Performance polymer film insert molding for fluid control devices

• US 20050081917A1
• Filed: 11/26/2002
• Published: 04/21/2005
• Est. Priority Date: 11/27/2001
• Status: Abandoned Application

• Current Assignee: Entegris Incorporated
• Original Assignee: Entegris Incorporated
• Inventors: Bhatt, Sanjiv M., Eggum, Shawn D.
• Application Number:
  US10/496,699
• Publication Number:
  US 20050081917A1
• Time in Patent Office: Days
• US Class Current: 137/375
• CPC Class Codes: B29C 2045/14901 Coating a sheet-like insert smaller than the dimensions of the adjacent mould wall
• CPC Class Codes: B29C 45/14778 the article consisting of a material with particular properties, e.g. porous, brittle
• CPC Class Codes: B29K 2071/00 Use of polyethers , e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2715/006 Glues or adhesives, e.g. hot melts or thermofusible adhesives
• CPC Class Codes: B29K 2995/0087 Wear resistance
• CPC Class Codes: B29L 2031/7506 Valves
• CPC Class Codes: Y10T 137/7036 Jacketed

Abstract

The present invention relates generally to a system and method for including a thin protective containment polymer film (100), such as Peek in the molding process for fluid processing devices utilized in the semiconductor processing industry. The thermoplastic film of predetermined size and shape is selectively placed along a shaping surface (110) in a mold cavity (106) for alignment with a desired target surface of a molded material. The molding processes causes a surface of the film (100) to bond to a contact surface of the moldable material such that the film (100) is permanently adhered to the moldable material. As a result, a comparable polymer film can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing prevention, rigidity enhancement, fluid absorption prevention, ultraviolet resistance, friction reduction and the like is needed.

Claims

1. A fluid control device for use in semiconductor processing, comprising:

at least one thermoplastic component structure making up a part of the fluid processing device; and

at least one thin, flexible protective thermoplastic film securely adhered by insert molding along a portion of the thermoplastic component structure to provide containment characteristics to the fluid control device.

2. The device of claim 1, wherein the at least one thin, flexible protective thermoplastic film includes a film having containment characteristics selected from the group consisting of:

abrasion resistance, chemical resistance, heat resistance, fluid absorption prevention, ultraviolet resistance, friction reduction, rigidity enhancement or outgassing prevention.

3. The device of claim 1, wherein the at least one thin, flexible protective thermoplastic film is constructed substantially of a material selected from the group consisting of:

polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.

4. The device of claim 1, wherein the at least one thin, flexible protective thermoplastic film is constructed substantially of polyetheretherketone.

5. The device of claim 2, wherein the at least one thin, flexible protective thermoplastic film is a film laminate having at least two thin, flexible film layers.

6. The device of claim 5, wherein the at least two thin, flexible film layers each have different containment characteristics.

7. The device of claim 5, wherein at least one of the at least two thin, flexible film layers is an intermediate layer whereby the bond strength between the protective film and the at least one thermoplastic component structure is improved.

8. The device of claim 1, wherein the at least one thermoplastic component structure is a valve.

9. The device of claim 8, wherein the valve comprises a valve body and a valve stem.

11. The device of claim 9, wherein the at least one thin, flexible thermoplastic film is selectively adhered to a surface on the valve stem.

12. The device of claim 1, wherein the at least one thermoplastic component structure is a length of plastic tubing.

13. The device of claim 12, wherein the at least one thin, flexible thermoplastic film is selectively adhered to an interior surface of the plastic tubing.

14. The device of claim 12, wherein the at least one thin, flexible thermoplastic film is selectively adhered to an exterior surface of the plastic tubing.

15. The device of claim 14, wherein the exterior surface of the plastic tubing comprises a barbed end.

16. The device of claim 1, wherein the at least one thermoplastic component structure is a flowmeter.

17. The device of claim 16, wherein the flowmeter comprises a translucent sight tube, an inlet, an outlet and a float.

18. The device of claim 16, wherein the at least one thin, flexible thermoplastic film is selectively applied to an interior surface of the flowmeter.

19. The device of claim 16, wherein the at least one thin, flexible thermoplastic film is selectively applied to an exterior surface of the flowmeter.

