Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures

• US 20050067292A1
• Filed: 05/07/2004
• Published: 03/31/2005
• Est. Priority Date: 05/07/2002
• Status: Abandoned Application

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Cohen, Adam L., Lockard, Michael S., Thompson, Jeffrey A.
• Application Number:
  US10/841,006
• Publication Number:
  US 20050067292A1
• Time in Patent Office: Days
• US Class Current: 205/118
• CPC Class Codes: B81C 1/00373 Selective deposition, e.g. printing or microcontact printing
• CPC Class Codes: B81C 2201/0181 Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers

Abstract

Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Claims

1. An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:

(A) selectively depositing at least a portion of a layer onto a temporary substrate, wherein the temporary substrate may comprise previously deposited material;

(B) forming a plurality of layers such that successive layers are formed adjacent to and adhered to previously deposited layers, wherein said forming comprises repeating operation (A) a plurality of times;

(C) after formation of a plurality of layers, attaching a structural substrate comprising a dielectric material to at least a portion of a layer of the structure and removing at least a portion of the temporary substrate from the structure.

2. The process of claim 1 additionally comprising:

(D) supplying a plurality of preformed masks, wherein each mask comprises a patterned dielectric material that includes at least one opening through which deposition can take place during the formation of at least a portion of a layer, and wherein each mask comprises a support structure that supports the patterned dielectric material,

wherein at least a plurality of the selective depositing operations comprise;

(1) contacting the temporary substrate and the dielectric material of a selected preformed mask;

(2) in presence of a plating solution, conducting an electric current through the at least one opening in the selected mask between an anode and the temporary substrate, wherein the anode comprises a selected deposition material, and wherein the temporary substrate functions as a cathode, such that the selected deposition material is deposited onto the temporary substrate to form at least a portion of a layer; and

(3) separating the selected preformed mask from the temporary substrate.

3. The process of claim 1 wherein a plurality of selective depositing operations comprise:

(1) providing an adhered patterned mask on a surface of the substrate, wherein the mask includes at least one opening;

(2) in presence of a plating solution, conducting an electric current through the at least one opening in the adhered mask between an anode and the substrate, wherein the anode comprises a selected deposition material, and wherein the substrate functions as a cathode, such that the selected deposition material is deposited onto the temporary substrate to form at least a portion of a layer; and

(3) removing the mask from the substrate.

4. The process of claim 1 wherein the attaching operation comprises placing a dielectric adhesive onto at least one of the structural substrate or the at least portion of the layer to which attachment is to occur and then bringing the structural substrate and at least portion of the layer into contact.

5. The process of claim 1 wherein the structural substrate is a preformed sheet that is bonded to the at least portion of the layer.

6. The process of claim 1 wherein the structural substrate comprises a flowable material that is contacted to the at least portion of the layer and is thereafter allowed to solidify or is made to solidify.

7. The process of claim 6, wherein the flowable material comprises a pre-polymer.

8. The process of claim 7 wherein the pre-polymer comprises a two-part epoxy.

9. The process of claim 1 wherein the structural substrate comprises a flexible material.

10. The process of claim 1 wherein the attaching operation causes the structural substrate to at least partially surround at least a portion of a layer of the deposited structure.

11. The process of claim 1 wherein the formation of a plurality of layers includes the deposition of at least a second material.

12. The process of claim 1 wherein the attaching of the structural substrate to the structure comprises a mechanical interlocking of portions of the substrate with portions of the structure.

13. The process of claim 11 wherein one of the selected deposition material or the second material comprises a structural material and the other comprises a sacrificial material.

14. The process of claim 11 wherein the second material is a structural material and the selected deposition material is a sacrificial material

15. The process of claim 11 wherein the selected deposition material is a structural material and the second material is a sacrificial material.

16. The process of claim 13 wherein at least a portion of the sacrificial material is removed prior to attaching the structural substrate.

17. The process of claim 16 wherein the at least portion of the region from which sacrificial material that was removed is filled with a dielectric material.

