Integrated optical filter

• US 20050073605A1
• Filed: 10/06/2003
• Published: 04/07/2005
• Est. Priority Date: 10/06/2003
• Status: Abandoned Application

• Current Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Burns, Jeffrey H.
• Application Number:
  US10/679,752
• Publication Number:
  US 20050073605A1
• Time in Patent Office: Days
• US Class Current: 348/374
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

The present invention involves an optical sensor assembly including an optically transmissive substrate and an integrated circuit having an optical imaging element. The optically transmissive substrate includes an integral filter element and the integrated circuit includes an optical imaging element which is located on a face of the integrated circuit facing the substrate. The filter material may be dispersed, embedded, or otherwise formed within the substrate, or provided as a thin film layer on a surface of the substrate.

Claims

1. An optical sensor circuit assembly, comprising:

an optically transmissive substrate including filter material; and

an optical imaging element coupled to said substrate.

2. The optical sensor circuit assembly of claim 1, wherein said filter material is embedded in said substrate.

3. The optical sensor circuit assembly of claim 1, wherein said filter material is dispersed in said substrate.

4. The optical sensor circuit assembly of claim 1, wherein said filter material comprises a thin film layer on said substrate.

5. The optical sensor circuit assembly of claim 4, wherein said thin film layer further comprises material having antireflective properties.

6. The optical sensor circuit assembly of claim 1, further comprising a circuit member coupled to a first surface of said substrate, said circuit member defining a plurality of electrically conductive leads.

7. The optical sensor circuit assembly of claim 6, wherein said optical imaging element includes an integrated circuit and a plurality of electrically conductive pads, said plurality of pads coupled with corresponding ones of said plurality of leads.

8. The optical sensor circuit assembly of claim 7, further comprising a conductive bump disposed between said plurality of leads and said plurality of pads.

9. The optical sensor circuit assembly of claim 1, further comprising at least one optical element positioned to direct electromagnetic radiation through said substrate and filter material and to said optical imaging element.

10. The optical sensor circuit assembly of claim 9, further comprising a lens mount supporting said at least one optical element and coupled to a second surface of said substrate.

11. An optical sensor circuit assembly, comprising:

an optically transmissive substrate;

a thin film optical material coupled to said substrate;

an integrated circuit having a face including an optical imaging element, said face coupled with at least one of said substrate and said optical material.

12. The optical sensor circuit assembly of claim 11, wherein said thin film optical material comprises at least one of a filter and antireflective material.

13. The optical sensor circuit assembly of claim 11, wherein:

said thin film optical material comprises an antireflective material; and

said optically transmissive substrate comprises a filter material at least one of embedded and dispersed in said substrate.

14. The optical sensor circuit assembly of claim 11, wherein:

said integrated circuit further comprises a plurality of electrically conductive pads; and

said assembly further comprises;

a circuit member coupled to said substrate, said circuit member defining a plurality of electrically conductive leads; and

a plurality of conductive bumps disposed between said plurality of leads and said plurality of pads.

15. The optical sensor circuit assembly of claim 11, further comprising at least one lens positioned to direct electromagnetic radiation through said substrate and filter material and to said optical imaging element.

16. The optical sensor circuit assembly of claim 15, further comprising a lens mount supporting said at least one optical element and coupled to a second surface of said substrate.

17. A method of assembling an optical sensor assembly, comprising the steps of:

providing an optically transmissive substrate;

associating at least one of a filter material and an antireflective material with the optically transmissive substrate; and

coupling an integrated circuit including an optical imaging element with the optically transmissive substrate, and positioning the integrated circuit so that the optical imaging element faces the substrate.

18. The method of claim 17, further comprising the step of coupling a circuit member to the substrate;

and wherein the step of coupling an integrated circuit with the optically transmissive substrate includes coupling the optical imaging element to the circuit member using conductive bumps.

19. The method of claim 17, further comprising the steps of coupling an optical element to the substrate using a lens mount.