Load sensor and method of manufacturing the load sensor, paste used for the method, and method of manufacturing the paste
First Claim
Patent Images
1. A load sensor wherein a crystalline glass layer is formed by 10 to 200 μ
- m in thickness on an elastic metal body;
a non-crystalline glass layer is formed by 5 to 100 μ
m in thickness on said crystalline glass layer;
silver wiring and strain sensitive resistor are formed by 5 to 50 μ
m in thickness each on said non-crystalline glass layer in such manner as to partially overlap each other;
said elastic metal body is connected to a part of said silver wiring via holes formed in said crystalline glass layer and said non-crystalline glass layer; and
a protective layer of 200 μ
m or less in thickness is formed so as to cover at least said strain sensitive resistor.
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Abstract
The present invention relates to a load sensor and provides a highly accurate load sensor with multi-layered wiring at low costs. It provides crystallized glass and non-crystalline glass which are best for a load sensor, and combines these to form multi-layered wiring, and further, makes a glass layer of composite type as needed, and reduces uneven printing in printing multiple layers with use of hardening type paste.
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Citations
52 Claims
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1. A load sensor wherein a crystalline glass layer is formed by 10 to 200 μ
- m in thickness on an elastic metal body;
a non-crystalline glass layer is formed by 5 to 100 μ
m in thickness on said crystalline glass layer;
silver wiring and strain sensitive resistor are formed by 5 to 50 μ
m in thickness each on said non-crystalline glass layer in such manner as to partially overlap each other;
said elastic metal body is connected to a part of said silver wiring via holes formed in said crystalline glass layer and said non-crystalline glass layer; and
a protective layer of 200 μ
m or less in thickness is formed so as to cover at least said strain sensitive resistor. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
- m in thickness on an elastic metal body;
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2. A load sensor wherein a crystalline glass layer is formed by 10 to 200 μ
- m in thickness on each side of an elastic metal body while an internal electrode of less than 50 μ
m in thickness is buried therein;
a non-crystalline glass layer is formed by 5 to 100 μ
m in thickness on said crystalline glass layer;
silver wiring and strain sensitive resistor are formed by 5 to 50 μ
m in thickness each on said non-crystalline glass layer;
said internal electrode is connected to a part of said wiring via holes formed in said crystalline glass layer and said non-crystalline glass layer; and
a protective layer of 200 μ
m or less in thickness is formed so as to cover at least said strain sensitive resistor.
- m in thickness on each side of an elastic metal body while an internal electrode of less than 50 μ
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23. A method of manufacturing a load sensor, comprising the steps of:
- printing first crystallized glass paste on an elastic metal body by 10 to 300 μ
m in is thickness;
burning together at 800 to 900°
C.;
printing non-crystalline glass paste by 10 to 300 μ
m in thickness and burning at 800 to 900°
C.;
printing wiring and strain sensitive resistor and individually burning at 800 to 900°
C.;
printing glass paste so as to cover at least the strain sensitive resistor and burning at 400 to 700°
C., followed by mounting electronic parts thereon as specified. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52)
- printing first crystallized glass paste on an elastic metal body by 10 to 300 μ
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24. A method of manufacturing a load sensor, comprising the steps of:
- printing first crystallized glass paste by 10 to 300 μ
m in thickness on an elastic metal body;
printing electrode paste;
burning them together at 800 to 900°
C.;
further printing second crystallized glass paste by 10 to 300 μ
m in thickness thereon and burning at 800 to 900°
C.;
printing non-crystalline glass paste by 10 to 300 μ
m in thickness and at 800 to 900°
C.;
further printing wiring and strain sensitive resistor and individually burning at 800 to 900°
C.; and
printing glass paste so as to cover at least the strain sensitive resistor and burning at 400 to 700°
C., followed by mounting electronic parts thereon as specified.
- printing first crystallized glass paste by 10 to 300 μ
-
25. A method of manufacturing a load sensor, comprising the steps of:
- printing first crystallized glass paste by 10 to 300 μ
m in thickness on an elastic metal body;
printing electrode paste;
burning them together at 800 to 900°
C.;
further printing second crystallized glass paste and non-crystalline glass paste by 10 to 300 μ
m each in thickness thereon and burning them together at 800 to 900°
C.;
further printing wiring and strain sensitive resistor and individually burning at 800 to 900°
C.; and
printing glass paste so as to cover at least the strain sensitive resistor and burning at 400 to 700°
C., followed by mounting electronic parts thereon as specified.
- printing first crystallized glass paste by 10 to 300 μ
-
26. A method of manufacturing a load sensor, comprising the steps of:
- printing first crystallized glass paste by 10 to 300 μ
m in thickness on an elastic metal body;
printing electrode paste, and printing second crystallized glass paste thereon and burning at 800 to 900°
C.;
further printing non-crystalline glass paste by 10 to 300 μ
m in thickness and burning at 800 to 900°
C.;
further printing wiring and strain sensitive resistor and burning at 800 to 900°
C.; and
printing glass paste so as to cover at least the strain sensitive resistor and burning at 400 to 700°
C., followed by mounting electronic parts thereon as specified.