18. The process of claim 17 wherein the structural substrate comprises the dielectric material.

19. The process of claim 13 wherein the structural substrate is attached to the at least portion of the layer prior to removal of the sacrificial material.

20. The process of claim 13 wherein upon release of the structural material from the sacrificial material the structural material is also released from the temporary substrate.

21. The process of claim 1 wherein the structural substrate comprises an electrical component.

22. The process of claim 1 wherein the structural substrate comprises an integrated circuit.

23. The process of claim 1 wherein the attaching operation comprises one or more wire bonding operations that attach one or more portions of the structure to one or more portions of the structural substrate.

24. The process of claim 1 wherein the attaching operation comprises one or forming one or more reflowed solder contacts between one or more portions of the structure and one or more portions of the structural substrate.

25. An electrochemical fabrication apparatus for producing a three-dimensional structure from a plurality of adhered layers, the apparatus comprising:

(A) means for selectively depositing at least a portion of a layer onto a temporary substrate, wherein the temporary substrate may comprise previously deposited material; and

(B) means for forming a plurality of layers such that successive layers are formed adjacent to and adhered to previously deposited layers, wherein said forming comprises repeating operation (A) a plurality of times;

(C) means for attaching a structural substrate comprising a dielectric material to at least a portion of a layer of the structure and removing at least a portion of the temporary substrate from the structure; and

(D) a computer programmed to control the means for contacting, the means for conducting, the means for separating, and the means for attaching, such that the means for attaching is made to operate after formation of a plurality of layers of the structure.

26. The apparatus of claim 25 additionally comprising:

(D) a plurality of preformed masks, wherein each mask comprises a patterned dielectric material that includes at least one opening through which deposition can take place during the formation of at least a portion of a layer, and wherein each mask comprises a support structure that supports the patterned dielectric material;

wherein the means for selectively depositing comprises;

(1) means for contacting the temporary substrate and the dielectric material of a selected preformed mask;

(2) means for conducting an electric current through the at least one opening in the selected mask between an anode and the temporary substrate in presence of a plating solution, wherein the anode comprises a selected deposition material, and wherein the temporary substrate functions as a cathode, such that the selected deposition material is deposited onto the temporary substrate to form at least a portion of a layer; and

(3) means for separating the selected preformed mask from the temporary substrate.

27. The apparatus of claim 25 wherein the means for selectively depositing comprises:

(1) means for providing an adhered patterned mask on a surface of the substrate, wherein the mask includes at least one opening;

(2) means for conducting an electric current through the at least one opening in the adhered mask between an anode and the substrate in presence of a plating solution, wherein the anode comprises a selected deposition material, and wherein the substrate functions as a cathode, such that the selected deposition material is deposited onto the temporary substrate to form at least a portion of a layer; and

(3) means for removing the mask from the substrate.

28. An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:

(A) selectively depositing at least a portion of a layer onto a first temporary substrate, wherein the first temporary substrate may comprise previously deposited material; and

(B) forming a plurality of layers such that successive layers are formed adjacent to and adhered to previously deposited layers; and

(C) after formation of a plurality of layers attaching a second temporary substrate, which comprises a dielectric material, to at least a portion of a layer of the structure and removing at least a portion of the first temporary substrate from the structure, and then attaching a structural substrate to at least a portion of a layer of the structure that at least partially overlaps a location where the first temporary substrate was attached.

29. The process of claim 28 wherein a plurality of selective depositing operations comprise:

(1) providing an adhered patterned mask on a surface of the substrate, wherein the mask includes at least one opening;

(2) in presence of a plating solution, conducting an electric current through the at least one opening in the adhered mask between an anode and the substrate, wherein the anode comprises a selected deposition material, and wherein the substrate functions as a cathode, such that the selected deposition material is deposited onto the temporary substrate to form at least a portion of a layer; and

(3) removing the mask from the substrate.

