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Method and apparatus for network with multilayer metalization

  • US 20050063373A1
  • Filed: 07/23/2004
  • Published: 03/24/2005
  • Est. Priority Date: 07/24/2003
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • a plurality of processing elements;

    one or more first dimension channels;

    each first dimension channel comprising;

    a plurality of first dimension interconnect paths, wherein at least some of the first dimension interconnect paths are coupled to at least some of the processing elements; and

    a plurality of first dimension interconnect switches, wherein at least some first dimension interconnect switches are coupled to at least some of the first dimension interconnect paths to connect selected processing elements to other selected processing elements, and wherein the plurality of first dimension interconnect paths and the plurality of first dimension interconnect switches are arranged to form one or more first dimension hierarchical levels, each first dimension hierarchical level comprising one or more first dimension parent segments, each first dimension parent segment having one or more corresponding first dimension child segments, the one or more corresponding first dimension child segments connected to the corresponding first dimension parent segment and wherein at least one first dimension child segment is also connected to a different first dimension parent segment within the same first dimension hierarchical level or wherein at least one first dimension child segment is also connected to a different first dimension parent segment at a different first dimension hierarchical level; and

    one or more second dimension channels;

    each second dimension channel comprising;

    a plurality of second dimension interconnect paths, wherein at least some of the second dimension interconnect paths are coupled to at least some of the processing elements; and

    a plurality of second dimension interconnect switches, wherein at least some second dimension interconnect switches are coupled to at least some of the second dimension interconnect paths to connect selected processing elements to other selected processing elements, and wherein the plurality of second dimension interconnect paths and the plurality of second dimension interconnect switches are arranged to form one or more second dimension hierarchical levels, each second dimension hierarchical level comprising one or more second dimension parent segments, each second dimension parent segment having one or more corresponding second dimension child segments, the one or more corresponding second dimension child segments connected to the corresponding second dimension parent segment and wherein at least one second dimension child segment is also connected to a different second dimension parent segment within the same second dimension hierarchical level or wherein at least one second dimension child segment is also connected to a different second dimension parent segment at a different second dimension hierarchical level, and wherein each processing element is either connected to at least one first dimension child segment at a lowest level of the first dimension hierarchical levels, or is connected to at least one second dimension child segment at a lowest level of the second dimension hierarchical levels, or is connected to at least one first dimension child segment at a lowest level of the first dimension hierarchical levels and to at least one second dimension child segment at a lowest level of the second dimension hierarchical levels.

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