20. The device of claim 1, wherein the at least one thermoplastic component structure is a plastic tubing connector.

21. The device of claim 20, wherein the plastic tubing connector comprises at least two fluid connections and a flow channel.

22. The device of claim 20, wherein the at least one thermoplastic film is selectively and securely adhered applied to an interior surface of the connector.

23. The device of claim 20, wherein the at least one thermoplastic film is selectively and securely adhered to an exterior surface of the connector.

10. (canceled).

24. A method of film insert molding a semiconductor fluid control component through meltably bonding at least one thin, flexible containment thermoplastic film to at least a portion of a thermoplastic material, comprising the steps of:

accessing a molding unit having a mold cavity, the mold cavity including at least one shaping surface;

positioning the at least one thin, flexible containment thermoplastic film within the cavity of the molding unit along at least a portion of the at least one shaping surface;

injecting a substantially molten thermoplastic material into the cavity of the molding unit to conform to the shape of the at least one shaping surface;

waiting a cooling period wherein the thermoplastic material substantially solidifies to matably bond with the at least one thin, flexible containment thermoplastic film to generate a protective containment surface on the semiconductor fluid processing component; and

ejecting the semiconductor fluid control component from the molding unit.

25. The method of claim 24, wherein the at least one thin, flexible containment thermoplastic film has a protective characteristic selected from the group consisting of:

abrasion resistance, chemical resistance, heat resistance, fluid absorption prevention, ultraviolet resistance, friction reduction, or outgassing prevention.

26. The method of claim 24, wherein the at least one thin, flexible containment thermoplastic film is constructed substantially of a material selected from the group consisting of:

polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.

27. The method of claim 24, wherein the at least one thin, flexible containment thermoplastic film is constructed substantially of polyetheretherketone.

28. The method of claim 24 wherein the semiconductor fluid control component is selected from the group consisting of:

valves, tubing, flowmeters, manifolds, regulator and connectors.

29. The method of claim 24 wherein the semiconductor fluid control component is a subcomponent of the semiconductor fluid controlg component.

30. The method of claim 24, further comprising the step of thermoforming the at least one thin, flexible containment thermoplastic film.

31. The method of claim 30, wherein thermoforming the at least one thin, flexible containment thermoplastic film includes thermoforming a multi-layer film laminate wherein at least one of the film layers is a thin, flexible containment thermoplastic film.

32. The method of claim 31, wherein the multi-layer film laminate includes at least two film layers, wherein a first film layer has a containment characteristic different than a second film layer.

33. The method of claim 31, wherein the multi-layer film laminate includes an intermediate layer for improving bond strength between the thin, flexible containment thermoplastic film and the thermoplastic material.

34. A thermoplastic valve for use in semiconductor processing, comprising:

a valve body containing a plurality of fluid ports, said valve body including a central bore whereby the plurality of fluid ports are in fluid communication;

a valve stem, the valve stem including a handle, a rod and a sealing face, the valve stem being sealingly mounted within the central bore; and

at least one thin, flexible thermoplastic protective film, said film securely adhered along a portion of the valve by insert molding to impart a protective characteristic to the valve.

35. The valve of claim 34, wherein the at least one thin, flexible thermoplastic protective film imparts a protective characteristic selected from the group consisting of:

abrasion resistance, chemical resistance, heat resistance, fluid absorption prevention, ultraviolet resistance, friction reduction, rigidity enhancement or outgassing prevention.

36. The valve of claim 34, wherein the at least one thin, flexible thermoplastic protective film is constructed substantially of a material selected from the group consisting of:

polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.

37. The valve of claim 34, wherein the at least one thin, flexible thermoplastic protective film is constructed substantially of polyetheretherketone.

38. The valve of claim 34, wherein the thin, flexible protective film is insert molded to a portion of the valve body.

39. The valve of claim 34, wherein the thin, flexible protective film is insert molded to a portion of the valve stem.

40. The valve of claim 34, wherein the at least one thin, flexible protective thermoplastic film comprises a multi-layer film laminate.

41. The valve of claim 40, wherein the multi-layer film laminate includes a first film layer and a second film layer, wherein said first film layer has a protective characteristic different than the second film layer.

42. The valve of claim 40, wherein the multi-layer film laminate includes an intermediate layer for improving bond strength between the protective thermoplastic film and the thermoplastic material.