- printing first crystallized glass paste by 10 to 300 μ
-
27. A method of manufacturing a load sensor, comprising the steps of:
- printing first crystallized glass paste by 10 to 300 μ
m in thickness on an elastic metal body;
printing electrode paste, and printing thereon second crystallized glass paste and non-crystalline glass paste by 10 to 300 μ
m each in thickness, and after printing wiring, burning them together at 800 to 900°
C.;
further printing strain sensitive resistor thereon and burning at 800 to 900°
C.; and
printing glass paste so as to cover at least the strain sensitive resistor and burning at 400 to 700°
C., followed by mounting electronic parts thereon as specified.
- printing first crystallized glass paste by 10 to 300 μ
-
28. A method of manufacturing a load sensor, comprising the steps of:
- printing first crystallized glass paste by 10 to 300 μ
m in thickness;
printing electrode paste, and printing thereon second crystallized glass paste and non-crystalline glass paste by 10 to 300 μ
m each in thickness, and after printing wiring, printing a plurality of strain sensitive resistors so as to be partially connected to the wiring at least and burning them together at 800 to 900°
C.; and
printing glass paste so as to cover at least the strain sensitive resistor and burning at 400 to 700°
C., followed by mounting electronic parts thereon as specified.
- printing first crystallized glass paste by 10 to 300 μ
-
29. A method of manufacturing a load sensor, comprising the steps of:
- printing first crystallized glass paste by 10 to 300 μ
m in thickness on an elastic metal body;
printing electrode paste, and printing thereon second crystallized glass paste by 10 to 300 μ
m in thickness;
burning them together at 800 to 900°
C.;
further printing thereon non-crystalline glass paste by 10 to 300 μ
m in thickness followed by burning;
printing wiring, and printing a plurality of strain sensitive resistors so as to be partially connected to the wiring at least and burning them together at 800 to 900°
C.; and
printing glass paste so as to cover at least the strain sensitive resistor and burning at 400 to 700°
C., followed by mounting electronic parts thereon as specified.
- printing first crystallized glass paste by 10 to 300 μ
-
30. A method of manufacturing a load sensor, comprising the steps of:
- printing first crystallized glass paste by 10 to 300 μ
m in thickness on an elastic metal body;
printing electrode paste, and printing thereon second crystallized glass paste by 10 to 300 μ
m in thickness;
burning them together at 800 to 900°
C.;
further printing thereon non-crystalline glass paste by 10 to 300 μ
m in thickness;
then printing wiring, and burning the non-crystalline glass and wiring together at 800 to 900°
C.;
printing a plurality of strain sensitive resistors so as to be partially connected to the wiring at least and burning them together at 800 to 900°
C.; and
printing glass paste so as to cover at least the strain sensitive resistor and burning at 400 to 700°
C., followed by mounting electronic parts thereon as specified.
- printing first crystallized glass paste by 10 to 300 μ
-
31. A method of manufacturing a load sensor, comprising the steps of:
- directly printing composite glass paste on an elastic metal body, which is formed from at least glass powder of 0.1 μ
m to 10 μ
m in average grain diameter and ceramic powder of 0.05 μ
m to 5 μ
m in average grain diameter dispersed in resin solution;
forming a composite glass layer by drying and burning at 800°
C. to 900°
C. in an oxidation atmosphere; and
forming a wiring pattern on the composite glass layer and a strain sensitive resistor so as to be partially connected to the wiring pattern.
- directly printing composite glass paste on an elastic metal body, which is formed from at least glass powder of 0.1 μ
-
32. A method of manufacturing a load sensor, comprising the steps of:
- printing and drying composite glass paste on support film, which is formed from at least glass powder of 0.1 μ
m to 10 μ
m in average grain diameter and ceramic powder of 0.05 μ
m to 5 μ
m in average grain diameter dispersed in resin solution;
transferring the composite glass paste on the support film onto an elastic metal body and burning at 800°
C. to 900°
C. in an oxidation atmosphere, thereby forming a composite glass layer; and
forming a wiring pattern on the composite glass layer and a strain sensitive resistor so as to be partially connected to the wiring pattern.
- printing and drying composite glass paste on support film, which is formed from at least glass powder of 0.1 μ
-
33. A method of manufacturing a load sensor, comprising the steps of:
- printing and drying composite glass paste on support film, which is formed from at least glass powder of 0.1 μ
m to 10 μ
m in average grain diameter and ceramic powder of 0.1 μ
m to 5 μ
m in average grain diameter dispersed in resin solution, followed by punching into specified shape; and
after placing it on an elastic metal body, burning at 800°
C. to 900°
C. in an oxidation atmosphere, thereby forming a composite glass layer; and
forming a wiring pattern on the composite glass layer and a strain sensitive resistor so as to be partially connected to the wiring pattern.
- printing and drying composite glass paste on support film, which is formed from at least glass powder of 0.1 μ
Specification