Ceramic packaging for high brightness LED devices
First Claim
Patent Images
1. A light emitting diode package comprising:
- a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for minimizing light leakage; and
a metallic coating on a portion of said ceramic substrate for reflecting light in a predetermined direction.
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Abstract
Embodiments of the present invention include a light emitting diode package comprising a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for reducing light leakage. The ceramic LED package further includes a metallic coating on a portion of the ceramic substrate for reflecting light in a predetermined direction.
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Citations
19 Claims
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1. A light emitting diode package comprising:
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a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for minimizing light leakage; and
a metallic coating on a portion of said ceramic substrate for reflecting light in a predetermined direction. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for manufacture of a light emitting diode package comprising:
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forming a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for reducing light leakage;
coating a portion of said ceramic cavity with a light reflective material;
positioning a light emitting diode on said substrate; and
depositing an optically-transparent material in said cavity to protect said light emitting diode. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A light source comprising:
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a ceramic cavity comprising a substrate for mounting a light emitting diode and sidewalls for reducing light leakage;
a metallic coating on a portion of said ceramic substrate for reflecting light in a predetermined direction;
a light emitting diode coupled to said substrate; and
an optically transparent coating for protecting said light emitting diode. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification