Radiation image storage panel

• US 20050077479A1
• Filed: 09/20/2004
• Published: 04/14/2005
• Est. Priority Date: 09/18/2003
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Photo Film Co Limited (Fujifilm Holdings Corporation)
• Inventors: Matsumoto, Hiroshi, Isoda, Yuji
• Granted Patent: US 7,442,943 B2
• Time in Patent Office: Days
• US Class Current: 250/484.400
• CPC Class Codes: C09K 11/7733 with alkali or alkaline earth metals
• CPC Class Codes: G21K 4/00 Conversion screens for the conversion of the spatial distribution of X-rays or particle radiation into visible images, e.g. fluoroscopic screens photographic processes using X-ray intensifiers G03C5/17; discharge tubes comprising luminescent screens H01J1/62; cathode ray tubes for X-ray conversion with optical output H01J31/50

Abstract

In a radiation image storage panel having a support, an underlayer, and a phosphor layer of a phosphor composed of a matrix compound and an activator and is formed on the underlayer by a gas phase-accumulation method, the underlayer consists essentially of the matrix compound and has a relative density lower than a relative density of the phosphor layer.

Claims

1. A radiation image storage panel comprising a support, an underlayer, and a phosphor layer which comprises a phosphor composed of a matrix compound and an activator and which is formed on the underlayer by a gas phase-accumulation method, in which the underlayer consists essentially of the matrix compound and has a relative density lower than a relative density of the phosphor layer.

2. The radiation image storage panel of claim 1, wherein the relative density of the underlayer is in the range of 80% to 98%.

3. The radiation image storage panel of claim 2, wherein the relative density of the underlayer is in the range of 85% to 95%.

4. The radiation image storage panel of claim 1, wherein the underlayer has a thickness less than a thickness of the phosphor layer under the following condition:

0.01<

thickness of underlayer/thickness of phosphor layer<

0.5.

5. The radiation image storage panel of claim 1, herein the underlayer is formed on the support by a gas phase-accumulation method.

6. The radiation image storage panel of claim 1, wherein the phosphor is an energy-storable phosphor.

7. The radiation image storage panel of claim 6, wherein the energy-storable phosphor is a stimulable alkali metal halide phosphor represented by the formula (I):

M^IX.aM^IIX′

₂.bM^IIIX″

₃;

zA 

 

(I)

in which M^I is at least one alkali metal selected from the group consisting of Li, Na, K, Rb and Cs;

M^II is at least one alkaline earth metal or divalent metal selected from the group consisting of Be, Mg, Ca, Sr, Ba, Ni, Cu, Zn and Cd;

M^III is at least one rare earth element or trivalent metal selected from the group consisting of Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Al, Ga and In;

each of X, X′ and

X″

is independently at least one halogen selected from the group consisting of F, Cl, Br and I;

A is at least one rare earth element or metal selected from the group consisting of Y, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Mg, Cu and Bi; and

a, b and z are numbers satisfying the conditions of 0≦

a<

0.5, 0≦

b<

0.5 and 0<

z<

1.0, respectively.

8. The radiation image storage panel of claim 7, herein M^I is Cs, X is Br, A is Eu, and z is a number satisfying the condition of 1×

10−

4≦

z≦

0.1.

9. A process for preparing a radiation image storage panel of claim 1, comprising the steps of:

depositing the matrix compound on the support by a gas phase-accumulating method performed at a pressure of 0.05 to 10 Pa, to produce the underlayer having a relative density less than a relative density of the phosphor layer; and

depositing the matrix compound and activator simultaneously on the underlayer by a gas phase-accumulating method performed at a pressure of 0.05 to 10 Pa, to produce the phosphor layer.

10. The process of claim 9, wherein the step for the production of the underlayer and the step for the production of the phosphor layer are performed successively.

11. The process of claim 9, wherein the step for the production of the underlayer and the step for the production of the phosphor layer are performed by a resistance-heating method.