Method for manufacturing solid-state imaging devices

• US 20050074912A1
• Filed: 08/27/2004
• Published: 04/07/2005
• Est. Priority Date: 09/03/2003
• Status: Active Grant

• Current Assignee: Panasonic Semiconductor Solutions Co., Ltd. (Winbond Electronics Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Minamio, Masanori, Shimizu, Katsutoshi, Yamauchi, Kouichi, Nagata, Haruto
• Granted Patent: US 7,247,509 B2
• Time in Patent Office: Days
• US Class Current: 438/26
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A solid-state imaging device is manufactured according to the steps below. A lattice-shaped rib forming member, which is an aggregation of a plurality of frame-shaped ribs for configuring a plurality of solid-state imaging devices, is resin-molded. An aggregate wiring board is used, which has regions corresponding to a plurality of the wiring boards, and in which a plurality of the wiring members are provided in each of the regions, and the imaging element is fastened to each region of the aggregate wiring board and the electrodes of the imaging elements and the wiring members are connected by a thin metal wire. The rib forming member is placed on the wiring board face and joined to the wiring board face, so that the imaging element is disposed inside the lattice elements of the rib forming member. The transparent plate is fastened to an upper face of the rib forming member, and each housing is cut in a direction perpendicular to the base portion, and in a direction dividing into two the width of the rib forming member, and separating the solid-state imaging devices into individual pieces It is possible to make a low cost housing, avoiding deformations caused by a difference in thermal expansion between the wiring board and the ribs made of a resin, when forming a plurality of housings together.

Claims

1. A method for manufacturing a solid-state imaging device which comprises a wiring board made of an insulating resin, frame-shaped ribs forming an internal space, the frame-shaped ribs being disposed on top of the wiring board, a plurality of wiring members for electrically conducting to an external portion from the internal space of a housing formed of the wiring board and the ribs, an imaging element fastened to the wiring board inside the internal space, a transparent plate fastened to an upper surface of the ribs, and connecting members which connect electrodes of the imaging element with the wiring members;

the method comprising;

resin molding a lattice-shaped rib forming member, which is an aggregation of a plurality of frame-shaped ribs for configuring a plurality of solid-state imaging devices;

using an aggregate wiring board, which has regions corresponding to a plurality of the wiring boards, and in which a plurality of the wiring members are provided in each of the regions;

fastening an imaging element to each region of the aggregate wiring board and connecting by the connecting members the electrodes of the imaging elements and the wiring members;

placing the rib forming member on the wiring board face and joining the rib forming member with the wiring board face, so that the imaging element is disposed inside the lattice elements of the rib forming member;

fastening the transparent plate to an upper face of the rib forming member; and

cutting each housing in a direction perpendicular to the base portion, and in a direction dividing into two the width of the rib forming member, and separating the solid-state imaging devices into individual pieces.

2. The method for manufacturing a solid-state imaging device according to claim 1,

wherein when fastening the transparent plate, the transparent plate of a size covering a plurality of housings is fastened to the top face of the rib forming member, and when cutting each housing, the transparent plate is also cut at the same time.

3. The method for manufacturing a solid-state imaging device according to claim 1,

wherein, when fastening the transparent plate, a plurality of transparent plates corresponding to the individual housings are used, edges of adjacent transparent plates are mounted onto the rib forming member forming a gap between the edges, and the solid-state imaging devices are separated into pieces in a region of the gaps.

4. The method for manufacturing a solid-state imaging device according to claim 1,

wherein the rib forming member is resin molded so that a cross sectional shape of the ribs has a taper in vertical direction, and the rib forming member is fastened to a wiring board face such that a narrow side of the ribs faces the wiring board.