VERTICAL CAPACITOR APPARATUS, SYSTEMS, AND METHODS

• US 20050063137A1
• Filed: 09/24/2003
• Published: 03/24/2005
• Est. Priority Date: 09/24/2003
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: He, Jiangqi, Kim, Joong-Ho, Kim, Hyunjun, Han, Dong-Ho
• Granted Patent: US 6,885,544 B2
• Time in Patent Office: Days
• US Class Current: 361/306.100
• CPC Class Codes: H01G 2/06 specially adapted for mounting on a printed-circuit support
• CPC Class Codes: H01G 4/228 Terminals
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates.

Claims

1. An apparatus, comprising:

at least one first vertically-oriented plate having a first terminal coupled to a first bottom side;

at least one second vertically-oriented plate having a second terminal coupled to a second bottom side; and

a dielectric body, wherein the first vertically-oriented plate and the second vertically-oriented plate are spaced apart and partially disposed within the dielectric body.

2. The apparatus of claim 1, further comprising:

a plurality of first vertically-oriented plates coupled to the first terminal; and

a plurality of second vertically-oriented plates coupled to the second terminal, wherein the plurality of first vertically-oriented plates and the plurality of second vertically-oriented plates are spaced apart and partially disposed within the dielectric body.

3. The apparatus of claim 2, wherein the plurality of first vertically-oriented plates and the plurality of second vertically-oriented plates have a height in the vertical direction that is greater than a horizontal thickness of the apparatus including a combined thickness of the plurality of first vertically-oriented plates and the plurality of second vertically-oriented plates.

4. The apparatus of claim 2, wherein the plurality of first vertically-oriented plates and the plurality of second vertically-oriented plates are substantially planar.

5. The apparatus of claim 2, wherein the plurality of first vertically-oriented plates and the plurality of second vertically-oriented plates are substantially rectangular.

25. The apparatus of claim 1, wherein a vertical surface area of the at least one first vertically-oriented plate is more than twice as large as a bottom surface area of a package housing the at least one first vertically-oriented plate, the at least one second vertically-oriented plate, and the dielectric body.

26. The apparatus of claim 1, further comprising:

a first plurality of pads coupled to the first terminal; and

a second plurality of pads coupled to the second terminal.

6. An apparatus, comprising:

at least one first vertically-oriented plate having a first terminal coupled to a first bottom side;

at least one second vertically-oriented plate having a second terminal coupled to a second bottom side; and

a dielectric body, wherein the first vertically-oriented plate and the second vertically-oriented plate are spaced apart and disposed adjacent the dielectric body.

7. The apparatus of claim 6, further comprising:

a plurality of first vertically-oriented plates coupled to the first terminal;

a plurality of second vertically-oriented plates coupled to the second terminal; and

a plurality of dielectric bodies, wherein the plurality of first vertically-oriented plates and the plurality of second vertically-oriented plates are spaced apart and adjacent at least one of the plurality of dielectric bodies.

8. The apparatus of claim 6, wherein a vertical surface area of one of the plurality of first vertically-oriented plates is more than twice as large as a bottom surface area of a package housing the plurality of first vertically-oriented plates, the plurality of second vertically-oriented plates, and the plurality of dielectric bodies.

9. The apparatus of claim 6, further comprising:

a first plurality of pads coupled to the first terminal; and

a second plurality of pads coupled to the second terminal.

27. The apparatus of claim 6, further comprising:

a plurality of first vertically-oriented plates coupled to the first terminal; and

a plurality of second vertically-oriented plates coupled to the second terminal, wherein the plurality of first vertically-oriented plates and the plurality of second vertically-oriented plates are spaced apart and partially disposed within the dielectric body.

10. A system, comprising:

a power supply having a source terminal and a return terminal;

a receiver coupled to the power supply;

an antenna coupled to the receiver; and

a capacitor having at least one first vertically-oriented plate having a first terminal coupled to a first bottom side and to the source terminal, at least one second vertically-oriented plate having a second terminal coupled to a second bottom side and to the return terminal, and a dielectric body, wherein the first vertically-oriented plate and the second vertically-oriented plate are spaced apart and disposed adjacent the dielectric body.

11. The system of claim 10, wherein the antenna comprises an omni-directional antenna.

12. The system of claim 10, wherein the receiver comprises a portion of a transceiver.

13. The system of claim 10, further comprising:

a circuit board coupled to the capacitor, wherein a planar surface of the circuit board is oriented in a substantially horizontal fashion, and wherein the at least one first vertically-oriented plate and the at least one second vertically-oriented plate are oriented in a substantially vertical fashion with respect to the planar surface.

14. The system of claim 10, further comprising:

a plurality of first vertically-oriented plates coupled to the first terminal;

a plurality of second vertically-oriented plates coupled to the second terminal; and

a plurality of dielectric bodies, wherein the plurality of first vertically-oriented plates and the plurality of second vertically-oriented plates are spaced apart and adjacent at least one of the plurality of dielectric bodies.

15. The system of claim 14, further comprising:

a circuit board coupled to the capacitor, wherein a planar surface of the circuit board is oriented in a substantially horizontal fashion, and wherein the plurality of first vertically-oriented plates and the plurality of second vertically-oriented plates are oriented in a substantially vertical fashion with respect to the planar surface.

28. The system of claim 10, further comprising:

a plurality of first vertically-oriented plates coupled to the first terminal; and

a plurality of second vertically-oriented plates coupled to the second terminal, wherein the plurality of first vertically-oriented plates and the plurality of second vertically-oriented plates are spaced apart and partially disposed within the dielectric body.

16. A method, comprising:

constructing a capacitor by forming a dielectric body between a first vertically-oriented plate having a first terminal coupled to a first bottom side and a second vertically-oriented plate having a second terminal coupled to a second bottom side.

17. The method of claim 16, further comprising:

forming a plurality of first vertically-oriented plates to couple to the first terminal; and

forming a plurality of second vertically-oriented plates to couple to the second terminal.

18. The method of claim 17, further comprising:

coupling the plurality of first vertically-oriented plates to the first terminal; and

coupling the plurality of second vertically-oriented plates to the second terminal.

19. The method of claim 16, wherein the first vertically-oriented plate and the second vertically-oriented plate comprise nickel, and wherein the dielectric body comprises a ceramic material.

20. A method, comprising:

operating a field programmable gate array coupled to a capacitor having a dielectric body disposed between a first vertically-oriented plate having a first terminal coupled to a first bottom side and a second vertically-oriented plate having a second terminal coupled to a second bottom side.

21. The method of claim 20, wherein operating the field programmable gate array further comprises:

executing a plurality of Boolean logic instructions.

22. The method of claim 20, wherein the capacitor further comprises:

a plurality of first vertically-oriented plates coupled to the first terminal; and

a plurality of second vertically-oriented plates coupled to the second terminal.

23. The method of claim 20, further comprising:

operating a transceiver coupled to the field programmable gate array.

24. The method of claim 20, wherein a circuit board having a planar surface oriented in a substantially horizontal fashion is coupled to the capacitor, and wherein the at least one first vertically-oriented plate and the at least one second vertically-oriented plate are oriented in a substantially vertical fashion with respect to the planar surface.