Producing method of flexible wired circuit board

• US 20050067293A1
• Filed: 09/28/2004
• Published: 03/31/2005
• Est. Priority Date: 09/29/2003
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Naito, Toshiki, Yamato, Takeshi, Shinogi, Yoshifumi
• Granted Patent: US 7,323,093 B2
• Time in Patent Office: Days
• US Class Current: 205/125
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673

Abstract

A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive pattern 3 on a surface of the elongate substrate 1 by the semi-additive process using electrolysis plating and then annealing the elongate substrate 1 with the conductive pattern 3 in its wound up state, a stiffener sheet 9 having a width narrower than the elongate substrate 1 is bonded to the back side of the elongate substrate 1. Thereafter, an oxidized film formed on a surface of the conductive pattern 3 is removed and then a solder resist 11 is formed thereon. This prevents the strip of the stiffener sheet 9 from the elongate substrate 1 and in turn prevents etching solution or developing solution from entraining in a gap therebetween.

Claims

1. A producing method of a flexible wired circuit board, comprising:

the process of forming a conductive pattern on a surface of an elongate substrate by electrolysis plating, and

the process of providing a stiffener sheet having a width narrower than the elongate substrate on a back side of the elongate substrate opposite to the front side where the conductive pattern is formed.

2. The producing method of the flexible wired circuit board according to claim 1, wherein the stiffener sheet is provided on the elongate substrate, with its widthwise edge placed 1-10 mm inwardly from widthwise edge of the elongate substrate.

3. The producing method of the flexible wired circuit board according to claim 1, wherein the elongate substrate has a thickness of 5-50 μ

m.