Method for producing a cover, method for producing a packaged device

• US 20050079686A1
• Filed: 08/18/2004
• Published: 04/14/2005
• Est. Priority Date: 02/19/2002
• Status: Active Grant

• Current Assignee: Chemtron Research LLC (Intellectual Ventures LLC)
• Original Assignee: Infineon Technologies AG
• Inventors: Franosch, Martin, Aigner, Robert, Oppermann, Klaus-Guenter, Strasser, Marc, Meckes, Andreas
• Granted Patent: US 7,288,435 B2
• Time in Patent Office: Days
• US Class Current: 438/458
• CPC Class Codes: H03H 9/105 the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device

Abstract

In a method for producing a cover for a region of a substrate, first a frame structure is produced in the region of the substrate, and then a cap structure is attached to the frame structure so that the region under the cap structure is covered. Thus, sensitive devices may be protected easily and at low cost from external influences and particularly from a casting material for casting the entire packaged device, which results when a diced chip is cast.

Claims

1-7. -7. (canceled)

8. A method for producing covers for a plurality of regions on a system wafer, each region comprising a device, wherein contact pads for the devices are provided outside each region, the method comprising:

providing the system wafer having the devices;

producing a frame structure for each region of the system wafer, wherein the step of producing a frame structure further comprises the following substeps;

spinning a first photostructurable epoxy resin material onto the system wafer;

exposing the first photostructurable epoxy resin material;

developing the first photostructurable epoxy resin material; and

removing the epoxy resin material defined by the exposure of the first photostructurable epoxy resin material to obtain the frame structure for each region of the system wafer;

providing a support wafer, wherein the support wafer comprises a sacrificial layer;

producing a cap structure for attaching to the frame structure so that the region between the cap structure and the system wafer is covered, wherein the step of producing a cap structure further comprises the following substeps;

spinning a second photostructurable epoxy resin material onto the sacrificial layer on the support wafer; and

structuring the second photostructurable epoxy resin material to produce the cap structure;

connecting the cap structure to the frame structure; and

removing the sacrificial layer from the support wafer to separate the cap structure from the support wafer.

9. The method of claim 8 wherein the substep of structuring the second photostructurable epoxy resin occurs in the step of producing the cap structure prior to the step of removing the sacrificial layer.

10. The method of claim 8 wherein the substep of structuring the photostructurable epoxy resin occurs in the step of producing the cap structure after the step of removing the sacrificial layer.

11. The method of claim 8 wherein the step of connecting the cap structure to the frame structure comprises bonding the cap structure and the frame structure.

12. The method of claim 8 wherein the step of connecting the cap structure to the frame structure comprises adhering the cap structure and the frame structure.

13. The method of claim 8 wherein the device is an electronic device.

14. The method of claim 8 wherein the device is an electromechanical device.

15. The method of claim 8 wherein the device is a micromechanical device.

16. The method of claim 8 wherein the first photostructurable epoxy resin material is the same material as the second photostructurable epoxy resin material.

17. The method of claim 8 wherein the first photostructurable epoxy resin material or the second photostructurable epoxy resin material is epoxy resin of the type SU-8.

18. The method of claim 8 wherein the frame structure has a height of more than 5 μ

m.

19. The method of claim 8 wherein the cap structure has a height of more than 5 μ

m.

20. The method of claim 8 further comprising the step of arranging a casting material around the frame structure, but not within the frame structure.

21. A method for producing packaged devices comprising:

a. providing a system wafer having a plurality of devices;

b. producing a frame structure around the plurality of devices;

c. providing a support wafer;

d. mounting a cap structure on the support wafer using a sacrificial layer;

e. placing the support wafer on the system wafer such that the cap structure is connected to the frame structure and the cap structure covers the plurality of devices; and

f. removing the sacrificial layer from the support wafer to separate the cap structure from the support wafer.

22. The method of claim 21 further comprising the step of re-using the support wafer of step c. according to steps d, e and f to connect a second cap structure to a second frame structure on a second system wafer having a second plurality of devices.

23. The method of claim 21 wherein the plurality of devices are integrated in the system wafer.

24. The method of claim 21 wherein the plurality of devices are applied to the system wafer.

25. The method of claim 21 wherein the frame structure and the cap structure are comprised of a photostructurable epoxy resin material.

26. The method of claim 21 wherein connection of the cap structure to the frame structure results in a plurality of cavities and each of the plurality of devices are arranged in one of the plurality of cavities.

27. The method of claim 26 wherein a plurality of contact pads are provided on the system wafer, each of the plurality of contact pads providing a connection to one of the plurality of devices, and each of the plurality of contact pads positioned outside of the plurality of cavities following connection of the cap structure to the frame structure.