Power conversion module device and power unit using the same

• US 20050083665A1
• Filed: 12/05/2003
• Published: 04/21/2005
• Est. Priority Date: 08/29/2003
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Miyoshi, Yoshiyuki, Tsujimoto, Etsuo, Marui, Tomio, Nakashima, Koji, Miyauchi, Michihiro
• Granted Patent: US 7,262,973 B2
• Time in Patent Office: Days
• US Class Current: 361/767
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0397 Tab
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

In a power conversion module device of the present invention, transformer (11), primary power element (14), and secondary power element (15) are mounted on printed wiring board (16) in surface-to-surface contact therewith, and no control circuit is mounted thereon. In addition to reduction in impedance and loss in the wiring, this constitution improves the voltage waveform of primary power element (14). Thus, noise reduction can be achieved. Further, because heat can be transferred to printed wiring board (16), heat generated from transformer (11), primary power element (14), and secondary power element (15) can be reduced. The size of the transformer can also be reduced.

Claims

1. A power conversion module device, wherein a transformer and at least one of a primary power element and a secondary power element are mounted on a printed wiring board in surface-to-surface contact therewith, and components mounted on the printed wiring board are connected to a control circuit part provided on a separate substrate via an external connection terminal provided on the printed wiring board.

2. The power conversion module device of claim 1, wherein the printed wiring board has a structure of a highly heat radiating board having an insulator and a wiring board unitary with lead frame bonded to each other.

3. The power conversion module device of claim 2, wherein a thickness of the insulator is at least 0.4 mm.

4. The power conversion module device of claim 2, wherein the insulator is made of an epoxy resin.

5. The power conversion module device of claim 4, wherein the resin includes mineral filler.

6. The power conversion module device of claim 2, wherein the insulator is made of a ceramic material.

7. The power conversion module device of claim 2, wherein the lead frame is formed of a cupper plate having a thickness of at least 0.3 mm.

8. The power conversion module device of claim 2, wherein the lead frame is bent to form the external connection terminal of the module.

9. The power conversion module device of claim 8, wherein at least one of the external connection terminals forms a terminal for connection to the control circuit part.

10. The power conversion module device of claim 2, wherein a metal plate is bonded to a backside of a surface of the insulator having the lead frame.

11. The power conversion module device of claim 10, wherein a material of the metal plate is aluminum.

12. The power conversion module device of claim 10, wherein a material of the metal plate is cupper.

13. The power conversion module device of claim 1, wherein the transformer and at least one of the primary power element and the secondary power element are mounted on a single principal surface of the printed wiring board.

14. The power conversion module device of claim 1, wherein a single-sided printed wiring board having a pattern formed on one side thereof is used as the printed wiring board.

15. The power conversion module device of claim 1, wherein a double-sided printed wiring board having patterns formed on both sides thereof is used as the printed wiring board.

16. The power conversion module device of claim 1, wherein a multi-layered printed wiring board is used as the printed wiring board.

17. The power conversion module device of claim 13, wherein, on a backside of a surface of the printed wiring board having the transformer and at least one of the primary power element and the secondary power element mounted thereon, a pattern electrically insulated from the surface of the printed wiring board having the transformer and at least one of the primary power element and the secondary power element mounted thereon is formed.

18. The power conversion module device of claim 1, wherein a metal base board having an insulating resin layer formed on a metal board and metal foil formed on the insulating resin layer is used as the printed wiring board.

19. The power conversion module device of claim 1, wherein at least one of a primary coil and a secondary coil of the transformer is formed of a coil shaped like a thin plate.

20. The power conversion module device of claim 19, wherein the thin-plate coil is formed of a cupper plate having a thickness of at least 0.3 mm.

21. The power conversion module device of claim 1, wherein at least one of a primary coil and a secondary coil of the transformer is formed of a three-layered insulated wire.

22. The power conversion module device of claim 1, wherein at least one of a primary coil and a secondary coil of the transformer is formed by winding a winding wire.

23. The power conversion module device of claim 22, wherein the winding wire of the coil has a fusion layer.

24. The power conversion module device of claim 23, wherein the fusion layer is a type fused by alcohol.

25. The power conversion module device of claim 1, wherein at least one of a primary coil and a secondary coil of the transformer is formed of a printed board.

26. The power conversion module device of claim 25, wherein a prepreg is inserted between layers of the coil to form a multi-layered printed board coil.

27. The power conversion module device of claim 1, wherein the transformer is mounted on the printed wiring board so that a bottom surface of a magnetic core of the transformer is in contact with the printed wiring board.

28. The power conversion module device of claim 27, wherein a pattern is formed on a surface of the printed wiring board facing to the magnetic core.

29. The power conversion module device of claim 27, wherein a heat conductive member is inserted between the magnetic core and the printed wiring board.

30. The power conversion module device of claim 1, wherein the transformer is disposed between the primary power element and the secondary power element.

31. A power unit comprising a first structure and a second structure integrated with each other, wherein the power conversion module device of claim 1 is used as the second structure, and a control circuit part for controlling the second structure is provided on a first substrate forming the first structure.

32. The power unit of claim 31, wherein a bore is provided through the first substrate forming the first structure and facing to a transformer forming the second structure.

33. The power unit of claim 31, wherein a printed wiring board forming the second structure has an insulator and a wiring board unitary with lead frame bonded to each other, and the first structure is connected to the second structure by a part of lead frames.

34. The power unit of claim 31, wherein a printed wiring board forming the second structure has an insulator and a wiring board unitary with lead frame bonded to each other, and the printed wiring board is mounted on a housing of the power unit in surface-to-surface contact therewith.

35. The power unit of claim 31, wherein a transformer forming the second structure is mounted on the first substrate forming the first structure so that a top surface of the transformer is surface-to-surface contact with a surface of the first substrate.

36. The power unit of claim 31, wherein components on a printed wiring board forming the second structure are mounted on a housing of the power unit so that a surface of the printed wiring board not having the components is surface-to-surface contact with a surface of the housing.

37. A power conversion module device, wherein a choke coil and at least one of a tertiary power element and a quaternary power element are mounted on a printed wiring board in surface-to-surface contact therewith, and the components mounted on the printed wiring board are connected to a control circuit part provided on a separate substrate via an external connection terminal provided on the printed wiring board.

38. A power unit comprising a first structure and a third structure integrated with each other, wherein the power conversion module device of claim 37 is used as the third structure, and a control circuit part for controlling the third structure is provided on a first substrate forming the first structure.