils.

326. A space transformer, according to claim 321, wherein:

the electrically conductive coating comprising a material selected from the group consisting of Au, Cr, Co, Ni and Pd.

327. A space transformer, according to claim 321, wherein:

the electrically conductive coating comprises nickel and cobalt.

328. A space transformer, according to claim 321, wherein:

the electrically conductive coating comprises a coating selected from the group consisting of nickel, cobalt, chromium, gold and palladium.

329. A space transformer, according to claim 321, wherein:

the electrically conductive coating is formed of a material selected from nickel, cobalt, chromium and gold.

330. A space transformer, according to claim 321, wherein:

the electrically conductive coating is a coating selected from the group consisting of an electroplated coating, an electrolessly plated coating, a sputtered coating and an e-beam evaporated coating.

331. A space transformer, according to claim 330, wherein:

the electrically conductive coating is a thin layer.

332. A space transformer, according to claim 318, wherein:

the substrate is a multi-layer interconnection substrate.

333. A space transformer, according to claim 318, wherein:

the first substrate comprises a dielectric material comprising a plurality of elongated electrical conductors embedded therein; and

a plurality of first ends of which comprise the first plurality of electrical conductors.

335. A space transformer, according to claim 318, wherein the second distance is different than the first distance.

336. A space transformer, according to claim 318, wherein the second substrate is a printed circuit card.

337. A space transformer, according to claim 336, wherein:

the first substrate comprises a dielectric material comprising a plurality of elongated electrical conductors embedded therein;

a plurality of first ends of which comprise the first plurality of electrical conductors.

340. A space transformer, according to claim 335, wherein selected ones of the first flexible elongated electrical conductors comprise:

a flexible elongate core element having a first end and a second end and formed of a readily-shaped material;

an electrically conductive coating, formed of a layer of conductive material disposed on the elongate core element.

341. A space transformer, according to claim 340, wherein:

the flexible elongate core element is selected from the group consisting of;

palladium, gold alloy, copper alloy, gold, aluminum, copper, silver, nickel and combinations thereof.

342. A space transformer, according to claim 340, wherein:

the flexible elongate core element has a diameter in the range of from 1 to 5 mils.

343. A space transformer, according to claim 342, wherein:

the flexible elongate core element is a wire.

345. A space transformer, according to claim 340, wherein:

the electrically conductive coating comprising a material selected from the group consisting of Au, Cr, Co, Ni and Pd.

346. A space transformer, according to claim 340, wherein:

the electrically conductive coating comprises nickel and cobalt.

347. A space transformer, according to claim 340, wherein:

the electrically conductive coating comprises a coating selected from the group consisting of nickel, cobalt, chromium, gold and palladium.

348. A space transformer, according to claim 340, wherein:

the electrically conductive coating is formed of a material selected from nickel, cobalt, chromium and gold.

349. A space transformer, according to claim 340, wherein:

the electrically conductive coating is a coating selected from the group consisting of an electroplated coating, an electrolessly plated coating, a sputtered coating and an e-beam evaporated coating.

350. A space transformer, according to claim 349, wherein:

the electrically conductive coating is a thin layer.

351. A space transformer, according to claim 335, wherein:

the substrate is a multi-layer interconnection substrate.

334. A space transformer comprising:

a first substrate comprising on one side thereof first elongated electrical conductors, each having an elongate flexible shape and a respective first end disposed at the one side thereof, and extending therefrom;

a second substrate provided with second electrical contact locations on one side thereof and third electrical contact locations on an opposite side thereof;

the second contact locations facing the first contact locations and each first elongated electrical conductor having a respective second end connected to a respective one of the second electrical contact locations, the second substrate being disassembleable from the first substrate; and

second elongated electrical conductors, each having an elongate flexible shape and a respective first end connected to a respective third electrical contact location of said third electrical contact locations and extending from the respective third electrical contact location,

selected ones of the first elongated electrical conductors are interconnected with selected ones of the second contact locations, and

selected ones of the first contact locations are spaced from one another by first distances, and selected ones of the second elongated electrical conductors have second ends, remotely located from the first ends thereof, which are spaced from one another by second distances.

338. A space transformer, according to claim 334, wherein:

the first substrate is a printed circuit board.

339. A space transformer, according to claim 334, wherein:

selected ones of the second electrical contact locations and selected ones of the third electrical contact locations are electrically interconnected by electrically conductive vias.

344. A space transformer, according to claim 339, wherein:

the flexible elongate core element has a length of about 40 mils.

352. A space transformer, according to claim 334, wherein:

the first distance is different that the second distance.

353. A space transformer, according to claim 334, wherein:

the second substrate is a printed circuit card.

354. A structure comprising:

a first substrate comprising a surface and a plurality of first elongated flexible electrical conductors extending from locations at the surface;

a second substrate comprising first electrical contact locations on one side thereof and second contact locations on an opposite side thereof;

the first contact location facing the surface of the first substrate, and each first elongated flexible electrical conductor of the first substrate have an end electrically connected to a first contact location, the second substrate being disassembleable from the first substrate, and second elongated flexible conductors having a first end electrically connected to a second contact location and extending away therefrom;

selected ones of the first elongated electrical conductors are electrically interconnected with selected ones of the first contact locations;

the first contact locations are spaced apart from one another by a first distance, the second locations are spaced apart from one another by a second distance.

355. A structure, according to claim 354, wherein:

the second distance is different than the first distance.

356. A structure, according to claim 354, wherein:

the second substrate is a printed circuit card.

