×

Wafer mobile phone platform system

  • US 20050070225A1
  • Filed: 09/25/2003
  • Published: 03/31/2005
  • Est. Priority Date: 09/25/2003
  • Status: Active Grant
First Claim
Patent Images

1. A wafer mobile phone platform system for transmitting voice and data over a wireless communication network, said system comprising:

  • a mobile phone wafer, said mobile phone wafer adaptable for connection to a peripheral device;

    a transceiver unit on said mobile phone wafer, said transceiver unit having telephone circuitry and componentry adaptable for connection to said wireless communication network for sending and receiving voice and data communications;

    a source of electrical power on said mobile phone wafer, said source of electrical power operatively connected to said transceiver unit;

    a communication device on said mobile phone wafer, said communication device configured to transmit voice and data communications between said transceiver unit and said peripheral device; and

    an antenna coupled to said transceiver unit, wherein said mobile phone wafer can be selectively and operatively connected to said peripheral device to interface said transceiver unit with said peripheral device to allow a user to utilize said peripheral device for wireless voice and data communication.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×