Smart label web and a method for its manufacture

• US 20050087607A1
• Filed: 06/16/2004
• Published: 04/28/2005
• Est. Priority Date: 12/21/2001
• Status: Active Grant

• Current Assignee: SMARTRAC Investment B.V. (Avery Dennison Corporation)
• Original Assignee: Upm Raflatac Oy (UPM-Kymmene Oyj)
• Inventors: Stromberg, Samuli
• Granted Patent: US 7,152,803 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar

Abstract

The present invention relates to manufacture of a smart label web, the smart label web comprising smart labels one after another and/or side by side. The smart label web comprises also a circuitry pattern and an integrated circuit on a chip attached to it. In the method, an electric contact is formed between the integrated circuit on the chip and the circuitry pattern on the smart label of the smart label web in such a way that a structural part separated from a separate carrier web and containing the integrated circuit on the chip is electrically connected to the smart label by pressing mechanically. The structural part or the smart label comprises a thermoplastic film whereby the structural part is attached to the smart label substantially entirely.

Claims

1. A method for the manufacture of a smart label web, the smart label web comprising smart labels one after another and/or side by side, which comprise a circuitry pattern and an integrated circuit on a chip attached to the smart label, wherein an electric contact is formed between the integrated circuit on the chip and the circuitry pattern on the smart label of the smart label web such that a structural part separated from a separate carrier web and containing the integrated circuit on the chip is electrically connected to the smart label by pressing mechanically, wherein the structural part or the smart label comprises a thermoplastic film wherein the structural part is attached to the smart label substantially entirely.

2. The method according to claim 1, wherein a dispenser is arranged to place structural parts in a focused manner onto the smart label.

3. The method according to claim 2, wherein the structural part is attached to the smart label by applying heat and pressure.

4. A smart label web comprising smart labels one after another and/or side by side, which comprise a circuitry pattern and a structural part comprising an integrated circuit on a chip, which is electrically connected to the circuitry pattern by a joint made by mechanical pressing, wherein the structural part or the smart label comprises a thermoplastic film wherein the structural part is attached to the smart label substantially entirely.