Method for connecting connection members to board

• US 20050067472A1
• Filed: 11/23/2004
• Published: 03/31/2005
• Est. Priority Date: 01/22/2003
• Status: Abandoned Application

• Current Assignee: DDK Limited (Fujikura Limited)
• Original Assignee: DDK Limited (Fujikura Limited)
• Inventors: Yamazaki, Yasue, Ohtsuki, Tomonari
• Application Number:
  US10/996,152
• Publication Number:
  US 20050067472A1
• Time in Patent Office: Days
• US Class Current: 228/248.100
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 3/087 Soldering or brazing jigs, fixtures or clamping means
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0949 Pad close to a hole, not surrounding the hole if used for surface mounting H05K1/114
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10424 Frame holders
• CPC Class Codes: H05K 2203/0165 Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence

Abstract

A method for connecting connection members to through-holes of a board by soldering is disclosed. The board is press holded on its one side by a jig, and paste solder or solder in paste form is forced to flow into each of the through-holes of the board from the opposite side by a paste solder printing method using a printing mask. The printing mask is then removed under the condition of the paste solder being filled in the through-holes. After the connection members have been inserted in the through-holes of the board or have been urged against the board on the opposite side, the connection members are further connected to the board by reflow soldering, while the board is still continuously restrained or press holded on the one side by the jig. In this manner, it become possible to form any desired shapes of a plurality of solder connection portions connected to the board on the one side. As a result, the solder connection portions can be formed to be a predetermined height to prevent them from interfering deformation of contacts to provide a constant contact pressure of the contacts, thereby eliminating defective or failed connection.

Claims

1. A method for connecting connection members to through-holes of a board by soldering, comprising steps of:

press holding said board on its one side by a jig;

forcing to flow paste solder into each of said through-holes of the board from the opposite side by a paste solder printing method using a printing mask;

removing said printing mask in the state of the paste solder being filled in said through-holes;

inserting or urging connection members into or against said through-holes of said board on the opposite side, respectively; and

further soldering said connection members to said board by reflow soldering, while said board is still continuously press holded on said one side by said jig, thereby enabling to form required shapes of a plurality of solder connection portions connected to said board on said one side.

2. The method for connecting connection members to a board as set forth in claim 1 wherein shapes of said jig at locations corresponding to said through-holes of the board are formed so as to obtain said required shapes of the solder connection portions on said one side.

3. The method for connecting connection members to a board as set forth in claim 2 wherein said shapes of said jig at locations corresponding to said through-holes of the board are formed in a shape selected from a group consisting of flat, raised and recessed shapes.