Encapsulated stack of dice and support therefor

• US 20050085034A1
• Filed: 10/28/2004
• Published: 04/21/2005
• Est. Priority Date: 07/26/2002
• Status: Active Grant

• Current Assignee: Jiro Kubota, Kinya Ichikawa, Masayuki Akiba, Takashi Kumamoto
• Original Assignee: Jiro Kubota, Kinya Ichikawa, Masayuki Akiba, Takashi Kumamoto
• Inventors: Ichikawa, Kinya, Kumamoto, Takashi, Kubota, Jiro, Akiba, Masayuki
• Granted Patent: US 7,132,739 B2
• Time in Patent Office: Days
• US Class Current: 438/232
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2225/0652 Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06582 Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06593 Mounting aids permanently on device; arrangements for alignment use of temporary supports H01L21/6835
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence

Abstract

Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice.

Claims

1-35. -35. (canceled)

36. A device comprising:

a first die attached to a first support stacked over a second die attached to a second support, at least one of the first support and the second support having an encapsulant flow opening; and

an encapsulant over the first support, over the first die, in the encapsulant flow opening, over the second support, and over the second die.

37. The device of claim 36, wherein the first support and the second support each have signaling mediums, and wherein the encapsulant flow opening includes a slit.

38. The device of claim 37, wherein the first support and the second support comprise printed circuits, wherein a width of the slit is between 0.5-2 millimeters, and wherein a length of the slit is greater than 2 millimeters.

39. The device of claim 36, wherein the encapsulant is on a surface of the second die.

40. The device of claim 36, wherein the first support and the second support each comprise a flexible sheet attached to a frame, and wherein each of the frames has an alignment opening to accommodate a jig to allow the first die to be aligned relative to the second die.

41. The device of claim 36, wherein the first die is attached to the first support at a position that depends on defect information.

42. A device comprising:

a plurality of stacked dice; and

an encapsulant formed contiguously around the plurality of stacked dice.

43. The device of claim 42, wherein the encapsulant contacts surfaces of the dice.

44. The device of claim 42, wherein the encapsulant is included in an encapsulant flow opening in a support of at least one die.

45. The device of claim 42, wherein the dice are stacked based on die attach position defect information of a support and die defect information.

46. A device comprising:

a Flash memory;

a plurality of stacked dice; and

an encapsulant formed contiguously around the plurality of stacked dice.

47. The device of claim 46, wherein the encapsulant contacts surfaces of the dice.

48. The device of claim 46, wherein the encapsulant is included in an encapsulant flow opening in a support of at least one die.

49. The device of claim 46, wherein the dice are stacked based on die attach position defect information of a support and die defect information.

50. A device comprising:

a printed circuit;

a die attach position on the printed circuit; and

an encapsulant flow opening to allow a liquid encapsulant to flow from one side of the printed circuit to another.

51. The device of claim 50, wherein the printed circuit comprises a flexible printed circuit.

52. The device of claim 50, wherein the encapsulant flow opening comprises a slit.

53. The device of claim 52, wherein the slit comprises a width that is between 0.5-2 millimeters and a length that is greater than 2 millimeters.

54. The device of claim 50, further comprising a plurality of encapsulant flow openings proximate the die attach position.

55. The device of claim 54, wherein the encapsulant flow openings are on opposite sides of the die attach position.

56. The device of claim 55, wherein the encapsulant flow openings are on all four sides of the die attach position.

57. The device of claim 50, further comprising:

a plurality of die attach positions; and

a plurality of encapsulant flow openings proximate each of the plurality of die attach positions.

58. The device of claim 50, further comprising:

a frame having a plurality of alignment teeth; and

a plurality of openings of the printed circuit corresponding to the plurality of alignment teeth.