Liquid cooled semiconductor device

• US 20050083652A1
• Filed: 10/15/2003
• Published: 04/21/2005
• Est. Priority Date: 10/15/2003
• Status: Active Grant

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Inventors: Trublowski, John, Jairazbhoy, Vivek A., Reddy, Prathap A.
• Granted Patent: US 6,992,887 B2
• Time in Patent Office: Days
• US Class Current: 361/689
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A liquid cooled semiconductor device is provided. The device includes a semiconductor die, a heat spreader, a wetting material, a sealant, a substrate, and a base. The spreader is mounted to a substrate such that a first side of the spreader is exposed on one side of the substrate and that a second side of the spreader is exposed on an opposing side of the substrate. Attached to a first side of the spreader is the semiconductor die. The wetting material is used to provide a thermal/electrical connection between the die and heat spreader. Sealant is provided between the die and the heat spreader to encapsulate and contain the wetting material. The substrate is mounted to the base, whereby the second side of the spreader is exposed to allow fluid to flow across the second side, directed within a channel defined by the base, and transfer heat away from the spreader.

Claims

1. A fluid cooled semiconductor device comprising:

a semiconductor die;

a heat spreader having a first side and a second side, the first side being attached to the semiconductor die;

a wetting material providing a thermal connection between the semiconductor die with the heat spreader;

a sealant extending between the semiconductor die and the heat spreader and encapsulating the wetting material;

a substrate to which the spreader is mounted, the spreader being mounted to the substrate such that at least part of the second surface of the spreader is exposed from the substrate; and

a base including wall portions defining a channel adapted to having cooling fluid flow through the channel, part of the wall portions defining an aperture and the substrate being mounted over the aperture such that the second surface of the spreader will be contacted by a flow of the cooling fluid through the channel.

2. The device according to claim 1, wherein the wetting material is a liquefiable solder.

3. The device according to claim 1, wherein the substrate includes a plastic material.

4. The device according to claim 3, wherein the heat spreader is insert molded into the substrate.

5. The device according to claim 1, wherein the heat spreader is constructed primarily of copper.

6. The device according to claim 1, wherein the heat spreader includes a dielectric coating on the second side of the heat spreader.

7. The device according to claim 6, wherein the coating is a ceramic coating.

8. The system according to claim 1, wherein the fluid is an electrolizable fluid.

9. The device according to claim 1, further comprising a fluid tight seal located about the aperture and between the substrate and the base.

10. A fluid cooled semiconductor device comprising:

a semiconductor die;

a heat spreader having a first and a second side, the first side being attached to the semiconductor die;

a liquefiable solder providing a thermal connection between the die and the heat spreader;

a sealant extending between the die and the heat spreader, and encapsulating the liquefiable solder;

a plastic substrate for fixing the location of the heat spreader, wherein the heat spreader is insert molded into the plastic substrate such that the second side of the heat spreader is exposed from the substrate; and

a base including wall portions defining a channel adapted to having cooling fluid flow through the channel, part of the wall portions defining an aperture and the substrate being mounted over the aperture such that the second surface of the spreader will be contacted by a flow of the cooling fluid through the channel.

11. The system according to claim 10, wherein the fluid is a dielectric fluid.

12. The system according to claim 10, wherein the heat spreader is a copper heat spreader.

13. The system according to claim 10, wherein the heat spreader includes a dielectric coating on the second side of the heat spreader.

14. The system according to claim 13, wherein the coating is a ceramic coating.

15. The system according to claim 13, wherein the ceramic coating is sputtered on the heat spreader.

16. The system according to claim 10, wherein the fluid is an electrolizable fluid.

17. The system according to claim 16, wherein the fluid includes water.

18. The system according to claim 10, further comprising a channel attached to the substrate, and the channel is configured to direct the fluid across the second side of the heat spreader.

19. The system according to claim 18, further comprising a seal located between the channel and the substrate.