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Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

  • US 20050067682A1
  • Filed: 09/28/2004
  • Published: 03/31/2005
  • Est. Priority Date: 09/30/2003
  • Status: Abandoned Application
First Claim
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1. A semiconductor device comprising:

  • a first semiconductor chip; and

    a second semiconductor chip mounted on the first semiconductor chip, wherein an upper surface of the first semiconductor chip is a plasma treatment surface, and the second semiconductor chip is mounted on the plasma treatment surface.

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