30. An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:

(A) selectively depositing at least a portion of a layer onto a sacrificial substrate, wherein the temporary substrate may comprise previously deposited material;

(B) forming a plurality of layers such that each successive layer is formed adjacent to and adhered to a previously deposited layer, wherein said forming comprises repeating operation (A) a plurality of times;

(C) after formation of a plurality of layers attaching a structural substrate, comprising a plurality of materials and/or a patterned structure, to at least a portion of a layer of the structure and removing at least a portion of the temporary substrate from the structure.

31. The process of claim 30 additionally comprising:

(A) supplying a plurality of preformed masks, wherein each mask comprises a patterned dielectric material that includes at least one opening through which deposition can take place during the formation of at least a portion of a layer, and wherein each mask comprises a support structure that supports the patterned dielectric material; and

wherein at least a plurality of the selective depositing operations comprise

(1) contacting the temporary substrate and the dielectric material of a selected preformed mask;

(2) in presence of a plating solution, conducting an electric current through the at least one opening in the selected mask between an anode and the sacrificial substrate, wherein the anode comprises a selected deposition material, and wherein the temporary substrate functions as a cathode, such that the selected deposition material is deposited onto the temporary substrate to form at least a portion of a layer; and

(3) separating the selected preformed mask from the sacrificial substrate.

32. The process of claim 30 wherein a plurality of selective depositing operations comprise:

(1) providing an adhered patterned mask on a surface of the substrate, wherein the mask includes at least one opening;

(2) in presence of a plating solution, conducting an electric current through the at least one opening in the adhered mask between an anode and the substrate wherein the anode comprises a selected deposition material, and wherein the substrate functions as a cathode, such that the selected deposition material is deposited onto the temporary substrate to form at least a portion of a layer; and

(3) removing the mask from the substrate.

33. An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:

(A) selectively depositing at least a portion of a layer onto a first temporary substrate, wherein the first temporary substrate may comprise previously deposited material; and

(B) forming a plurality of layers such that successive layers are formed adjacent to and adhered to previously deposited layers; and

(C) after formation of a plurality of layers attaching a second temporary substrate, which comprises a plurality of materials and/or comprises a patterned structure, to at least a portion of a layer of the structure and removing at least a portion of the first temporary substrate from the structure and then attaching a structural substrate to at least a portion of a layer of the structure that at least partially overlaps a location where the first temporary substrate was attached.

34. The process of claim 33 wherein a plurality of selective depositing operations comprise:

(1) providing an adhered patterned mask on a surface of the substrate, wherein the mask includes at least one opening;

(2) in presence of a plating solution, conducting an electric current through the at least one opening in the adhered mask between an anode and the substrate, wherein the anode comprises a selected deposition material, and wherein the substrate functions as a cathode, such that the selected deposition material is deposited onto the temporary substrate to form at least a portion of a layer; and

(3) removing the mask from the substrate.

35. An electrochemical fabrication process for producing a multi-part three-dimensional structure wherein at least one part is produced from a plurality of adhered layers, the process comprising:

(A) forming at least one part of the multi-part structure, comprising;

(1) selectively depositing at least a portion of a layer onto a substrate, wherein the substrate may comprise previously deposited material;

(2) forming a plurality of layers such that successive layers are formed adjacent to and adhered to previously deposited layers, wherein said forming comprises repeating operation (1) a plurality of times;

(B) supplying at least one additional part of the multi-part structure;

(C) attaching the at least one part to the at least one additional part to form the multi-part structure.

36. The process of claim 35 wherein a plurality of selective depositing operations comprise:

(1) providing an adhered patterned mask on a surface of the substrate, wherein the mask includes at least one opening;

(2) in presence of a plating solution, conducting an electric current through the at least one opening in the adhered mask between an anode and the substrate, wherein the anode comprises a selected deposition material, and wherein the substrate functions as a cathode, such that the selected deposition material is deposited onto the temporary substrate to form at least a portion of a layer; and

(3) removing the mask from the substrate.

37. The electrochemical fabrication process of claim 35 additionally comprising separating the at least one part of the multi-part structure from the substrate.