Laser processing of a locally heated target material
First Claim
1. A method of using a laser output to rapidly remove target material from a target material location of a workpiece, the laser output removing a portion of the target material at a material removal rate, and the target material characterized by a temperature and a dimensional stability property, comprising:
- applying heating energy in the form of a light beam to the target material location to elevate its temperature while substantially maintaining the dimensional stability property of the target material; and
directing for incidence on the target material location a processing laser output characterized by a wavelength, a beam spot size, an energy per pulse, a pulse width, and a pulse repetition rate that, in combination, are appropriate to effect removal of the target material, the combined incidence of the processing laser output and the heating energy on the target material location enabling the processing laser output to remove a portion of the target material at a material removal rate that is higher than a material removal rate achievable in the absence of the heating energy.
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Accused Products
Abstract
A method and laser system effect rapid removal of material from a workpiece by applying heating energy in the form of a light beam to a target location on the workpiece to elevate its temperature while maintaining its dimensional stability. When the target portion of the workpiece is heated, a laser beam is directed for incidence on the heated target location. The laser beam preferably has a processing laser output that is appropriate to effect removal of the target material from the workpiece. The combined incidence of the processing laser output and the heating energy on the target location enables the processing laser output to remove a portion of the target material at a material removal rate that is higher than the material removal rate achievable when the target material is not heated.
57 Citations
23 Claims
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1. A method of using a laser output to rapidly remove target material from a target material location of a workpiece, the laser output removing a portion of the target material at a material removal rate, and the target material characterized by a temperature and a dimensional stability property, comprising:
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applying heating energy in the form of a light beam to the target material location to elevate its temperature while substantially maintaining the dimensional stability property of the target material; and
directing for incidence on the target material location a processing laser output characterized by a wavelength, a beam spot size, an energy per pulse, a pulse width, and a pulse repetition rate that, in combination, are appropriate to effect removal of the target material, the combined incidence of the processing laser output and the heating energy on the target material location enabling the processing laser output to remove a portion of the target material at a material removal rate that is higher than a material removal rate achievable in the absence of the heating energy. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification