Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
First Claim
1. A capped chip, comprising:
- a chip having a front surface and a plurality of bond pads exposed at said front surface;
a cap member having a bottom surface facing said front surface of said chip and having a top surface opposite said front surface, said cap member further having a plurality of through holes extending from said bottom surface to said top surface; and
a plurality of metallic interconnects extending from said bond pads at least partially through said through holes, said metallic interconnects including stud bumps joined to said bond pads, said stud bumps contacting and engaging at least one of (i) said top surface of said cap member surrounding said through holes and (ii) inner surfaces of said through holes.
3 Assignments
0 Petitions
Accused Products
Abstract
A capped chip is provided which includes a chip and a cap member, the chip having a front surface and a plurality of bond pads exposed at the front surface, the cap member having a bottom surface facing the front surface of the chip and having a top surface opposite the front surface. A plurality of through holes extend from the bottom surface of the cap member to the top surface. The capped chip assembly further includes a plurality of metallic interconnects extending from the bond pads at least partially through the through holes, the metallic interconnects including stud bumps joined to the bond pads, the stud bumps contacting and engaging at least one of (i) the top surface of the cap member surrounding the through holes and (ii) inner surfaces of the through holes.
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Citations
12 Claims
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1. A capped chip, comprising:
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a chip having a front surface and a plurality of bond pads exposed at said front surface;
a cap member having a bottom surface facing said front surface of said chip and having a top surface opposite said front surface, said cap member further having a plurality of through holes extending from said bottom surface to said top surface; and
a plurality of metallic interconnects extending from said bond pads at least partially through said through holes, said metallic interconnects including stud bumps joined to said bond pads, said stud bumps contacting and engaging at least one of (i) said top surface of said cap member surrounding said through holes and (ii) inner surfaces of said through holes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of making a capped chip comprising the steps of:
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(a) assembling at least one chip with at least one cap so that stud bumps project from said chip at least partially through through-holes in said cap; and
(b) deforming said stud bumps into engagement with at least one of (i) a top surface of said cap surrounding the through-holes and (ii) walls of said through holes. - View Dependent Claims (11, 12)
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Specification