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Liquid cooled semiconductor device

  • US 20050083652A1
  • Filed: 10/15/2003
  • Published: 04/21/2005
  • Est. Priority Date: 10/15/2003
  • Status: Active Grant
First Claim
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1. A fluid cooled semiconductor device comprising:

  • a semiconductor die;

    a heat spreader having a first side and a second side, the first side being attached to the semiconductor die;

    a wetting material providing a thermal connection between the semiconductor die with the heat spreader;

    a sealant extending between the semiconductor die and the heat spreader and encapsulating the wetting material;

    a substrate to which the spreader is mounted, the spreader being mounted to the substrate such that at least part of the second surface of the spreader is exposed from the substrate; and

    a base including wall portions defining a channel adapted to having cooling fluid flow through the channel, part of the wall portions defining an aperture and the substrate being mounted over the aperture such that the second surface of the spreader will be contacted by a flow of the cooling fluid through the channel.

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