357. A structure, according to claim 354, wherein:

the first substrate comprises a dielectric material comprising the first plurality of elongated electrical conductors embedded therein;

a plurality of first ends of which comprise the first plurality of electrical conductors.

358. A structure, according to claim 354, wherein:

the first substrate is a printed circuit board.

359. A structure, according to claim 354, wherein:

selected ones of the first electrical contact locations and selected ones of the second electrical contact locations are electrically interconnected by electrically conductive vias.

360. A structure, according to claim 354, wherein selected ones of the first flexible elongated electrical conductors comprise:

a flexible elongate core element having a first end and a second end and formed of a readily-shaped material;

an electrically conductive coating, formed of a layer of conductive material disposed on the elongate core element.

361. A structure, according to claim 360, wherein:

the flexible elongate core element is selected from the group consisting of;

palladium, gold alloy, copper alloy, gold, aluminum, copper, silver, nickel and combinations thereof.

362. A structure, according to claim 360, wherein:

the flexible elongate core element has a diameter in the range of from 1 to 5 mils.

363. A structure, according to claim 362, wherein:

the flexible elongate core element is a wire.

364. A structure, according to claim 360, wherein:

the flexible elongate core element has a length of about 40 mils.

365. A structure, according to claim 360, wherein:

the electrically conductive coating comprising a material selected from the group consisting of Au, Cr, Co, Ni and Pd.

366. A structure, according to claim 360, wherein:

the electrically conductive coating comprises nickel and cobalt.

367. A structure, according to claim 360, wherein:

the electrically conductive coating comprises a coating selected from the group consisting of nickel, cobalt, chromium, gold and palladium.

368. A structure, according to claim 360, wherein:

the electrically conductive coating is formed of a material selected from nickel, cobalt, chromium and gold.

369. A structure, according to claim 360, wherein:

the electrically conductive coating is a coating selected from the group consisting of an electroplated coating, an electrolessly plated coating, a sputtered coating and an e-beam evaporated coating.

370. A structure, according to claim 369, wherein:

the electrically conductive coating is a thin layer.

371. (Amended 1st) A structure, according to claim 355, wherein:

the second substrate is a multi-layer interconnection substrate.

372. (Amended 1st) A structure, according to claim 355, wherein:

the elongated electrical conductor extending from the locations of the surface of the first substrate comprises a wire.

373. A structure comprising:

a first substrate comprising first electrical contact locations and a plurality of first elongated flexible electrical conductors extending from the first electrical contact locations;

a second substrate comprising second electrical contact locations on one side thereof and third contact locations on an opposite side thereof;

the second contact location facing the first contact locations, and each first elongated flexible electrical conductor comprises an end electrically connected to a first contact location, the second substrate being disassembleable from the first substrate, and second elongated flexible conductors having a first end electrically connected to a second contact location and extending away therefrom;

selected ones of the first elongated electrical conductors are electrically interconnected with selected ones of the second contact locations;

the first contact locations are spaced apart from one another by a first distance, the second contact locations are spaced apart from one another by a second distance.

374. A structure, according to claim 373, wherein:

the second distance is different than the first distance.

375. A structure, according to claim 373, wherein:

the second substrate comprises a printed circuit card.

376. A structure, according to claim 373, wherein:

selected elements of the first and second plurality of elongated electrical conductors are embedded in a dielectric material.

377. A structure, according to claim 373, wherein:

the first substrate is a printed circuit board.

378. A structure, according to claim 373, wherein:

selected ones of the second electrical contact locations and selected ones of the third electrical contact locations are electrically interconnected by electrically conductive vias.

379. A structure, according to claim 373, wherein an element selected from the group consisting of selected ones of the first and second flexible elongated electrical conductors comprise:

a flexible elongate core element having a first end and a second end and formed of a readily-shaped material;

an electrically conductive coating, formed of a layer of conductive material disposed on the elongate core element.

380. A structure, according to claim 379, wherein:

the flexible elongate core element is selected from the group consisting of;

palladium, gold alloy, copper alloy, gold, aluminum, copper, silver, nickel and combinations thereof.

381. A structure, according to claim 379, wherein:

the flexible elongate core element has a diameter in the range of from about 1 to 5 mils.

382. A structure, according to claim 381, wherein:

the flexible elongate core element is a wire.

383. A structure, according to claim 379, wherein:

the flexible elongate core element has a length of about 40 mils.

384. A structure, according to claim 379, wherein:

the electrically conductive coating comprising a material selected from the group consisting of Au, Cr, Co, Ni and Pd.

385. A structure, according to claim 379, wherein:

the electrically conductive coating comprises nickel and cobalt.

386. A structure, according to claim 379, wherein:

the electrically conductive coating comprises a coating selected from the group consisting of nickel, cobalt, chromium, gold and palladium.

387. A structure, according to claim 379, wherein:

the electrically conductive coating is formed of a material selected from nickel, cobalt, chromium and gold.

388. A structure, according to claim 379, wherein:

the electrically conductive coating is a coating selected from the group consisting of an electroplated coating, an electrolessly plated coated, a sputtered coating and an e-beam evaporated coating.

389. A structure, according to claim 388, wherein:

the electrically conductive coating is a thin layer.

390. A structure, according to claim 373, wherein:

an element selected from the group consisting of the first and the second substrate is a multi-layer interconnection substrate.

391. A structure, according to claim 373, wherein:

the second substrate comprises a fan out substrate.

392. A structure, according to claim 373, wherein:

the first and second elongated electrical conductors are embedded in a dielectric layer and the second substrate is a fan out substrate.