Polishing composition and use thereof
First Claim
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1. An aqueous slurry composition which comprises:
- A. about 0.01% by weight to about 50% by weight of abrasive particles;
B. about 0.01% to about 50% by weight of an oxidizer;
C. at least about 500 ppm of a quaternary ammonium hydroxide;
D. an acid having a pKa of about 2.5 or lower in an sufficient amount to provide an acidic pH; and
E. water.
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Abstract
An acidic aqueous slurry composition comprising silica abrasive particles, an oxidizer, a quaternary ammonium hydroxide; and acid having a maximum pKa of about 2.5; and water is provided along with its use for polishing.
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Citations
22 Claims
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1. An aqueous slurry composition which comprises:
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A. about 0.01% by weight to about 50% by weight of abrasive particles;
B. about 0.01% to about 50% by weight of an oxidizer;
C. at least about 500 ppm of a quaternary ammonium hydroxide;
D. an acid having a pKa of about 2.5 or lower in an sufficient amount to provide an acidic pH; and
E. water. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 21, 22)
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20. A method for polishing a metal which comprises providing on the metal an aqueous slurry composition comprising:
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A. about 0.1% by weight to about 50% by weight of abrasive particles;
B. about 0.1% to about 50% by weight of an oxidizer;
C. at least about 500 ppm of a quaternary ammonium hydroxide;
D. an acid being a pKa of about 2.5 or lower in amount to provide an acidic pH;
and E. water;
and contacting the metal with a polishing pad.
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Specification