Dielectric thermal stack for the cooling of high power electronics

• US 20050083655A1
• Filed: 10/15/2003
• Published: 04/21/2005
• Est. Priority Date: 10/15/2003
• Status: Abandoned Application

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Inventors: Baker, Jay D., Reddy, Prathap A., Jairazbhoy, Vivek, Paruchuri, Mohan
• Application Number:
  US10/685,931
• Publication Number:
  US 20050083655A1
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3733 having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A system for dissipating heat in an electronic power module is provided. The system includes a semiconductor die, a substrate, and a heat sink in which is contained a first fluid, and a conduit through which a second fluid is permitted to flow. The substrate is attached on one surface to the die and configured to conduct heat from the die. The heat sink is attached to another surface of the substrate and transfers heat from the die to the first fluid contained therein, which evaporates due to the heat provided by the substrate. The fluid is condensed on a condensing wall cooled by the second fluid, which flows across the outer surface of the condensing wall, to transport heat away from the heat sink.

Claims

1. A heat dissipating system for an electronic power module, the system comprising:

a semiconductor die;

a substrate attached to the die so as to conduct heat from the die;

a heat sink attached to the substrate, wherein portions of the heat sink define a chamber, the chamber including a wall further defining a condensing surface;

a first fluid contained in the chamber; and

a base having portions defining a fluid passageway therein, and a second fluid within the passageway flows across an outer surface of the wall of the heat sink to transport the heat away from the heat sink.

2. The system according to claim 1, wherein the substrate is formed of metal.

3. The system according to claim 2, wherein the substrate is substantially copper.

4. The system according to claim 1, wherein the heat sink includes portions defining an aperture, and the substrate being mounted over the aperture.

5. The system according to claim 1, wherein the first fluid is a dielectric fluid.

6. The system according to claim 5, wherein a seal is located between the substrate and the chamber.

7. The system according to claim 1, wherein the outside surface of the wall of the heat sink includes at least one fin extending therefrom and providing additional surface area for dissipating heat.

8. The system according to claim 1, wherein portions of the base define an aperture, and the heat sink being mounted over the aperture.

9. The system according to claim 1, further comprising a seal located between the wall of the conduit and the wall of the heat sink.

10. The system according to claim 1, wherein the second fluid is substantially water.

11. The system according to claim 1, wherein the die is attached to the substrate by a phase changing solder material.

12. The system according to claim 11, further comprising a sealant attached between the die and the substrate to contain the phase changing solder material.

13. The system according to claim 1, wherein the heat sink includes fins on the condensing surface to provide additional surface area for improved condensation.

14. The system according to claim 1, the heat sink has a predefined orientation wherein the orientation is such that gravity causes the first fluid to return to the substrate after it has condensed on the condensing surface.

15. The system according to claim 1, wherein the substrate includes metal foam.

16. The system according to claim 1, wherein the substrate includes a metal foam member extending from the substrate, the metal foam configured to draw the first fluid towards the die.

17. The system according to claim 16, wherein the condensing surface includes plates extending therefrom into the first fluid.

18. The system according to claim 1, wherein the heat sink includes bellows configured to accommodate thermal expansion of the first fluid therein.

19. The system according to claim 1, further comprising metal foam attached to the outer surface of the chamber, the metal foam having passageways defined therethrough to allow the second fluid to flow through the metal foam.

21. The system according to claim 1, wherein the substrate includes metal foam.

22. The system according to claim 21, wherein the substrate includes substantially copper.

20. A heat dissipating system for an electronic power module, the system comprising:

a semiconductor die;

a substrate attached to the die so as to conduct heat from the die;

a heat sink attached to the substrate, the heat sink including portions defining an aperture and the substrate being mounted to the heat sink over the aperture such that the heat sink and substrate cooperatively define a chamber, the chamber including a wall further defining a condensing surface;

a first fluid contained in the chamber; and

a base having portions defining a fluid passageway therein, and a second fluid within the passageway flows across an outer surface of the wall of the heat sink to transport the heat away from the heat sink.

23. The system according to claim 20, wherein the first fluid is a dielectric fluid.

24. The system according to claim 20, wherein the substrate forms a wall of the chamber.

25. The system according to claim 24, wherein a seal is located between the substrate and the chamber.

26. The system according to claim 25, wherein the outside surface of the wall of the chamber includes at least one fin to provide additional surface area for dissipating heat.

27. The system according to claim 20, wherein a wall of the base has an aperture and the outside surface of the wall of the chamber is located in the aperture to allow the second fluid to flow across the outer surface of the wall of the chamber.

28. The system according to claim 27, further comprising a seal located between the wall of the channel and the outside surface of the wall of the chamber.

29. The system according to claim 20, wherein the second fluid includes substantially water.

30. The system according to claim 20, wherein the die is attached to the substrate using a phase changing solder material.

31. The system according to claim 30, further comprising a sealant attached between the die and the substrate to contain the phase changing solder material.

32. The system according to claim 20, wherein the heat sink includes fins on the condensing surface to provide additional surface area for improved condensation.

33. The system according to claim 20, wherein the orientation of the chamber is such that gravity causes the first fluid to return to the substrate after it has condensed on the condensing surface.

34. The system according to claim 20, wherein the porous material of the substrate is configured to draw the first fluid towards the die.

35. The system according to claim 20, wherein the condensing surface includes plates extending through the first fluid.

36. The system according to claim 20, wherein the heat sink includes bellows configured to accommodate thermal expansion of the dielectric fluid.

37. The system according to claim 20, further comprising metal foam attached to the outer surface of the chamber and configured to allow the second fluid to flow through the metal foam.