43. A length of tubing for use in semiconductor processing, comprising:

a thermoplastic tube having a distal end and a proximal end, said tube defining a flow channel whereby said distal end and proximal end are in fluid communication; and

at least one thin, flexible thermoplastic protective film, said film securely adhered along a portion of the tube by insert molding to impart a protective characteristic to the tube.

44. The tubing of claim 43, wherein the at least one thin, flexible thermoplastic protective film imparts a protective characteristic selected from the group consisting of:

abrasion resistance, chemical resistance, heat resistance, fluid absorption prevention, ultraviolet resistance, friction reduction, rigidity enhancement or outgassing prevention.

45. The tubing of claim 43, wherein the at least one thin, flexible thermoplastic protective film is constructed substantially of a material selected from the group consisting of:

polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.

46. The tubing of claim 43, wherein the at least one thin, flexible thermoplastic protective film is constructed substantially of polyetheretherketone.

47. The tubing of claim 43, wherein the proximal end includes a barb.

48. The tubing of claim 43, wherein the at least one protective thin, flexible thermoplastic film comprises a multi-layer film laminate.

49. The tubing of claim 48, wherein the multi-layer film laminate includes a first film layer and a second film layer, wherein said first film layer has a protective characteristic different than the second film layer.

50. The tubing of claim 48, wherein the multi-layer film laminate includes an intermediate layer for improving bond strength between the protective thermoplastic film and the thermoplastic material.

51. A flowmeter assembly for use in semiconductor processing, comprising:

a flowmeter including an inlet port and an outlet port, the flowmeter also including a flow indicator mounted between the inlet port and outlet port; and

at least one thermoplastic protective film, said film securely adhered along a portion of the flowmeter by insert molding to impart a protective characteristic to the flowmeter.

52. The flowmeter assembly of claim 51, wherein the at least one thin, flexible thermoplastic protective film imparts a protective characteristic selected from the group consisting of:

abrasion resistance, chemical resistance, heat resistance, fluid absorption prevention, ultraviolet resistance, friction reduction, rigidity enhancement or outgassing prevention.

53. The flowmeter assembly of claim 51, wherein the at least one thin, flexible thermoplastic protective film is constructed substantially of a material selected from the group consisting of:

polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.

54. The flowmeter assembly claim 51, wherein the at least one thin, flexible thermoplastic protective film is constructed substantially of polyetheretherketone.

55. The flowmeter assembly of claim 51, wherein the flow indicator comprises an opaque sightglass and a float.

56. The flowmeter assembly of claim 51, wherein the at least one thin, flexible protective thermoplastic film comprises a multi-layer film laminate.

57. The flowmeter assembly of claim 56, wherein the multi-layer film laminate includes a first film layer and a second film layer, wherein said first film layer has a protective characteristic different than the second film layer.

58. The flowmeter assembly of claim 56, wherein the multi-layer film laminate includes an intermediate layer for improving bond strength between the protective thermoplastic film and the thermoplastic material.

59. A connector for use in semiconductor processing, comprising:

a thermoplastic connector including a plurality of ports, and

at least one thin, flexible thermoplastic protective film, said film securely adhered along a portion of the connector by insert molding to impart a protective characteristic to the connector.

60. The connector of claim 59, wherein the at least one thin, flexible thermoplastic protective film imparts a protective characteristic selected from the group consisting of:

abrasion resistance, chemical resistance, heat resistance, fluid absorption prevention, ultraviolet resistance, friction reduction, rigidity enhancement or outgassing prevention.

61. The connector of claim 59, wherein the at least one thin, flexible thermoplastic protective film is constructed substantially of a material selected from the group consisting of:

polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.

62. The connector of claim 59, wherein the at least one thin, flexible thermoplastic protective film is constructed substantially of polyetheretherketone.

63. The connector of claim 59, wherein the at least one thin, flexible protective thermoplastic film comprises a multi-layer film laminate.

64. The connector of claim 63, wherein the multi-layer film laminate includes a first film layer and a second film layer, wherein said first film layer has a protective characteristic different than the second film layer.

65. The connector of claim 63, wherein the multi-layer film laminate includes an intermediate layer for improving bond strength between the protective thermoplastic film and the thermoplastic material.