Method and structure for cooling a dual chip module with one high power chip
First Claim
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1. A cooling structure for an integrated circuit structure having multiple integrated circuit chips, said cooling structure comprising:
- a plurality of heat spreaders, wherein the lower side of each of said heat spreaders is connected to the top of a corresponding one of said integrated circuit chips; and
a heat dissipating structure connected to the upper sides of said heat spreaders through a thermally conductive material, wherein said thermally conductive material is positioned in gaps between the upper sides of said heat spreaders and the bottom of said heat dissipating structure, and wherein the smallest of said gaps exists between the top of the heat spreader that is connected to the integrated circuit chip that produces the most thermal energy, relative to the other integrated circuit chips, and the bottom of said heat dissipating structure.
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Abstract
Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mates to a heat sink with the smallest interface gap. The variable and higher gaps between the lower power spreaders and the heat sink base are accommodated by compressible thermal pad or grease materials.
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Citations
26 Claims
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1. A cooling structure for an integrated circuit structure having multiple integrated circuit chips, said cooling structure comprising:
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a plurality of heat spreaders, wherein the lower side of each of said heat spreaders is connected to the top of a corresponding one of said integrated circuit chips; and
a heat dissipating structure connected to the upper sides of said heat spreaders through a thermally conductive material, wherein said thermally conductive material is positioned in gaps between the upper sides of said heat spreaders and the bottom of said heat dissipating structure, and wherein the smallest of said gaps exists between the top of the heat spreader that is connected to the integrated circuit chip that produces the most thermal energy, relative to the other integrated circuit chips, and the bottom of said heat dissipating structure. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A cooling structure for an integrated circuit structure, said cooling structure comprising:
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a chip carrier comprising multiple integrated circuit chips;
a cap connected to said chip carrier and to the top of the integrated circuit chip that produces the most thermal energy, relative to the other integrated circuit chips;
a plurality of heat spreaders, wherein the lower side of each of said heat spreaders is connected to the top of a corresponding integrated circuit chip of said other integrated circuit chips; and
a heat dissipating structure connected to the upper sides of said heat spreaders and said cap through a thermally conductive material, wherein said thermally conductive material is positioned in gaps, wherein said gaps exist between the tops of said heat spreaders and the bottom of heat dissipating structure, and between the upper side of said cap and the bottom of said heat dissipating structure, and wherein the smallest of said gaps exists between the upper side of said cap and the bottom of said heat dissipating structure. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A cooling structure for an integrated circuit structure having multiple integrated circuit chips, said cooling structure comprising:
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a heat spreader connected to the integrated circuit chip that produces the most thermal energy, relative to the other integrated circuit chips; and
a heat dissipating structure connected to the upper side of said heat spreader and to the upper sides of said other integrated circuit chips, wherein thermally conductive material is positioned in gaps, wherein said gaps exist between the upper side of said heat spreader and the bottom of said heat dissipating structure, and between the upper sides of said integrated circuit chips and the bottom of said heat dissipating structure, and wherein the smallest of said gaps exists between the upper side of said heat spreader and the bottom of said heat dissipating structure. - View Dependent Claims (16, 17, 18, 20, 21)
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22. A cooling structure for an integrated circuit structure, said cooling structure comprising:
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a chip carrier comprising multiple integrated circuit chips;
a heat dissipating structure connected to the upper sides of said integrated circuit chips through a thermally conductive material, wherein said thermally conductive material is positioned in gaps between the upper sides of said integrated circuit chips and the bottom of said heat dissipating structure, and wherein said heat dissipating structure is shaped such that the smallest of said gaps exists between the top of the integrated circuit chip that produces the most thermal energy, relative to the other integrated circuit chips, and the bottom of said heat dissipating structure. - View Dependent Claims (23, 24, 25, 26)
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Specification